Diodes Incorporated 74HCT00T14-13

Overview

74HCT00T14-13 from Diodes Incorporated is a quadruple 2-input NAND gate IC in TSSOP-14 package, operating at 4.5V–5.5V supply, delivering 4mA output drive, with TTL-compatible inputs and Schmitt-trigger action on all inputs. It performs Boolean Y = A·B across four independent gates and is used in logic interfacing for PC peripherals and consumer electronics.

For engineers reviewing the 74HCT00T14-13 datasheet, 74HCT00T14-13 pinout, 74HCT00T14-13 application, or 74HCT00T14-13 equivalent, key selection criteria include input voltage compatibility (VIH ≥ 2.0V, VIL ≤ 0.8V), propagation delay (tPD ≤ 29ns at -40°C to +125°C), output drive capability (±4mA), ESD robustness (2kV HBM), and TSSOP-14 thermal and board-space advantages over SO-14.

Technical Context

This device implements four independent, non-inverting NAND logic functions with push-pull CMOS outputs. Each gate accepts TTL-level inputs (VIH = 2.0V min, VIL = 0.8V max) and provides rail-to-rail output swing under load (VOH ≥ 3.70V at IOL = –4mA, VOL ≤ 0.4V at IOL = 4mA).

It features Schmitt-trigger inputs for noise immunity, operates across –40°C to +125°C, and meets JESD22 ESD standards (2kV HBM, 1kV CDM, 200V MM). Power dissipation per gate is 12pF typical at 1MHz, with ICC ≤ 40μA at VCC = 6.0V and no load.

Key Specifications

Pinout & Package

TSSOP-14 (Thin Shrink Small Outline Package), 4.9mm × 4.4mm body, 0.65mm pitch, exposed pad optional, RoHS-compliant, halogen-free "Green" construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input NAND gate applications.

Compared with SN74HCT00DR and 74AHCT00PW,118, the 74HCT00T14-13 uniquely balances TSSOP-14 space efficiency, full TTL input compatibility, and industrial temperature support - making it optimal for compact, mixed-signal embedded control where legacy interface reliability is mandatory.

Availability

74HCT00T14-13 is available at Aetrix Electronics and suitable for PC peripheral interface design, consumer audio control logic, DVD/Blu-ray drive controller implementation, and industrial PLC I/O expansion requiring stable component supply and long-term manufacturability.

Supply support for 74HCT00T14-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving industrial, computing, communications, and consumer markets with high-reliability components.

The 74HCT logic family targets 5V mixed-signal systems requiring TTL compatibility, low power, and robust noise immunity - designed specifically for interoperability in legacy and transitional digital infrastructure.

FAQ

Is the 74HCT00T14-13 compatible with 3.3V logic inputs?

No. Its input thresholds are fixed for TTL compatibility: VIH ≥ 2.0V and VIL ≤ 0.8V at VCC = 4.5–5.5V. A 3.3V logic high may not reliably exceed VIH under worst-case conditions, risking metastability. Level-shifting is required for interfacing with 3.3V-only sources.

Can unused inputs be left floating?

No. Floating inputs cause excessive ICC, unpredictable output states, and potential oscillation due to Schmitt-trigger hysteresis. Per datasheet Note 6, all unused inputs must be tied to VCC or GND - direct connection preferred over pull-up/down resistors to minimize leakage-induced offset.

What is the maximum capacitive load this device can drive reliably?

It is characterized up to CL = 50pF (tPD and tt tested at this load). Driving >50pF increases propagation delay nonlinearly and may cause overshoot/ringing. For >50pF loads, add a series resistor (22–47Ω) near the output to dampen reflections and maintain signal integrity.

Does the TSSOP-14 package require special PCB layout considerations?

Yes. The 0.65mm pitch demands precise solder mask definition and stencil aperture control. Recommended pad dimensions are X = 0.45mm, Y = 1.45mm, C1 = 5.9mm, C2 = 0.65mm per Diodes AP02001. Thermal relief to inner ground planes should use ≥4 spokes to avoid tombstoning during reflow.