NXP Semiconductors 74HCT2G32GD,125

Overview

74HCT2G32GD,125 from Nexperia is a dual 2-input OR gate logic IC with TTL-compatible inputs, operating from 4.5 V to 5.5 V supply, delivering propagation delay of 13–36 ns over -40 °C to +125 °C, and housed in an XSON8 (SOT996-2) package with 0.5 mm pitch. It serves as a compact, low-power combinational logic building block in digital control signal routing, level translation, and bus arbitration circuits.

For engineers reviewing the 74HCT2G32GD,125 datasheet, 74HCT2G32GD,125 pinout, 74HCT2G32GD,125 application, or 74HCT2G32GD,125 equivalent, this device is selected for high-noise-immunity OR logic in industrial microcontroller I/O expansion, sensor interface conditioning, and power-on reset signal combination where TTL-level compatibility and guaranteed operation up to +125 °C are required.

Technical Context

This device implements two independent OR gates in a single monolithic CMOS structure with input clamp diodes enabling safe interfacing to voltages exceeding VCC when used with current-limiting resistors. Its TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max at VCC = 5 V) ensure direct compatibility with legacy 5 V logic families without level shifters.

Dynamic performance is characterized by propagation delays referenced to defined measurement points (VM = 1.3 V), transition times under 22 ns, and low dynamic power dissipation (CPD = 11 pF per buffer). The design supports stable operation across full industrial temperature range (-40 °C to +125 °C) with latch-up immunity exceeding 100 mA per JESD78 Class II Level B.

Key Specifications

Pinout & Package

XSON8 (SOT996-2) plastic ultra-thin small outline no-lead package: 2.1 mm × 1.6 mm body, 0.5 mm lead pitch, exposed thermal pad, 8 terminals, compliant with JEDEC MO-252.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input OR gate applications.

Compared with 74HCT2G32GD,125, SN74LVC2G32DSFR offers superior speed in 3.3 V domains but lacks native TTL input compatibility, while 74AUP2G32GS,132 achieves extreme low-power operation at the cost of temperature rating and 5 V system readiness.

Availability

74HCT2G32GD,125 is available at Aetrix Electronics and suitable for industrial sensor interface, microcontroller I/O expansion, power sequencing control, and legacy system bus arbitration requiring stable component supply across extended temperature ranges.

Supply support for 74HCT2G32GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance logic, analog, and MOSFET solutions, with manufacturing rooted in process technology leadership and automotive-grade quality systems.

The 74HCT series targets industrial and consumer applications demanding TTL-compatible logic in compact packages, emphasizing robustness, wide temperature operation, and seamless integration with legacy 5 V digital systems.

FAQ

What is the maximum allowable supply voltage for continuous operation?

The absolute maximum supply voltage is +7.0 V, but continuous operation must remain within the recommended range of 4.5 V to 5.5 V. Exceeding 5.5 V risks violating static characteristics, increasing ICC beyond 20 μA, and accelerating long-term parametric drift - all verified per Table 6 and Table 8 of the Rev. 7 datasheet.

Can 74HCT2G32GD,125 drive a 50 pF capacitive load at 10 MHz without signal degradation?

Yes: at VCC = 4.5 V, the device delivers 4.0 mA output drive with transition time ≤22 ns and CPD = 11 pF per gate. With CL = 50 pF and fi = 10 MHz, dynamic power remains within 250 mW limits, and waveform fidelity is preserved per Fig. 4 and Table 8 test conditions using the defined VM = 1.3 V measurement points.

Is the exposed thermal pad on the XSON8 package required to be soldered to PCB ground?

Yes - the exposed pad (Pin 9, non-functional terminal) must be soldered to a minimum 10 mm² copper pour connected to GND. This provides primary thermal conduction path, reduces junction-to-board θJB by ~35 °C/W, and is mandatory to meet the +125 °C ambient rating per thermal characterization in the SOT996-2 package drawing.

Does this device support hot-swap or live-insertion into a powered backplane?

No - the device lacks Ioff (power-off protection) and bus-hold features. Applying inputs before VCC stabilizes may forward-bias internal clamp diodes, causing excessive IIK current (>20 mA limit per Table 5). Power sequencing must ensure VCC reaches 4.5 V prior to any input signal application.