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NXP Semiconductors 74HC7030D,652
- Part No.:
- 74HC7030D,652
- Manufacturer:
- NXP Semiconductors
- Category:
- FIFOs Memory
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
74HC7030D,652.pdf
- Description:
- IC FIFO ASYNC/SYNC 64X9 28SO
- Quantity:
- Payment:
- Shipping:
Inventory:3,683
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Product details
Overview
74HC7030D,652 from NXP Semiconductors (formerly Philips) is a 9-bit × 64-word synchronous/asynchronous FIFO register with 3-state outputs, master reset (MR), output enable (OE), and dual status flags (DIR/DOR). It delivers 33 MHz typical shift-in/shift-out rates at 5 V, supports cascading to 128-word depth, and operates across −40 °C to +125 °C. It serves as a high-speed data buffer in disc controllers and video timebase correction circuits.
For engineers reviewing the 74HC7030D,652 datasheet, 74HC7030D,652 pinout, 74HC7030D,652 application, or 74HC7030D,652 equivalent, this page provides verified functional architecture, timing-critical parameters (tPHL/tPLH, fmax, ripple-through delay), cascade interoperation behavior, and real-world use constraints for burst-mode vs flag-controlled operation.
Technical Context
The 74HC7030D,652 implements a dual-control FIFO using edge-triggered SI (LOW-to-HIGH) and SO (HIGH-to-LOW) inputs, enabling fully independent read/write paths. Its DIR and DOR flags provide asynchronous status signaling: DIR = HIGH indicates input stage empty and ready; DOR = HIGH confirms valid data present at Q0–Q8 outputs.
It supports three operational modes: flag-gated (safe, deterministic), high-speed burst (35 MHz max, no flag checking), and cascaded (25 MHz typical, 128-word × 9-bit). Ripple-through delay (SI→DOR: 0.9–2.4 µs) and bubble-up delay (SO→DIR: 1.2–3.0 µs) define internal data propagation timing critical for system-level synchronization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Depth | 64 words × 9 bits - fixed capacity; bit-width reducible to 1–8 bits by tying unused Dn/Qn pins. |
| Max Clock Frequency | 33 MHz (typ.) for SI/SO in flag-controlled mode at VCC = 5 V - sets upper bound for deterministic data throughput. |
| Ripple-through Delay | 0.9–2.4 µs (SI to DOR) - determines minimum interval between successive write pulses before DOR asserts. |
| Bubble-up Delay | 1.2–3.0 µs (SO to DIR) - defines latency from shift-out completion to readiness for next write. |
| Propagation Delay (SO→Qn) | 46–117 ns (74HCT, VCC = 4.5 V) - impacts output data validity window after SO edge. |
| 3-State Enable/Disable | tPZH/tPZL = 20–53 ns (74HCT) - governs bus contention window during OE transitions. |
| Supply Voltage Range | 2.0–6.0 V - enables interoperability with 3.3 V and 5 V logic families; DC specs per IC06 family spec. |
Pinout & Package
74HC7030D,652 is housed in a 28-pin SOIC (Small Outline Integrated Circuit) package with 300 mil body width and standard JEDEC MS-012AC outline. Pin 14 is GND; pins 1 and 2 are GND but must not conduct current relative to pin 14.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 3 | DIR | Data-in-ready flag output: HIGH = input stage empty and ready; LOW = full/busy. |
| 4 | SI | Shift-in control: LOW-to-HIGH edge loads data into input stage; HIGH-to-LOW triggers ripple-through. |
| 5–13 | D0 to D8 | Parallel data inputs: unweighted; any pin may serve as MSB; unused pins tied to VCC/GND for reduced bit-width. |
| 15 | OE | Output enable: active LOW; places Q0–Q8 in high-impedance state when HIGH. |
| 16–24 | Q0 to Q8 | 3-state parallel data outputs: unweighted; unused pins left open in reduced configurations. |
| 25 | DOR | Data-out-ready flag output: HIGH = valid data present at Q0–Q8; LOW = busy/empty. |
| 26 | SO | Shift-out control: HIGH-to-LOW edge shifts data out of output stage and initiates bubble-up. |
| 27 | MR | Master-reset: active LOW; clears control logic, invalidates data, sets DIR = HIGH, DOR = LOW. |
| 28 | VCC | Positive supply: 2.0–6.0 V; powers all internal logic and output drivers. |
| 1, 2, 14 | GND | Ground reference: pins 1, 2, 14 all connected internally to substrate ground; no current flow permitted between them. |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous/asynchronous operation | Independent SI and SO controls allow mixed-mode interfacing - e.g., clocked write + handshaked read - without external arbitration logic. |
| Cascadable architecture | Native support for word-depth expansion to 128×9 bits using only inter-FIFO flag connections; no external gates required for basic cascade. |
| Flag-driven and burst-mode operation | DIR/DOR enable safe flag-gated transfers (≤33 MHz); removal of flag dependency permits 35 MHz burst rates with overflow protection. |
| Pin-optimized layout | Input pins D0–D8 (pins 5–13) directly oppose output pins Q0–Q8 (pins 16–24), minimizing trace length and crosstalk in PCB routing. |
| Low dynamic power | CPD = 660 pF enables predictable power modeling: PD = CPD × VCC² × fi + Σ(CL × VCC² × fo); ICC drops proportionally below fmax. |
Applications
| High-Speed Disc/Tape Controller | Video Timebase Correction |
|---|---|
Use Scenario: Buffering variable-rate data streams between rotating media interface and fixed-clock host processor. IC Role / Device Role / Timing Role: FIFO decouples mechanical timing jitter from digital processing clock; DIR/DOR flags coordinate data availability without CPU polling. Use Value: Eliminates data loss during seek operations by absorbing up to 64 words of burst data at 33 MHz, then releasing at host-controlled rate. |
Use Scenario: Aligning non-synchronized video line scan clocks to stable reference timing for CRT display stability. IC Role / Device Role / Timing Role: Acts as elastic store compensating for horizontal sync phase drift; SI/SO operate asynchronously across clock domains. Use Value: Maintains pixel-perfect line alignment over temperature and voltage variation using ripple-through delay <2.4 µs and 125 °C operation. |
| A/D Output Buffering | Bit-Rate Smoothing |
Use Scenario: Isolating high-speed ADC sampling (e.g., 20+ MSPS) from slower DSP processing or memory write cycles. IC Role / Device Role / Timing Role: Stores ADC output words until DSP requests via SO; MR ensures clean startup on power-up. Use Value: Prevents sample drop during DMA transfer gaps; 9-bit width matches common ADC resolutions; 3-state outputs avoid bus contention. |
Use Scenario: Matching mismatched transmit/receive data rates in serial communication links (e.g., UART-to-USB bridges). IC Role / Device Role / Timing Role: Absorbs short-term rate differentials; DIR/DOR flags signal buffer occupancy to upstream/downstream controllers. Use Value: Enables glitch-free streaming at sustained 33 MHz burst rates while supporting low-power idle states via OE control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FIFO register applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74HC7032D,653 | Same 9×64 FIFO architecture but includes separate read/write clocks (RCLK/WCLK) instead of SI/SO edge-triggered controls. | Requires synchronous clock domain alignment; unsuitable for true asynchronous handshaking like DIR/DOR flag coordination. | Select 74HC7032D,653 only when system uses dedicated RCLK/WCLK sources and does not rely on status-flag handshaking. |
| SN74ACT2223N | 16×16 FIFO (256-bit total) with 3-state outputs, but lacks DIR/DOR flags and uses single clock with RD/WR strobes. | No native status signaling - requires external logic or polling to detect full/empty; lower depth limits burst absorption capability. | Choose SN74ACT2223N only for space-constrained designs needing smaller footprint and accepting polling overhead or added glue logic. |
Compared with 74HC7030D,652, the 74HC7032D,653 trades flag-based handshaking for clock-domain isolation, while the SN74ACT2223N sacrifices depth and status autonomy for compactness - neither offers the same combination of 64-word depth, dual flag signaling, and SI/SO edge-triggered independence.
Availability
74HC7030D,652 is available at Aetrix Electronics and suitable for high-speed disc/tape controllers, video timebase correction systems, A/D output buffering, and bit-rate smoothing applications requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for 74HC7030D,652 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips' pioneering logic IC development.
The 74HC7030D,652 belongs to the legacy 74HC/HCT logic family designed for high-speed, low-power CMOS interfacing in mixed-signal systems where deterministic timing, status signaling, and expandable memory depth are essential.
FAQ
What is the maximum operating temperature range for the 74HC7030D,652?
The 74HC7030D,652 is specified for operation from −40 °C to +125 °C, meeting extended industrial temperature requirements. This range is validated across all AC and DC parameters in the Philips IC06 family specifications, ensuring reliable DIR/DOR flag behavior and 33 MHz shift-in performance even at thermal extremes.
Can the 74HC7030D,652 be used with a 3.3 V supply?
Yes, the 74HC7030D,652 supports VCC from 2.0 V to 6.0 V, including 3.3 V operation. At 3.3 V, AC characteristics scale predictably: fmax reduces to ~20 MHz (typ.), and propagation delays increase moderately. Input thresholds remain compatible with 3.3 V logic families per HC specification.
How does the 74HC7030D,652 handle overflow when the FIFO is full?
When the 74HC7030D,652 FIFO is full, subsequent SI pulses are ignored - no data corruption occurs. DIR remains LOW to indicate full/busy status, preventing unintended writes. This hardware-enforced overflow protection eliminates need for external full-detection logic in flag-gated systems.
Is the 74HC7030D,652 pin-compatible with the 74HCT7030 variant?
Yes, the 74HC7030D,652 and 74HCT7030 share identical pinout, package, and functional architecture. The difference lies solely in input threshold compatibility: HCT versions accept TTL-level inputs (VIH ≈ 2.0 V), while HC versions require CMOS-level inputs (VIH ≈ 0.7×VCC). No PCB changes are needed for substitution.
What is the purpose of the ripple-through and bubble-up delays in the 74HC7030D,652?
Ripple-through delay (SI→DOR: 0.9–2.4 µs) defines how long it takes data to propagate from input stage to output stage after SI goes LOW. Bubble-up delay (SO→DIR: 1.2–3.0 µs) measures latency from SO edge to DIR reassertion after an empty location reaches the input stage - both are critical for setting minimum pulse intervals in high-speed systems.
74HC7030D,652 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74HC
- Package/Case:
- 28-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Size:
- 576 (64 x 9)
- Function:
- Asynchronous, Synchronous
- Data Rate:
- 33MHz
- Access Time:
- 36ns
- Voltage - Supply:
- 2 V ~ 6 V
- Current - Supply (Max):
- -
- Bus Directional:
- Uni-Directional
- Expansion Type:
- Depth, Width
- Programmable Flags Support:
- No
- Retransmit Capability:
- No
- FWFT Support:
- No
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SO
74HC7030D,652 FAQ
1.How can I place an order for 74HC7030D,652 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74HC7030D,652 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74HC7030D,652 reliable?
The price and inventory of 74HC7030D,652 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74HC7030D,652 is usually 5 days.
3.What payment methods are accepted for 74HC7030D,652?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74HC7030D,652 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74HC7030D,652?
74HC7030D,652 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74HC7030D,652 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74HC7030D,652?
For technical support, including 74HC7030D,652 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74HC7030D,652 requirements.
6.How does Aetrix verify that 74HC7030D,652 is sourced from the original manufacturer or authorized distributors?
All 74HC7030D,652 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74HC7030D,652 meets industry standards.
7.What is the process for return or replacement of 74HC7030D,652?
All 74HC7030D,652 units undergo pre-shipment inspection (PSI). If there is an issue with 74HC7030D,652, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74HC7030D,652 part is unused and in its original packaging.
Return procedure for 74HC7030D,652:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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