Nexperia USA Inc. 74HCT32BQ,115

Overview

74HCT32BQ,115 from Nexperia is a quad 2-input OR gate IC with TTL-compatible inputs, 14-terminal DHVQFN package (SOT762-1), -40 °C to +125 °C operating range, 4.5–5.5 V supply, and 11–36 ns propagation delay at VCC = 4.5 V. It performs basic Boolean OR logic in digital control signal routing, bus arbitration, and enable-line combining in industrial microcontroller interfaces.

For engineers reviewing the 74HCT32BQ,115 datasheet, 74HCT32BQ,115 pinout, 74HCT32BQ,115 application, or 74HCT32BQ,115 equivalent, this page delivers verified pin functions, thermal-enhanced QFN package details, TTL-level input compatibility, propagation delay vs. load capacitance behavior, and direct alternatives for logic-level translation and discrete gate replacement in space-constrained embedded systems.

Technical Context

The 74HCT32BQ,115 implements four independent 2-input OR gates using CMOS silicon with TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max at VCC = 4.5–5.5 V), enabling direct interfacing with legacy 5 V TTL outputs without level shifters. Its symmetrical output drive (±4.0 mA at VOH/VOL) ensures consistent rise/fall times and noise margin across all four channels.

Designed for high-noise industrial environments, it features clamp diodes on all inputs-allowing safe interface to signals exceeding VCC when used with current-limiting resistors-and meets JESD7A (2.0–6.0 V) and JEDEC ESD standards (HBM >2000 V, CDM >1000 V). The DHVQFN14 package provides enhanced thermal performance over SO14/TSSOP variants while maintaining pin-to-pin compatibility across the 74HCT32 family.

Key Specifications

Pinout & Package

DHVQFN14 package (SOT762-1): 2.5 mm × 3.0 mm body, 0.85 mm height, 14 terminals, no leads, exposed thermal pad (not electrically connected; may be left floating or tied to GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input OR gate applications.

Compared with 74HCT32PW,118 and SN74HCT32DR, the 74HCT32BQ,115 offers superior thermal performance in dense layouts and guaranteed 125 °C operation with lower package height-critical for stacked PCBs or enclosed enclosures where airflow is restricted.

Availability

74HCT32BQ,115 is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, microcontroller GPIO logic combining, legacy system bus arbitration, and power sequencing enable logic requiring stable component supply across extended temperature ranges.

Supply support for 74HCT32BQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading semiconductor manufacturer headquartered in Nijmegen, Netherlands, specializing in high-performance logic, analog, and discrete components for industrial, automotive, and consumer applications.

The 74HCT32BQ,115 belongs to Nexperia's 74HCT logic family-designed specifically to bridge TTL and CMOS systems with robust noise immunity, wide temperature operation, and thermally optimized packaging for demanding embedded control environments.

FAQ

Is the exposed thermal pad on the 74HCT32BQ,115 electrically connected?

No-the exposed pad on the DHVQFN14 package (SOT762-1) is not electrically connected to any internal node. Per Nexperia's datasheet note, it has no electrical or mechanical requirement to be soldered. If soldered, it must remain floating or be connected to GND to avoid unintended coupling or thermal stress.

Can 74HCT32BQ,115 operate reliably at 3.3 V supply?

No-it is specified only for 4.5–5.5 V operation. At 3.3 V, input thresholds (VIH ≥ 2.0 V) become marginal, and output drive strength degrades significantly. For 3.3 V systems, use 74LVC32 or 74AHC32 variants instead.

What is the maximum capacitive load the 74HCT32BQ,115 can drive while maintaining specified propagation delay?

The datasheet specifies tpd values at CL = 50 pF. Driving loads >50 pF increases propagation delay nonlinearly-e.g., at 100 pF, tpd rises ~35% versus the 50 pF value. For loads >75 pF, add a buffer stage or reduce trace length/capacitance to maintain timing integrity.

Does 74HCT32BQ,115 support hot insertion or live swapping?

No-this device lacks hot-swap protection circuitry such as power-on reset, I/O clamp sequencing, or slew-rate control. Applying VCC or signals before GND stabilization risks latch-up or ESD damage. Always power GND first, then VCC, then apply inputs during system initialization.