Nexperia USA Inc. 74HCT04BZZ

Overview

74HCT04BZZ from Nexperia is a hex inverter IC with TTL-compatible inputs, 14-terminal DHXQFN package (2.0 × 2.0 × 0.48 mm), −40 °C to +125 °C operating range, 4.5–5.5 V supply, and 10–29 ns propagation delay at VCC = 4.5 V. It drives logic-level inversion in microcontroller I/O buffering, address line conditioning, and clock signal polarity correction in industrial control modules.

For engineers reviewing the 74HCT04BZZ datasheet, 74HCT04BZZ pinout, 74HCT04BZZ application, or 74HCT04BZZ equivalent, key selection criteria include TTL input threshold compatibility (VIH = 2.0 V min), low dynamic power (CPD = 24 pF), thermal-enhanced leadless QFN footprint, and guaranteed operation across extended temperature ranges without derating below 125 °C.

Technical Context

This device implements six independent CMOS-based inverters with buffered outputs and input clamp diodes enabling safe interfacing to voltages exceeding VCC via current-limiting resistors. Each gate operates with rail-to-rail output swing and exhibits symmetrical HIGH/LOW propagation delays (tPLH ≈ tPHL).

Its TTL-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V at VCC = 4.5–5.5 V) ensure direct compatibility with legacy 5 V logic families, while static current consumption remains below 2 μA at 25 °C and 40 μA over full temperature range - critical for low-power embedded systems.

Key Specifications

Pinout & Package

DHXQFN14 plastic leadless package (SOT8014-1): 2.0 mm × 2.0 mm × 0.48 mm body, 0.4 mm pitch, 14 terminals, exposed thermal pad (non-soldered or floating GND connection per datasheet note).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hex inverter applications.

Compared with 74HCT04PW and SN74HCT04DR, the 74HCT04BZZ delivers the smallest footprint (4 mm²), lowest thermal resistance among QFN variants, and tightest ICC specification - making it optimal for miniaturized, thermally constrained, and ultra-low-power industrial controllers.

Availability

74HCT04BZZ is available at Aetrix Electronics and suitable for industrial PLC I/O modules, motor control gate drivers, microcontroller address bus interfaces, and legacy system logic glue requiring stable component supply across extended temperature ranges.

Supply support for 74HCT04BZZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and discrete components with emphasis on reliability and energy efficiency.

The 74HCT04 series belongs to Nexperia's industry-standard logic portfolio, engineered specifically for robust interoperability with legacy TTL systems while meeting modern low-power and thermal requirements in industrial automation and automotive-adjacent applications.

FAQ

Can 74HCT04BZZ operate at 3.3 V supply?

No. The 74HCT04BZZ is specified only for 4.5–5.5 V operation per its TTL-input design. At 3.3 V, VIH minimum (2.0 V) would fall outside recommended margins, risking unreliable HIGH-level recognition. Use 74HC04BZZ instead for 2.0–6.0 V CMOS-compatible operation.

Is the exposed thermal pad electrically connected?

No. The exposed pad in the SOT8014-1 package has no internal electrical connection. Datasheet note (1) explicitly states it is not a ground pin; if soldered, it must remain floating or connect to GND - never to VCC or signal nets - to avoid parasitic coupling or thermal stress.

What is the maximum capacitive load for guaranteed timing?

The 10–29 ns propagation delay is characterized at CL = 50 pF. Driving >50 pF increases tpd nonlinearly: at 100 pF, delay rises ~35% (to ~39 ns max). For loads >75 pF, add series termination or buffer stages to maintain timing integrity in high-speed paths.

Does 74HCT04BZZ support hot insertion?

No. The device lacks hot-swap protection features such as power-up sequencing control or Ioff (power-off isolation). Applying VCC before GND or inserting into live backplanes risks latch-up or ESD damage due to uncontrolled biasing of internal clamp diodes and substrate paths.