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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

NXP Semiconductors 74HC3G34GD,125

Name: 74HC3G34GD,125
Brand: NXP Semiconductors
SKU: 74HC3G34GD,125
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74HC3G34GD,125

Manufacturer:: NXP Semiconductors

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 8-XFDFN

Datasheet:: 74HC3G34GD,125.pdf

Description:: IC BUFFER NON-INVERT 6V 8XSON

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Product details

Overview

74HC3G34GD,125 from NXP Semiconductors is a triple non-inverting buffer IC in XSON8 package, operating from 2.0 V to 6.0 V supply, delivering symmetrical output impedance, balanced propagation delays (8–20 ns at VCC = 6.0 V), and CMOS-level input compatibility for signal conditioning in space-constrained digital interfaces.

For engineers reviewing the 74HC3G34GD,125 datasheet, 74HC3G34GD,125 pinout, 74HC3G34GD,125 application, or 74HC3G34GD,125 equivalent, this page delivers verified pin functions, real-world timing specs across temperature (−40 °C to +125 °C), static/dynamic electrical parameters, and validated alternative options for logic buffering in industrial control, sensor interface, and low-power MCU peripheral expansion.

Technical Context

The 74HC3G34GD,125 implements three independent, unidirectional non-inverting buffers with integrated input clamp diodes-enabling safe interfacing to voltages exceeding VCC when used with current-limiting resistors. Its CMOS input structure ensures high noise immunity and low input leakage (±1.0 µA max).

Each buffer exhibits matched HIGH/LOW output drive capability (±4.0 mA at VCC = 4.5 V), symmetrical transition times (5–20 ns), and consistent propagation delay matching across channels-critical for parallel data path integrity in timing-sensitive applications like address/data bus conditioning and level translation.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage Range	2.0 V to 6.0 V - supports direct integration with 3.3 V and 5 V logic domains without level shifters.
Propagation Delay (tpd)	8 ns (typ) at VCC = 6.0 V - enables reliable operation in high-speed digital paths up to ~50 MHz clock-equivalent rates.
Output Drive Strength	±4.0 mA at VCC = 4.5 V - sufficient to drive standard 50 pF loads and multiple 74HC inputs without fanout degradation.
Input Voltage Thresholds	VIH = 3.15 V, VIL = 1.35 V (at VCC = 4.5 V) - CMOS-compatible thresholds ensure robust noise margin (>1.3 V) in noisy environments.
Operating Temperature	−40 °C to +125 °C - qualified for extended industrial and under-hood automotive-adjacent applications.
ESD Protection	HBM > 2000 V, MM > 200 V - provides inherent resilience against handling and board-level electrostatic discharge events.
Power Dissipation Capacitance	CPD = 10 pF - enables accurate dynamic power estimation (PD = CPD × VCC² × fi × N) for battery-powered designs.

Pinout & Package

XSON8 (SOT996-2) package: plastic extremely thin small outline, no leads, 8-terminal surface-mount device with 3.0 × 2.0 × 0.5 mm body dimensions and wettable flank terminals for automated optical inspection.

Pin/Terminal	Circuit Role	Design Meaning
1	1A	Buffer 1 input - accepts CMOS-level signals; clamped to prevent overvoltage damage.
2	3Y	Buffer 3 output - drives downstream logic with matched rise/fall times and rail-to-rail swing.
3	2A	Buffer 2 input - electrically isolated from other inputs; supports independent signal routing.
4	GND	Ground reference - must be low-impedance connection to minimize ground bounce in multi-buffer switching.
5	3A	Buffer 3 input - shares same voltage and timing specs as pins 1 and 3; no crosstalk between channels.
6	2Y	Buffer 2 output - symmetrical impedance to 1Y/3Y ensures consistent signal integrity across all three outputs.
7	1Y	Buffer 1 output - delivers inverted-phase-free buffered signal with <20 ns max delay variation over temperature.
8	VCC	Supply voltage - decoupling capacitor (100 nF) required within 2 mm for stable high-frequency operation.

Key Features

Feature	Design Value
Triple independent buffer architecture	Enables simultaneous conditioning of three separate digital signals (e.g., address bits, control lines, or sensor outputs) without shared timing or loading effects.
Input clamp diodes with current-limiting support	Allows safe interface to voltages up to VCC + 0.5 V using external resistors-eliminates need for discrete protection in mixed-voltage systems.
Symmetrical output impedance	Ensures matched rise/fall times (<20 ns difference) critical for maintaining signal duty cycle integrity in clock distribution or data strobing.
Low quiescent current	ICC ≤ 20 µA at VCC = 6.0 V and −40 °C to +125 °C - supports always-on monitoring circuits with microamp-level standby budgets.
JEDEC Std. 7A compliance	Guarantees interoperability with legacy 74-series logic families and compatibility with industry-standard PCB layout practices.

Applications

Industrial PLC I/O Expansion	MCU Peripheral Signal Buffering
Use Scenario: Isolating and strengthening GPIO signals from a microcontroller to drive multiple optocouplers or relay drivers in factory automation panels. IC Role / Device Role / Timing Role: Non-inverting buffer providing current gain and noise margin while preserving signal polarity and timing alignment across three parallel control lines. Use Value: Prevents MCU output voltage droop under load and eliminates timing skew between buffered outputs-ensuring synchronized actuator activation.	Use Scenario: Conditioning SPI MISO/MOSI/CLK lines between a low-power ARM Cortex-M0+ and external flash memory or ADC in portable instrumentation. IC Role / Device Role / Timing Role: Signal repeater maintaining signal edge fidelity and reducing capacitive loading on the MCU's native pins. Use Value: Enables reliable 20 MHz SPI communication over 50 mm PCB traces by restoring signal slew rate and suppressing reflections.
Sensor Interface Signal Conditioning	Digital Bus Level Translation
Use Scenario: Buffering analog-to-digital converter status flags (BUSY, DRDY, OVFL) before routing to an FPGA fabric in environmental monitoring hardware. IC Role / Device Role / Timing Role: Low-propagation-delay gate ensuring deterministic flag sampling with <25 ns worst-case latency from event to FPGA capture. Use Value: Guarantees sub-microsecond response to sensor overrange conditions-critical for closed-loop safety shutdown sequences.	Use Scenario: Translating 3.3 V logic levels from an SoC to 5 V peripherals (e.g., legacy UART transceivers or display controllers) in embedded HMI systems. IC Role / Device Role / Timing Role: Unidirectional voltage-domain translator leveraging CMOS input thresholds and rail-swing outputs. Use Value: Achieves level shift without external pull-ups or direction-control logic-reducing BOM count and layout complexity.

Industrial PLC I/O Expansion

MCU Peripheral Signal Buffering

Use Scenario: Isolating and strengthening GPIO signals from a microcontroller to drive multiple optocouplers or relay drivers in factory automation panels.

IC Role / Device Role / Timing Role: Non-inverting buffer providing current gain and noise margin while preserving signal polarity and timing alignment across three parallel control lines.

Use Value: Prevents MCU output voltage droop under load and eliminates timing skew between buffered outputs-ensuring synchronized actuator activation.

Use Scenario: Conditioning SPI MISO/MOSI/CLK lines between a low-power ARM Cortex-M0+ and external flash memory or ADC in portable instrumentation.

IC Role / Device Role / Timing Role: Signal repeater maintaining signal edge fidelity and reducing capacitive loading on the MCU's native pins.

Use Value: Enables reliable 20 MHz SPI communication over 50 mm PCB traces by restoring signal slew rate and suppressing reflections.

Sensor Interface Signal Conditioning

Digital Bus Level Translation

Use Scenario: Buffering analog-to-digital converter status flags (BUSY, DRDY, OVFL) before routing to an FPGA fabric in environmental monitoring hardware.

IC Role / Device Role / Timing Role: Low-propagation-delay gate ensuring deterministic flag sampling with <25 ns worst-case latency from event to FPGA capture.

Use Value: Guarantees sub-microsecond response to sensor overrange conditions-critical for closed-loop safety shutdown sequences.

Use Scenario: Translating 3.3 V logic levels from an SoC to 5 V peripherals (e.g., legacy UART transceivers or display controllers) in embedded HMI systems.

IC Role / Device Role / Timing Role: Unidirectional voltage-domain translator leveraging CMOS input thresholds and rail-swing outputs.

Use Value: Achieves level shift without external pull-ups or direction-control logic-reducing BOM count and layout complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
74LVC3G34GM,132	Lower VCC range (1.65–5.5 V); faster tpd (3.2 ns typ at 3.3 V); higher ICC (max 40 µA)	Better suited for ultra-low-voltage 1.8 V systems; less suitable for 5 V-only legacy designs	Select when optimizing for speed and 1.8 V/3.3 V compatibility; verify VCC tolerance margins match system rails.
SN74LVC3G34DCUR	Texas Instruments part; identical pinout (XSON8); slightly higher VOL (0.4 V @ 24 mA) and lower ESD (HBM 2000 V)	Drop-in replacement in TI-centric designs; requires validation of output drive margin at full load	Choose for TI-aligned supply chains; confirm 24 mA drive requirement aligns with actual load-74HC3G3G34GD,125 rated for ±4 mA only.

Compared with 74LVC3G34GM,132 and SN74LVC3G34DCUR, the 74HC3G34GD,125 offers superior 5 V compatibility, lower static power, and higher noise immunity-making it optimal for mixed-voltage industrial control where reliability across −40 °C to +125 °C is mandatory.

Availability

74HC3G34GD,125 is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, MCU peripheral signal buffering, and sensor interface signal conditioning requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74HC3G34GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in logic, interface, and power management ICs.

The 74HC3G34GD,125 belongs to NXP's 74HC high-speed CMOS logic family-designed specifically for robust, low-power digital signal conditioning in space-constrained, thermally demanding environments.

FAQ

What is the maximum supply voltage rating for the 74HC3G34GD,125?

The absolute maximum supply voltage (VCC) for the 74HC3G34GD,125 is +7.0 V, but the recommended operating range is 2.0 V to 6.0 V. Operation above 6.0 V voids guaranteed performance and risks permanent damage per IEC 60134 limiting values. The 74HC3G34GD,125 must be operated within 2.0–6.0 V for full specification compliance across −40 °C to +125 °C.

Does the 74HC3G34GD,125 support TTL-level inputs?

No-the 74HC3G34GD,125 is the HC variant and supports CMOS-level inputs only (VIH ≥ 3.15 V at VCC = 4.5 V). For TTL compatibility, use the pin-compatible 74HCT3G34GD,125, which specifies VIH = 2.0 V min and VIL = 0.8 V max at VCC = 4.5–5.5 V. The 74HC3G34GD,125 will not reliably recognize standard TTL HIGH levels below 3.15 V.

What is the thermal derating behavior of the 74HC3G34GD,125 in its XSON8 package?

For the XSON8 (SOT996-2) package, total power dissipation (Ptot) derates linearly above +118 °C at 7.8 mW/K. At ambient temperatures ≤118 °C, Ptot is rated at 300 mW. This derating ensures safe operation under sustained high-temperature conditions typical in enclosed industrial enclosures-critical for maintaining reliability of the 74HC3G34GD,125 in sealed control modules.

Can the 74HC3G34GD,125 be used to drive a 50 pF capacitive load at 10 MHz?

Yes-the 74HC3G34GD,125 is characterized with 50 pF load in its dynamic test conditions (Table 10) and delivers <20 ns propagation delay and <20 ns transition time at VCC = 6.0 V. At 10 MHz, dynamic power is calculable via PD = CPD × VCC² × fi × N = 10 pF × (6 V)² × 10 MHz × 3 ≈ 10.8 mW-well within the 300 mW Ptot limit. The 74HC3G34GD,125 remains stable and meets timing specs under this load.

Is the 74HC3G34GD,125 pin-compatible with other 74-series triple buffers in XSON8?

Yes-the 74HC3G34GD,125 shares identical XSON8 (SOT996-2) pinout and footprint with 74HCT3G34GD,125, 74LVC3G34GM,132, and SN74LVC3G34DCUR. All use the same 1A–3Y/GND/VCC terminal mapping and 0.5 mm pitch. However, voltage ratings, drive strength, and timing differ-so electrical validation is required before substitution, even though the 74HC3G34GD,125 fits the same land pattern.

74HC3G34GD,125 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: 74HC

Package/Case:: 8-XFDFN

Packaging:: Bulk

Product Status:: Active

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 3

Number of Bits per Element:: 1

Input Type:: -

Output Type:: Push-Pull

Current - Output High, Low:: 5.2mA, 5.2mA

Voltage - Supply:: 2V ~ 6V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-XSON (2x3)

74HC3G34GD,125 FAQ

1.How can I place an order for 74HC3G34GD,125 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74HC3G34GD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74HC3G34GD,125 reliable?

The price and inventory of 74HC3G34GD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74HC3G34GD,125 is usually 5 days.

3.What payment methods are accepted for 74HC3G34GD,125?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74HC3G34GD,125 transactions.

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4.How is shipping managed for 74HC3G34GD,125?

74HC3G34GD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74HC3G34GD,125 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74HC3G34GD,125?

For technical support, including 74HC3G34GD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74HC3G34GD,125 requirements.

6.How does Aetrix verify that 74HC3G34GD,125 is sourced from the original manufacturer or authorized distributors?

All 74HC3G34GD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74HC3G34GD,125 meets industry standards.

7.What is the process for return or replacement of 74HC3G34GD,125?

All 74HC3G34GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74HC3G34GD,125, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74HC3G34GD,125 part is unused and in its original packaging.

Return procedure for 74HC3G34GD,125:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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