Nexperia USA Inc. 74HCT244PW-Q100,11

Overview

74HCT244PW-Q100 from Nexperia is an automotive-grade octal non-inverting 3-state buffer/line driver in TSSOP20 package, featuring dual independent output-enable controls (1OE, 2OE), TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max at VCC = 4.5–5.5 V), and operation from -40 °C to +125 °C. It serves as bidirectional bus interface or load isolation in automotive body control modules.

For engineers reviewing the 74HCT244PW-Q100 datasheet, 74HCT244PW-Q100 pinout, 74HCT244PW-Q100 application, or 74HCT244PW-Q100 equivalent, key selection criteria include TTL-level input compatibility, dual 4-bit enable control, 3-state timing (ten ≤ 45 ns, tdis ≤ 38 ns at VCC = 4.5 V), AEC-Q100 Grade 1 qualification, and TSSOP20 thermal performance (Ptot derating: 10.0 mW/K above 100 °C).

Technical Context

This device implements two independent 4-bit non-inverting buffer sections, each with dedicated active-low 3-state enable (1OE for Y0–Y3, 2OE for Y4–Y7). Inputs accept TTL logic levels while outputs drive CMOS loads with VOH ≥ 3.7 V and VOL ≤ 0.4 V at IO = ±6 mA.

Its architecture supports bus-hold-free operation via internal clamp diodes enabling current-limiting resistor interfacing to voltages exceeding VCC. Latch-up immunity exceeds 100 mA per JESD78 Class II Level B, and ESD robustness meets HBM >2000 V and CDM >1000 V.

Key Specifications

Pinout & Package

TSSOP20 package (SOT360-1): plastic thin shrink small outline, 20 leads, 4.4 mm body width, 0.65 mm pitch, 1.1 mm max height - optimized for automated optical inspection (AOI) and high-density automotive PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Compared with SN74HCT244QPWRQ1, 74HCT244PW-Q100 delivers tighter propagation delay and lower ICC for energy-sensitive modules; versus 74HCT244BQ-Q100, it trades thermal performance for easier AOI inspection and lower assembly cost in mid-tier automotive systems.

Availability

74HCT244PW-Q100 is available at Aetrix Electronics and suitable for automotive body control modules, instrument cluster interfaces, ADAS camera sequencing, and electric power steering sensor hubs requiring stable component supply across extended temperature ranges and AEC-Q100 compliance.

Supply support for 74HCT244PW-Q100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable components for automotive, industrial, and consumer markets, with leadership in logic, MOSFETs, and ESD protection.

The 74HCT244-Q100 series belongs to Nexperia's automotive-qualified logic portfolio, designed specifically for robust signal buffering and bus isolation in harsh-temperature vehicle subsystems.

FAQ

What is the maximum clock frequency supported by 74HCT244PW-Q100?

The device does not operate as a clocked element but as a combinatorial buffer. Its usable data rate is determined by propagation delay (tpd ≤ 33 ns at VCC = 4.5 V) and transition time (tt ≤ 18 ns), supporting reliable operation on buses with edge rates up to 20 MHz. Timing margins must account for worst-case loading and temperature.

Can 74HCT244PW-Q100 interface directly with 3.3 V logic?

No - its TTL-compatible inputs require VIH ≥ 2.0 V, which is compatible with 3.3 V logic HIGH levels, but its minimum VCC is 4.5 V per recommended operating conditions. Operating below 4.5 V violates specification and risks unreliable VIH recognition; a level shifter or 5 V supply rail is required.

How does the dual output-enable architecture improve system reliability?

Independent 1OE and 2OE pins allow one 4-bit group to remain active while the other is disabled - enabling phased bus access, fault isolation, and reduced ground bounce. This prevents simultaneous switching noise from all eight outputs, lowering EMI and improving ADC reference stability in mixed-signal automotive ECUs.

Is thermal pad soldering required for the TSSOP20 package?

No - the TSSOP20 (SOT360-1) package has no exposed thermal pad. Thermal management relies on copper pour under pins 10 (GND) and 20 (VCC), with recommended 200 mm² of 2-oz copper connected via ≥4 thermal vias to inner ground planes to maintain junction temperature within 125 °C limit at full load.