Nexperia USA Inc. 74HCT3G07DP-Q100H

Overview

74HCT3G07DP-Q100 from Nexperia is an automotive-grade triple buffer IC with open-drain outputs, designed for level-shifting and wired-AND logic in 5 V TTL-compatible systems. It operates from -40 °C to +125 °C, supports 4.5 V to 5.5 V supply, delivers <0.33 V low-level output at 4 mA load, and features input clamp diodes enabling overvoltage-tolerant interfacing in body control modules.

For engineers reviewing the 74HCT3G07DP-Q100 datasheet, 74HCT3G07DP-Q100 pinout, 74HCT3G07DP-Q100 application, or 74HCT3G07DP-Q100 equivalent, key selection criteria include TTL-level input compatibility, open-drain drive capability, AEC-Q100 Grade 1 qualification, and TSSOP8 package thermal performance in engine bay sensor interfaces.

Technical Context

This device implements three independent non-inverting buffers, each with an open-drain output stage that requires external pull-up for HIGH-state assertion. Input clamp diodes allow safe interface to signals up to 6.0 V even when VCC = 4.5 V, supporting mixed-voltage domain communication between microcontrollers and CAN transceivers or LIN bus peripherals.

Propagation delays are specified at 11–27 ns (tPZL) and 10–26 ns (tPLZ) across temperature and voltage, with defined measurement thresholds (VM = 1.3 V for HCT), ensuring predictable timing in real-time automotive subsystems such as door module wake-up signaling and diagnostic response chains.

Key Specifications

Pinout & Package

TSSOP8 package (SOT505-2): plastic thin shrink small outline, 8-lead, 3 mm body width, 0.65 mm pitch, exposed pad not present - optimized for automated optical inspection and thermal dissipation in compact PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple open-drain buffer applications.

Compared with 74HCT3G07DC-Q100, the DP variant offers superior thermal dissipation in high-ambient environments due to larger TSSOP8 copper exposure; versus SN74LVC3G07QDCURQ1, it guarantees TTL-level interoperability with legacy 5 V controllers but lacks 3.3 V native support.

Availability

74HCT3G07DP-Q100 is available at Aetrix Electronics and suitable for automotive body control modules, instrument cluster interfaces, and door module wake-up circuits requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74HCT3G07DP-Q100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and MOSFET solutions for automotive, industrial, and mobile markets.

This device belongs to Nexperia's automotive logic portfolio, engineered specifically for robust signal conditioning and interface bridging in harsh-temperature automotive subsystems with stringent AEC-Q100 compliance.

FAQ

What is the maximum sink current per output at 125 °C ambient?

At Tamb = +125 °C and VCC = 5.5 V, the device guarantees 4.0 mA sink current with VOL ≤ 0.4 V per output, as confirmed in Table 7 of the Rev. 4 datasheet. Derating is not required up to this limit, and the output remains functional within absolute max ratings (IO = ±25 mA).

Can this IC interface directly with a 3.3 V microcontroller output?

No - the 74HCT3G07DP-Q100 has TTL input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), so a 3.3 V MCU output (VOH ≈ 3.3 V) meets VIH but may violate VIL if its VOL exceeds 0.8 V. For guaranteed compatibility, use a 74LVC3G07 variant or add a series resistor to limit input current when interfacing 3.3 V logic.

Is an external pull-up resistor mandatory for open-drain operation?

Yes - open-drain outputs cannot source current; a pull-up resistor to VCC or another rail is required to establish a valid HIGH logic level. Typical values range from 1 kΩ (for speed-critical 10 MHz buses) to 10 kΩ (for low-power LED driving), selected based on rise time and power budget.

Does the TSSOP8 package have a thermal pad?

No - the SOT505-2 (TSSOP8) package used for 74HCT3G07DP-Q100 has no exposed thermal pad. Thermal performance relies on copper area under the leads and PCB layout; recommended footprint follows IPC-7351B density level B with 0.3 mm solder mask expansion.