Diodes Incorporated 74HCT32T14-13

Overview

74HCT32T14-13 from Diodes Incorporated is a quad 2-input OR gate IC in TSSOP-14 package, operating at 4.5V–5.5V supply, delivering 4mA output drive, 11ns typical propagation delay, and Schmitt-trigger inputs for noise immunity-used in PC motherboard logic control and peripheral interface signal conditioning.

For engineers reviewing the 74HCT32T14-13 datasheet, 74HCT32T14-13 pinout, 74HCT32T14-13 application, or 74HCT32T14-13 equivalent, key selection criteria include TTL-compatible input thresholds, push-pull output capability, ESD robustness (2kV HBM), and TSSOP-14 thermal performance in space-constrained embedded logic nodes.

Technical Context

This device implements four independent non-inverting OR logic functions (Y = A + B) with CMOS-level power efficiency and TTL-voltage-compatible inputs. Each gate features Schmitt-trigger action on both inputs, enabling reliable operation in noisy digital environments without external hysteresis components.

It operates within –40°C to +125°C ambient temperature, supports 500 ns/V input transition rate, and maintains defined VOH/VOL across full industrial temperature range under 4mA load-ensuring interoperability with legacy LSTTL and modern 5V CMOS systems.

Key Specifications

Pinout & Package

TSSOP-14 (Thin Shrink Small Outline Package), 4.9mm × 4.4mm body, 0.65mm pitch, exposed pad optional, JEDEC MO-153 compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input OR gate applications.

Compared with SN74HCT32PW and 74HCT32S14-13, the 74HCT32T14-13 offers optimal thermal profile and board area efficiency in high-density consumer electronics, while maintaining full functional and timing equivalence across all four gates.

Availability

74HCT32T14-13 is available at Aetrix Electronics and suitable for PC motherboard control logic, hard disk drive interface design, and industrial PLC input conditioning requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74HCT32T14-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving industrial, computing, and consumer markets with high-reliability components.

The 74HCT logic family targets cost-sensitive, high-volume 5V digital systems requiring TTL compatibility, low power, and robust ESD performance-designed specifically for legacy interface bridging and board-level signal aggregation.

FAQ

What is the maximum operating frequency for reliable OR-gate operation?

The 74HCT32T14-13 does not specify a maximum clock frequency, as it is a combinational logic device. Its usable toggle rate is limited by propagation delay (max 36ns at –40°C to +125°C) and load capacitance. With CL ≤ 50pF, it reliably supports data rates up to ~15MHz in feedback-free configurations.

Can unused inputs be left floating?

No. Unused inputs must be tied to VCC or GND per datasheet Recommendation Note 6. Floating inputs may cause increased ICC, erratic output states, or localized heating due to input stage contention in CMOS structures-especially under temperature extremes.

Does this part support mixed-voltage interfacing (e.g., 3.3V inputs)?

No. The 74HCT32T14-13 is designed for 4.5V–5.5V VCC only. Inputs are TTL-compatible (VIH = 2.0V min), but applying 3.3V signals while VCC = 5V is acceptable; however, driving it from a 3.3V-only supply violates absolute maximum ratings and risks damage.

Is the TSSOP-14 package thermally enhanced?

The standard TSSOP-14 package (T14) has no thermal pad. Its θJA is approximately 100°C/W on 1-inch² 2-oz copper. For higher power density layouts, Diodes recommends using the SO-14 variant or adding thermal vias under the package body per AP02001 guidelines.