Diodes Incorporated 74LVC1G06FS3-7

Overview

74LVC1G06FS3-7 from Diodes Incorporated is a single inverter buffer/driver with open-drain output, designed for voltage-level shifting and signal isolation in mixed-voltage systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs, supports IOFF partial power-down mode, delivers 32mA sink current at 5V, and uses the X2-DFN0808-4 (0.8mm × 0.8mm) package for ultra-compact PCB integration in portable electronics.

For engineers reviewing the 74LVC1G06FS3-7 datasheet, 74LVC1G06FS3-7 pinout, 74LVC1G06FS3-7 application, or 74LVC1G06FS3-7 equivalent, this device is selected for low-power logic inversion with open-drain flexibility, input overvoltage tolerance, and thermal performance in space-constrained designs requiring reliable sink capability and power-down safety.

Technical Context

This IC implements a single CMOS inverter stage with an open-drain N-channel MOSFET output, enabling wired-OR/AND configurations and bidirectional level translation. Its IOFF circuit actively disables output leakage during VCC = 0V, preventing backflow currents up to ±200μA at 5.5V.

Propagation delay ranges from 0.5ns (typ.) at 5V to 6.5ns (max.) at 1.8V across –40°C to +85°C; input thresholds scale with VCC (e.g., VIH = 0.7×VCC at 4.5–5.5V), and output VOL remains ≤0.55V at IOL = 32mA, ensuring robust low-state drive under load.

Key Specifications

Pinout & Package

X2-DFN0808-4 is a 4-terminal chip-scale package with exposed pad (non-electrical), 0.5mm diamond pad pitch, and bottom-side pin #1 marking. Pin 1 (A) is input; Pin 2 (GND) is ground; Pin 3 (VCC) is supply; Pin 4 (Y) is open-drain output. No-connect (NC) terminals are absent - all four pads are functional.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar single inverter with open-drain output applications.

Compared with SN74LVC1G06DBVR and 74AUP1G06GW,125, the 74LVC1G06FS3-7 uniquely combines 5.5V input tolerance, 32mA sink capability at 5V, and the smallest available footprint (0.8mm²), making it optimal for space- and voltage-flexible designs where IOFF reliability is mandatory.

Availability

74LVC1G06FS3-7 is available at Aetrix Electronics and suitable for USB power control, IoT sensor interfaces, and industrial PLC input conditioning requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 74LVC1G06FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance, energy-efficient components for consumer, computing, industrial, and automotive markets.

The 74LVC logic family targets low-voltage, mixed-supply digital systems, emphasizing voltage tolerance, power-down safety, and compact packaging for next-generation portable and embedded electronics.

FAQ

Can 74LVC1G06FS3-7 operate with VCC = 1.65V while accepting a 5V input signal?

Yes. The device guarantees 5.5V-tolerant inputs across its full 1.65–5.5V supply range. At VCC = 1.65V, the input clamp structure safely sinks transient current without damage, and logic thresholds remain valid per datasheet VIH/VIL specs - enabling direct interface with legacy 5V peripherals.

What is the maximum recommended pull-up resistor value for the open-drain Y output when sinking 32mA at 5V?

Using Ohm's Law with VOL ≤ 0.55V at IOL = 32mA, the maximum pull-up resistance is (5V − 0.55V) / 0.032A ≈ 139Ω. For reliable margin, Diodes recommends ≤100Ω for 5V systems; lower values (e.g., 47Ω) improve rise time but increase static power draw.

Does the X2-DFN0808-4 package require thermal vias under the exposed pad?

No - the X2-DFN0808-4 has no exposed thermal pad. Its thermal path relies solely on copper traces connected to GND and VCC pins. Diodes' datasheet specifies θJA = 400°C/W on FR-4 with minimum recommended pad layout; adding thermal relief or wider traces improves dissipation but vias are not needed or specified.

How does IOFF behavior differ from standard CMOS high-impedance tri-state in power-down scenarios?

IOFF actively disables the output FET's channel when VCC = 0V, limiting leakage to ±200μA even with 5.5V applied to Y or A. Standard tri-state outputs lack this protection - their off-state impedance degrades at zero VCC, risking destructive back-current through substrate paths in multi-rail systems.