Texas Instruments 74LVC16T245DGGRG4
- Part No.:
- 74LVC16T245DGGRG4
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74LVC16T245DGGRG4.pdf
- Description:
- IC TRANSLATOR BIDIR 48TSSOP
- Quantity:
- Payment:

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Product details
Overview
74LVC16T245 from Texas Instruments is a 16-bit dual-supply noninverting bus transceiver with configurable level-shifting, supporting bidirectional voltage translation between 1.65 V–5.5 V domains on both A and B ports. It features independent VCCA and VCCB rails, Ioff partial-power-down protection, VCC isolation, and tri-state outputs controlled by DIR/OE pins. Used in mixed-voltage interconnects between 1.8-V controllers and 3.3-V peripherals.
For engineers reviewing the 74LVC16T245 datasheet, 74LVC16T245 pinout, 74LVC16T245 application, or 74LVC16T245 equivalent, key selection criteria include dual-rail supply flexibility (VCCA/VCCB = 1.65–5.5 V), guaranteed high-impedance during power sequencing, ±32 mA output drive at 4.5 V, sub-7 ns propagation delay (A→B @ 3.3 V→5 V), and Ioff compliance for hot-swap safety.
Technical Context
The 74LVC16T245 implements two independent 8-bit transceiver blocks (1A/1B and 2A/2B), each with dedicated DIR and OE controls referenced to VCCA. Direction logic is asynchronous: DIR = HIGH enables A→B data flow; DIR = LOW enables B→A flow. OE = HIGH forces both ports into high-impedance regardless of DIR state.
VCC isolation ensures that if either VCCA or VCCB drops to GND, all I/Os enter high-impedance-preventing backdrive and bus contention. Input thresholds (VIH/VIL) scale with their respective VCC rail, enabling robust operation across 1.8 V, 2.5 V, 3.3 V, and 5 V interfaces without external biasing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCA / VCCB Range | 1.65 V to 5.5 V per rail - enables direct translation between 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains without level-shifters |
| Max Output Drive | ±32 mA at VCC = 4.5 V - supports driving 50-Ω transmission lines or multiple CMOS loads |
| tPLH / tPHL (A→B) | 0.4 ns min / 7.1 ns max @ VCCA=5 V, VCCB=5 V - enables >100 MHz data rates under light load |
| Ioff Current | ±2 μA max @ TA = 85°C - prevents damaging back-current when one rail is powered down |
| VCC Isolation | Both ports auto-enter Hi-Z if VCCA = GND or VCCB = GND - eliminates bus contention during power sequencing |
| ESD Rating | ±2000 V HBM - meets industrial handling requirements without additional protection circuitry |
| Operating Temp | –40°C to +85°C - qualified for extended-temperature industrial and telecom applications |
Pinout & Package
TSSOP-48 package (12.50 mm × 6.10 mm), lead pitch 0.5 mm, RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A8, 2A1–2A8 | A-port I/O | Bi-directional data lines referenced to VCCA; tolerate 0–VCCA+0.5 V |
| 1B1–1B8, 2B1–2B8 | B-port I/O | Bi-directional data lines referenced to VCCB; tolerate 0–VCCB+0.5 V |
| 1DIR, 2DIR | Direction control input | Active-HIGH: A→B; Active-LOW: B→A; referenced to VCCA |
| 1OE, 2OE | Output enable input | Active-HIGH disables all outputs (Hi-Z); referenced to VCCA |
| VCCA | A-port supply | Power rail for A-side logic, DIR/OE inputs, and A-port I/O threshold reference |
| VCCB | B-port supply | Power rail for B-side logic and B-port I/O threshold reference |
| GND | Ground | Common return for both supply domains; must be low-impedance connection |
Key Features
| Feature | Design Value |
|---|---|
| Dual-rail voltage translation | Independent 1.65–5.5 V operation on VCCA and VCCB enables seamless 1.8↔3.3 V, 2.5↔5 V, or 3.3↔5 V interconnects |
| VCC isolation | Automatic Hi-Z activation on both ports if either VCCA or VCCB falls to GND - critical for safe hot-plug and power-rail sequencing |
| Ioff partial-power-down | Prevents destructive back-current when one supply is off while the other remains active - required for PCIe, USB, and modular systems |
| Configurable direction per channel pair | Two independent DIR/OE controls allow simultaneous A→B and B→A data flow on separate 8-bit lanes |
| Overvoltage-tolerant I/O | A/B ports withstand up to VCCX + 0.5 V - eliminates need for external clamping diodes in mixed-voltage systems |
Applications
| Industrial PLC Backplane Interconnect | Automotive ADAS Sensor Hub |
|---|---|
Use Scenario: Connecting a 3.3-V FPGA-based motion controller to legacy 5-V analog I/O modules via shared backplane. IC Role / Device Role / Timing Role: Bidirectional level translator isolating FPGA domain from 5-V fieldbus; DIR toggled per command cycle; OE held low during active transfer. Use Value: Eliminates discrete resistor-divider networks and reduces PCB area by 65% versus discrete solutions while maintaining <10 ns timing margin. | Use Scenario: Aggregating data from 1.8-V image sensors and 2.5-V radar processors into a 3.3-V domain MCU in a compact ADAS ECU. IC Role / Device Role / Timing Role: Dual-rail transceiver enabling concurrent sensor readout and radar preprocessing; VCCA = 1.8 V, VCCB = 3.3 V, DIR fixed for sensor→MCU path. Use Value: Guarantees clean signal integrity across voltage domains without timing skew; Ioff prevents sensor damage during MCU reset sequences. |
| Enterprise SSD NVMe Controller Bridge | Telecom Baseband Unit Interface |
Use Scenario: Interfacing a 1.8-V NVMe host controller to a 3.3-V NAND flash memory subsystem in an enterprise SSD. IC Role / Device Role / Timing Role: High-speed bidirectional translator on command/address/data bus; OE synchronized to controller clock enable; DIR set for host→flash writes. Use Value: Supports 800 MB/s throughput with <7 ns propagation delay; VCC isolation prevents NAND corruption during host power collapse. | Use Scenario: Linking a 2.5-V baseband processor to 5-V RF front-end ICs in a 4G/LTE macro base station radio unit. IC Role / Device Role / Timing Role: Level-shifting transceiver on control/status bus; DIR tied low for processor→RF path; OE managed by firmware for fault isolation. Use Value: Enables reliable GPIO and SPI communication across voltage domains; ±2000 V HBM rating withstands harsh RF environment ESD events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AVCH16T245 | Lower VCC min (1.2 V), higher speed (tPLH ≤ 4.2 ns @ 3.3 V→5 V), but no VCC isolation | Requires external power-good sequencing; unsuitable for uncontrolled hot-swap scenarios | Select when maximum speed and lowest voltage operation are critical, and power sequencing is tightly controlled. |
| TXB0108PWR | Auto-direction sensing (no DIR pin), lower drive (±24 mA), supports 1.2–3.6 V only on A side | Limited to single-supply translation; cannot handle 5-V B-side interfaces | Select for simple 1.8↔3.3 V point-to-point links where direction is predictable and 5-V compatibility is unnecessary. |
Compared with SN74AVCH16T245 and TXB0108PWR, the 74LVC16T245 uniquely combines full 1.65–5.5 V dual-rail support, VCC isolation, and Ioff in a TSSOP-48 package-making it the only choice for robust, mixed-voltage industrial backplanes requiring fail-safe power sequencing.
Availability
74LVC16T245 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ADAS sensor hubs, enterprise SSD controllers, and telecom baseband units requiring stable component supply across extended temperature ranges and mixed-voltage designs.
Supply support for 74LVC16T245 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with deep expertise in interface, power management, and logic ICs for industrial, automotive, and communications markets.
The SN74LVC16T245 belongs to TI's LVC logic family, engineered specifically for low-voltage, mixed-domain system interconnects where voltage translation, power sequencing resilience, and ESD robustness are mission-critical.
FAQ
What is the minimum operating voltage for VCCA and VCCB on the 74LVC16T245?
The 74LVC16T245 supports VCCA and VCCB independently from 1.65 V to 5.5 V. Operation below 1.65 V is not guaranteed - the device will not function correctly at 1.5 V or lower. This 1.65 V minimum enables compatibility with 1.8-V systems while maintaining noise margin and drive strength.
Can the 74LVC16T245 translate between 1.8-V and 5-V logic levels bidirectionally?
Yes, the 74LVC16T245 fully supports bidirectional 1.8-V ↔ 5-V translation: configure VCCA = 1.8 V and VCCB = 5 V for A→B flow, or VCCA = 5 V and VCCB = 1.8 V for B→A flow. Input thresholds scale with the local VCC, and overvoltage tolerance (up to VCCX + 0.5 V) protects I/Os during level transitions.
Does the 74LVC16T245 require external pull-up resistors on DIR or OE pins?
OE must be pulled up to VCCA (not VCCB or another rail) via an external resistor to ensure Hi-Z state during power-up/power-down; minimum value depends on driver sink capability (typically 10 kΩ). DIR has no such requirement - it may be driven directly from a logic source or tied HIGH/LOW as needed for fixed-direction operation.
How does VCC isolation work on the 74LVC16T245, and why is it important?
VCC isolation means that if either VCCA or VCCB falls to GND, all A- and B-port I/Os automatically enter high-impedance - verified in Electrical Characteristics (IOZ ≤ ±2 μA). This prevents back-driving powered-down sections of a system, eliminating bus contention and potential latch-up in modular or hot-swap architectures.
Is the 74LVC16T245 pin-compatible with the SN74LVC16245?
No - the 74LVC16T245 is not pin-compatible with SN74LVC16245. The 74LVC16T245 uses dual DIR/OE controls (1DIR/1OE, 2DIR/2OE) and separate VCCA/VCCB supplies, while SN74LVC16245 has single DIR/OE and a single VCC. Pin assignments, power domains, and functional behavior differ fundamentally; PCB redesign is required for substitution.
74LVC16T245DGGRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Translation Transceiver
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
74LVC16T245DGGRG4 FAQ
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6.How does Aetrix verify that 74LVC16T245DGGRG4 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of 74LVC16T245DGGRG4?
All 74LVC16T245DGGRG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC16T245DGGRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC16T245DGGRG4 part is unused and in its original packaging.
Return procedure for 74LVC16T245DGGRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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