Diodes Incorporated 74LVC1G00FX4-7

Overview

74LVC1G00FX4-7 from Diodes Incorporated is a single 2-input positive NAND gate in a 1.4 mm × 0.9 mm X2-DFN1409-6 chip-scale package, operating from 1.65 V to 5.5 V with ±24 mA output drive at 3.3 V and 5.5 V-tolerant inputs. It supports partial power-down via IOFF, enabling safe signal isolation in mixed-voltage systems such as USB interface level-shifting and portable device power sequencing.

For engineers reviewing the 74LVC1G00FX4-7 datasheet, 74LVC1G00FX4-7 pinout, 74LVC1G00FX4-7 application, or 74LVC1G00FX4-7 equivalent, key selection criteria include its 0.5 mm pad pitch DFN layout, sub-6 ns propagation delay at 3.3 V, IOFF-enabled backflow prevention during power-down, and compatibility with 1.8 V/3.3 V/5 V logic domains in space-constrained embedded designs.

Technical Context

This device implements standard Boolean NAND logic (Y = A·B) using CMOS technology with push-pull outputs and no internal pull-ups or pull-downs. Its IOFF circuit actively disables output terminals when VCC = 0 V, blocking reverse current flow up to ±10 μA leakage.

Input thresholds scale with VCC (e.g., VIH = 0.7×VCC at 4.5–5.5 V), ensuring robust noise margins across supply voltages. The 5.5 V input tolerance enables direct interfacing with legacy 5 V TTL signals while powered from lower-voltage rails like 1.8 V or 2.5 V.

Key Specifications

Pinout & Package

X2-DFN1409-6 is a 6-terminal chip-scale package with 0.5 mm pad pitch, 1.4 mm × 0.9 mm footprint, and 0.4 mm height. Pin 1 (A) is marked by a circular fiducial on the bottom side.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar single 2-input NAND gate applications.

Compared with SN74LVC1G00DBVR and 74AUP1G00GW,125, the 74LVC1G00FX4-7 uniquely combines chip-scale packaging, 5.5 V input tolerance, and IOFF in a single device-making it the sole choice for space-constrained, mixed-voltage, and power-sequenced designs requiring guaranteed backflow prevention.

Availability

74LVC1G00FX4-7 is available at Aetrix Electronics and suitable for USB interface design, portable device power management, and low-power sensor hub integration requiring stable component supply and long-term lifecycle support.

Supply support for 74LVC1G00FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and logic solutions, with manufacturing certified to IATF 16949 and product qualification per AEC-Q100/101/200 standards.

The 74LVC logic family targets high-speed, low-voltage general-purpose digital applications, emphasizing wide supply range, mixed-voltage interoperability, and robust ESD performance for consumer, computing, and industrial end equipment.

FAQ

Can 74LVC1G00FX4-7 operate reliably at 1.65 V supply?

Yes. The device is fully characterized down to 1.65 V, with guaranteed propagation delay ≤8.0 ns and output drive ≥±4 mA at that voltage. Input thresholds scale accordingly (VIH = 0.65×VCC), ensuring noise margins remain compliant per JEDEC standards.

What is the thermal impact of using X2-DFN1409-6 in high-density layouts?

The X2-DFN1409-6 has θJA = 470°C/W, meaning it heats significantly more than larger packages under identical load. For continuous 24 mA output, junction temperature rise exceeds 11°C at ambient - thermal relief pads and minimal copper isolation are recommended to avoid derating.

How does IOFF behave when VCC is ramping during power-up?

IOFF activates only when VCC falls below ~0.8 V. During power-up, the output remains functional once VCC exceeds 1.0 V; no undefined state occurs. The transition is monotonic and does not introduce glitches on Y during supply ramping.

Is NC pin on FX4 internally connected or floating?

The NC pin is an unconnected die pad with no internal bond wire. It is electrically isolated and must remain unconnected on the PCB. Soldering it to ground or VCC may cause parasitic coupling or thermal stress due to coefficient-of-thermal-expansion mismatch.