Renesas 74HC365P-E

Overview

74HC365P-E from Renesas Electronics is a hex non-inverting bus driver with 3-state outputs, designed for bidirectional data buffering and level translation in digital systems. It operates across 2–6 V supply, delivers 9 ns typical propagation delay (CL = 50 pF), supports ±35 mA output current, and features dual independent output-enable controls (G1/G2) for flexible bus partitioning - used in industrial control backplanes and legacy microprocessor address/data bus isolation.

For engineers reviewing the 74HC365P-E datasheet, 74HC365P-E pinout, 74HC365P-E application, or 74HC365P-E equivalent, key selection criteria include its dual-gated 3-state architecture, wide VCC range, low quiescent ICC (4 µA max), and DIP-16 package compatibility with through-hole PCB assembly and legacy test fixtures.

Technical Context

The 74HC365P-E implements six independent non-inverting buffer channels, each with separate output-enable logic tied to either G1 or G2 - enabling two groups of three drivers to be controlled independently. Its CMOS input structure ensures high noise immunity (VIH = 3.15 V min at VCC = 4.5 V) and low input current (±0.1 µA max).

Output stages are designed for TTL-load fanout (15 LSTTL loads), with guaranteed VOL ≤ 0.1 V at IOL = 6 mA and VOH ≥ 4.13 V at IOH = –6 mA (VCC = 4.5 V). Off-state leakage (IOZ ≤ ±0.5 µA) and fast enable/disable timing (tZL/tHZ ≤ 15 ns typ at 4.5 V) support reliable bus sharing in multiplexed architectures.

Key Specifications

Pinout & Package

DIP-16 package (JEDEC MS-001, Renesas code PRDP0016AE-B), 7.62 mm body width, 19.2 mm length, 2.54 mm lead pitch, through-hole mounting with Ni/Pd/Au plating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex bus driver applications.

Compared with SN74HC365N and 74HCT365N, the 74HC365P-E offers tighter propagation delay and lower static current - critical for high-speed deterministic bus arbitration and low-power standby modes - while retaining full DIP-16 mechanical compatibility.

Availability

74HC365P-E is available at Aetrix Electronics and suitable for industrial PLC backplanes, legacy microprocessor bus isolation, and automated manufacturing fixtures requiring stable component supply and long-term obsolescence management.

Supply support for 74HC365P-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and timing solutions for industrial, automotive, and infrastructure markets.

The HD74HC365 product line delivers standardized high-speed CMOS logic buffers for bus management and signal conditioning in cost-sensitive, long-lifecycle industrial systems - emphasizing reliability, wide supply range, and legacy compatibility.

FAQ

What is the maximum operating temperature range for the 74HC365P-E?

The 74HC365P-E is specified for operation from –40°C to +85°C, meeting industrial-grade thermal requirements. This range is validated per Renesas' Recommended Operating Conditions and confirmed in the Absolute Maximum Ratings table (Ta = –40 to +85°C). The device maintains full electrical performance across this span without derating, making it suitable for uncontrolled ambient environments like factory floors or outdoor enclosures. All timing and DC parameters in the datasheet apply within this temperature window.

Does the 74HC365P-E support 3.3 V logic interfacing?

Yes, the 74HC365P-E fully supports 3.3 V logic interfacing: its VCC range includes 3.3 V (2–6 V), input thresholds scale with supply (VIH = 2.31 V min at VCC = 3.3 V), and outputs swing rail-to-rail. At 3.3 V, it delivers VOH ≥ 3.13 V and VOL ≤ 0.1 V under 6 mA load - compatible with standard 3.3 V CMOS and LVTTL inputs. No level-shifting circuitry is needed when connecting to 3.3 V microcontrollers or FPGAs.

How are the G1 and G2 pins used in the 74HC365P-E?

The G1 and G2 pins provide independent 3-state control over two groups of outputs: G1 enables Y1–Y3, and G2 enables Y4–Y6. When either G input is high, its associated outputs go high-impedance regardless of A-input states. Both must be low for active driving. This allows segmented bus control - for example, isolating memory address lines (Y1–Y3) from peripheral I/O lines (Y4–Y6) using separate firmware-controlled enable signals. Pin 1 = G1, Pin 16 = G2 per the top-view pin diagram.

What package type is used for the 74HC365P-E?

The 74HC365P-E uses a 16-pin plastic dual in-line package (DIP-16), designated by Renesas as PRDP0016AE-B and commonly referenced as DP-16FV. It has a 2.54 mm lead pitch, 7.62 mm body width, and 19.2 mm length. The package features through-hole leads with Ni/Pd/Au plating for solderability and corrosion resistance, and is RoHS-compliant per Renesas' environmental documentation. This DIP format ensures compatibility with legacy prototyping, socketing, and wave-solder processes.

Is the 74HC365P-E pin-compatible with other 74HC365 variants?

Yes, the 74HC365P-E is pin-compatible with all industry-standard 74HC365 DIP-16 variants, including SN74HC365N and 74HCT365N, because it shares identical pin numbering, function mapping, and physical dimensions. The "P" suffix denotes the DIP package across manufacturers, and the pin arrangement (G1, A1, Y1…G2, A6, Y6, VCC, GND) matches JEDEC MS-001. However, electrical differences - such as input threshold (HC vs HCT) or propagation delay - require verification against system timing and voltage interface requirements before substitution.