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NXP Semiconductors 74HC3G07GD,125

Part No.:
74HC3G07GD,125
Manufacturer:
NXP Semiconductors
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
8-XFDFN
Datasheet:
Aetrix74HC3G07GD,125.pdf
Description:
IC BUFFER TRPL OPN DRN XSON8U
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:39,000

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Product details

Overview

74HC3G07GD,125 from Nexperia is a triple non-inverting buffer IC with open-drain outputs, designed for level-shifting and wired-OR logic interfacing in mixed-voltage systems. It operates from 2.0 V to 6.0 V, supports CMOS input levels, delivers propagation delays as low as 7 ns at 6.0 V, and features input clamp diodes enabling safe interface to voltages exceeding VCC-commonly used in I²C bus pull-up networks and GPIO expansion.

For engineers reviewing the 74HC3G07GD,125 datasheet, 74HC3G07GD,125 pinout, 74HC3G07GD,125 application, or 74HC3G07GD,125 equivalent, key selection criteria include open-drain output drive capability (5.2 mA sink at 6.0 V), -40 °C to +125 °C operating range, TSSOP8 package compatibility, and static input leakage <±0.1 μA at 6.0 V.

Technical Context

This device implements three independent non-inverting buffers, each with an open-drain output stage that requires external pull-up resistors. The inputs incorporate integrated clamp diodes, allowing current-limited connection to signals up to 6.0 V even when VCC is as low as 2.0 V-enabling bidirectional voltage translation without additional components.

It adheres to JEDEC JESD7A (2.0–6.0 V) and JESD8C (2.7–3.6 V) standards, meets HBM ESD >2000 V and CDM >1000 V, and exhibits latch-up immunity exceeding 100 mA per JESD78 Class II Level B-making it suitable for industrial control and sensor interface applications where robustness against overvoltage transients is required.

Key Specifications

Parameter Value and Actual Design Meaning
Supply voltage 2.0 V to 6.0 V - enables direct operation across 3.3 V and 5 V logic domains without level shifters.
Output type Open-drain - allows wired-AND/wired-OR bus configurations and flexible pull-up voltage selection (e.g., 1.8 V, 3.3 V, or 5 V).
Propagation delay 7 ns (typ) at VCC = 6.0 V - supports signal integrity in high-speed digital control paths up to ~50 MHz.
Sink current 5.2 mA at VOL ≤ 0.33 V (VCC = 6.0 V) - sufficient to drive standard I²C bus loads and LED indicators.
Input leakage <±0.1 μA at VCC = 6.0 V - minimizes power loss in battery-powered or ultra-low-power monitoring circuits.
Operating temperature -40 °C to +125 °C - qualified for under-hood automotive modules and industrial PLC I/O stages.
ESD rating HBM >2000 V, CDM >1000 V - reduces need for external protection in board-level ESD-prone environments.

Pinout & Package

XSON8 (SOT996-2) package: plastic extremely thin small outline no-lead package; 8 terminals; body size 2.1 mm × 1.6 mm; 0.5 mm pitch; exposed thermal pad; moisture sensitivity level 1 (MSL1).

Pin/Terminal Circuit Role Design Meaning
1 Input A1 First buffer input; accepts CMOS-level signals; clamp diode enables overvoltage tolerance.
2 Output Y3 Third buffer open-drain output; requires external pull-up; sinks up to 5.2 mA at 6.0 V.
3 Input A2 Second buffer input; electrically identical to A1; shares same VCC and GND reference.
4 GND Ground reference for all internal circuitry and I/O; must be low-impedance for noise immunity.
5 Output Y2 Second buffer open-drain output; independently controllable; compatible with I²C SDA/SCL timing.
6 Input A3 Third buffer input; fully decoupled from other inputs; supports asynchronous signal conditioning.
7 Output Y1 First buffer open-drain output; commonly used for status flag assertion or interrupt generation.
8 VCC Positive supply rail; powers internal logic and defines output high-impedance state voltage ceiling.

Key Features

Feature Design Value
Triple open-drain buffer Enables independent control of three wired-OR nodes-ideal for multi-sensor interrupt aggregation or shared bus arbitration.
Input clamp diodes Permits use of series current-limiting resistors to safely interface 5 V or 12 V control signals to 3.3 V logic without external clamps.
Wide VCC range (2.0–6.0 V) Eliminates need for separate voltage translators when connecting microcontrollers to legacy 5 V peripherals or modern 1.8 V sensors.
Low dynamic power (CPD = 4 pF) Reduces switching power consumption in high-frequency enable/disable sequences typical in power management sequencing.
High noise immunity CMOS input threshold ratios (VIH/VIL ≈ 70%/30% at VCC = 4.5 V) suppress false triggering in electrically noisy industrial enclosures.

Applications

I²C Bus Level Translation GPIO Expansion Interface

Use Scenario: Interfacing a 3.3 V microcontroller I²C master to 5 V slave devices on the same bus.

IC Role / Device Role / Timing Role: Acts as passive open-drain repeater; buffers SDA/SCL lines while preserving I²C timing compliance and slew rate limits.

Use Value: Eliminates need for active dual-supply translators; maintains bus capacitance below 400 pF with 2.2 kΩ pull-ups at 5 V.

Use Scenario: Expanding MCU GPIO count to drive multiple LEDs, relays, or status indicators.

IC Role / Device Role / Timing Role: Provides three independent open-drain drivers; each output sinks load current while isolating MCU pins from inductive kickback.

Use Value: Enables direct 5 V LED drive with 5.2 mA sink capability per channel; avoids level-shifter ICs and saves PCB area.

Industrial Sensor Signal Conditioning Power Sequencing Control

Use Scenario: Aggregating fault signals from three isolated temperature sensors into a single wired-OR alert line.

IC Role / Device Role / Timing Role: Buffers and ORs discrete digital alerts; open-drain outputs prevent contention during simultaneous fault reporting.

Use Value: Reduces system-level wiring complexity; supports hot-plug detection via fast 7 ns propagation delay and low leakage (<0.1 μA).

Use Scenario: Controlling power-on sequence of three subsystems (e.g., RF module, ADC, memory) using MCU GPIOs.

IC Role / Device Role / Timing Role: Delivers precise enable timing with matched propagation delays across all three channels; ensures deterministic power-up order.

Use Value: Guarantees sub-20 ns skew between enable signals; eliminates race conditions in multi-rail power architectures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple open-drain buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
74LVC3G07GM,132 Lower VCC range (1.65–5.5 V); higher speed (tPD = 3.2 ns @ 3.3 V); smaller XSON8 (1.35 × 1.15 mm). Better suited for space-constrained portable designs requiring 1.8 V compatibility and faster edge rates. Select when footprint reduction and 1.8 V operation are critical; verify pull-up resistor values for 1.8 V bus compatibility.
SN74LVC3G07DCUR TSSOP8 package (3 mm width); wider temp range (-40 °C to +125 °C); identical electrical specs but TI-marked. Preferred where existing TSSOP8 layout reuse is required or TI ecosystem alignment matters. Choose for drop-in replacement in legacy TSSOP8 footprints; confirm marking code and reel packaging match procurement requirements.

Compared with 74HC3G07GD,125, the 74LVC3G07GM,132 offers superior speed and smaller size at lower voltages but lacks 6.0 V tolerance; the SN74LVC3G07DCUR provides identical functionality in a larger, more manufacturable TSSOP8 package-ideal for rework-sensitive production lines.

Availability

74HC3G07GD,125 is available at Aetrix Electronics and suitable for industrial automation, sensor interface, and embedded power management applications requiring stable component supply, long-term lifecycle support, and guaranteed traceability.

Supply support for 74HC3G07GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and MOSFET solutions optimized for reliability and energy efficiency.

The 74HC3G07GD,125 belongs to Nexperia's HC-series logic family, engineered for robust industrial and automotive-adjacent applications where wide supply range, ESD resilience, and open-drain flexibility are mandatory.

FAQ

What is the maximum supply voltage rating for the 74HC3G07GD,125?

The 74HC3G07GD,125 has an absolute maximum supply voltage (VCC) of 7.0 V per its limiting values table. However, the recommended operating range is 2.0 V to 6.0 V. Operating continuously at 7.0 V risks permanent damage; sustained use above 6.0 V violates specification and voids performance guarantees defined in the datasheet for the 74HC3G07GD,125.

Can the 74HC3G07GD,125 be used to translate between 1.8 V and 3.3 V logic levels?

No-the 74HC3G07GD,125 does not support 1.8 V VCC operation. Its minimum recommended supply voltage is 2.0 V, and input thresholds (VIH ≥ 1.5 V at VCC = 2.0 V) are incompatible with reliable 1.8 V logic recognition. For 1.8 V ↔ 3.3 V translation, consider the 74LVC3G07GM,132 instead, which is explicitly rated down to 1.65 V and specified for 1.8 V interfaces. The 74HC3G07GD,125 remains optimal for 3.3 V ↔ 5 V or 2.0 V ↔ 6.0 V bridging.

Does the 74HC3G07GD,125 require external pull-up resistors on its outputs?

Yes-every output (Y1, Y2, Y3) of the 74HC3G07GD,125 is open-drain and must be pulled up externally to a valid logic HIGH voltage. The value depends on bus capacitance and speed requirements: 2.2 kΩ is typical for I²C at 100 kHz, while 10 kΩ suffices for slower GPIO signaling. Without pull-ups, outputs remain floating in the high-impedance state and cannot assert HIGH logic-this is intrinsic to the 74HC3G07GD,125's architecture.

Is the 74HC3G07GD,125 pin-compatible with the 74HCT3G07GD,125?

Yes-the 74HC3G07GD,125 and 74HCT3G07GD,125 share identical XSON8 (SOT996-2) pinout, package dimensions, and terminal assignments. The only functional difference is input threshold compatibility: the HC version accepts CMOS-level inputs (VIH ≈ 0.7×VCC), while the HCT version matches TTL thresholds (VIH = 2.0 V min). This makes them mechanically interchangeable, but logic-level validation is required before substitution in the 74HC3G07GD,125 design.

What is the thermal pad connection requirement for the 74HC3G07GD,125?

Although the 74HC3G07GD,125's XSON8 package includes an exposed thermal pad, the datasheet does not mandate soldering it to ground or a thermal plane. However, for optimal thermal performance in continuous 5.2 mA sink operation at elevated ambient temperatures, Nexperia recommends connecting the pad to a PCB copper pour tied to GND. Failure to do so may reduce maximum allowable power dissipation by up to 30%, especially above 85 °C ambient-critical for sustained operation in the 74HC3G07GD,125's full -40 °C to +125 °C range.

74HC3G07GD,125 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74HC
Package/Case:
8-XFDFN
Packaging:
Bulk
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
3
Number of Bits per Element:
1
Input Type:
-
Output Type:
Open Drain
Current - Output High, Low:
-, 5.2mA
Voltage - Supply:
2V ~ 6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-XSON (2x3)

74HC3G07GD,125 FAQ

1.How can I place an order for 74HC3G07GD,125 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74HC3G07GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74HC3G07GD,125 reliable?

The price and inventory of 74HC3G07GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74HC3G07GD,125 is usually 5 days.

3.What payment methods are accepted for 74HC3G07GD,125?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74HC3G07GD,125 transactions.

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4.How is shipping managed for 74HC3G07GD,125?

74HC3G07GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74HC3G07GD,125 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74HC3G07GD,125?

For technical support, including 74HC3G07GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74HC3G07GD,125 requirements.

6.How does Aetrix verify that 74HC3G07GD,125 is sourced from the original manufacturer or authorized distributors?

All 74HC3G07GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74HC3G07GD,125 meets industry standards.

7.What is the process for return or replacement of 74HC3G07GD,125?

All 74HC3G07GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74HC3G07GD,125, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74HC3G07GD,125 part is unused and in its original packaging.

Return procedure for 74HC3G07GD,125:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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