Nexperia USA Inc. 74LV1T125GWH

Overview

74LV1T125GWH from Nexperia is a single-supply, 5-pin CMOS level-translating buffer/line driver with 3-state output, supporting bidirectional voltage translation (1.8 V ↔ 3.3 V, 2.5 V ↔ 3.3 V, 3.3 V ↔ 5.0 V), 5 V tolerant inputs, and operation across -40 °C to +125 °C. It enables logic-level bridging between mixed-voltage subsystems in portable computing and industrial controllers.

For engineers reviewing the 74LV1T125GWH datasheet, 74LV1T125GWH pinout, 74LV1T125GWH application, or 74LV1T125GWH equivalent, key selection criteria include verified up/down translation capability at VCC = 1.8 V/2.5 V/3.3 V/5.0 V, 3-state enable timing (ten ≤ 12.9 ns @ 1.8 V), input leakage < ±1 μA, and TSSOP5 (SOT353-1) package compatibility with high-density PCB layouts.

Technical Context

This device implements a single-channel, non-inverting buffer with active-high output enable (OE), where output state (driven HIGH/LOW or high-impedance Z) is determined solely by OE and input A. The internal circuitry uses scalable CMOS design to maintain rail-to-rail output swing referenced to VCC across 1.6 V–5.5 V supply range.

Translation behavior is defined by input threshold voltages (VIH/VIL) that scale with VCC - e.g., VIH = 0.65 × VCC min at 3.0 V ≤ VCC ≤ 3.6 V - enabling reliable recognition of 1.8 V logic at 3.3 V VCC and 3.3 V logic at 1.8 V VCC. Input pins tolerate up to 7.0 V regardless of VCC, supporting robust down-translation from 5 V domains.

Key Specifications

Pinout & Package

TSSOP5 (SOT353-1) package: plastic thin shrink small outline, 5-lead, 1.25 mm body width, 0.65 mm lead pitch, 1.3 mm height - optimized for automated placement and thermal performance in space-constrained designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar level-translating buffer applications.

Compared with SN74LVC1T45DBVR and FXMA108MTCX, the 74LV1T125GWH provides optimal trade-off of unidirectional precision, 3-state controllability, ultra-low static current, and compact 5-pin TSSOP packaging - making it ideal for discrete signal-level translation in thermally constrained, low-power embedded systems.

Availability

74LV1T125GWH is available at Aetrix Electronics and suitable for portable applications, PC and notebooks, industrial controllers, and telecom infrastructure requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74LV1T125GWH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable, and energy-efficient components for automotive, industrial, mobile, and consumer electronics markets.

The 74LV1T series targets space- and power-sensitive applications requiring single-gate logic with advanced voltage translation - designed specifically for seamless integration into mixed-voltage digital subsystems without external passive components.

FAQ

What is the maximum recommended VCC voltage for continuous operation?

The absolute maximum VCC is +7.0 V per limiting values table, but the recommended operating maximum is 5.5 V. Operating continuously above 5.5 V risks exceeding safe junction temperature and violates JEDEC-compliant stress limits. For long-term reliability in production, VCC must remain within 1.6 V to 5.5 V as specified in Table 6.

Can the 74LV1T125GWH translate 5 V inputs to 1.8 V outputs?

No - the device does not support 5 V → 1.8 V down-translation. Its inputs are 5 V tolerant, but output voltage swing is always referenced to VCC. To generate 1.8 V outputs, VCC must be set to 1.8 V, and input logic must be compatible with VIH/VIL thresholds at that VCC (e.g., 3.3 V input is valid at VCC = 1.8 V due to 5 V tolerance, but output will be 0–1.8 V).

Is the GND pin (Pin 3) internally connected to substrate or exposed pad?

There is no exposed thermal pad in the SOT353-1 (TSSOP5) package. Pin 3 (GND) is the sole ground connection for both logic and power return paths. Internal substrate connection is tied exclusively to this pin; no secondary grounding path exists. PCB layout must provide low-impedance copper pour directly connected to Pin 3.

Does the 3-state disable time (tdis) vary with load capacitance?

Yes - tdis increases with higher capacitive loads. At VCC = 5.0 V, tdis is 5.0 ns (typical) with CL = 15 pF, rising to 6.5 ns (typical) at CL = 30 pF. This dependency is documented in Table 8 and must be accounted for in bus timing budgets where Y drives >20 pF net capacitance.