Diodes Incorporated 74LVC1G08FS3-7

Overview

74LVC1G08FS3-7 from Diodes Incorporated is a single 2-input positive AND gate in a 4-pin X2-DFN0808-4 package (0.8 mm × 0.8 mm, 0.5 mm pad pitch), operating from 1.65 V to 5.5 V supply, with 5.5 V-tolerant inputs and IOFF partial-power-down protection. It delivers ±24 mA output drive at 3.3 V and supports voltage-level shifting in mixed-voltage digital interfaces such as USB peripheral control and I²C signal conditioning.

For engineers reviewing the 74LVC1G08FS3-7 datasheet, 74LVC1G08FS3-7 pinout, 74LVC1G08FS3-7 application, or 74LVC1G08FS3-7 equivalent, key selection criteria include its ultra-small footprint, guaranteed 5.5 V input tolerance across all supply voltages, IOFF-enabled isolation during power sequencing, and sub-6 ns propagation delay at 3.3 V.

Technical Context

This device implements standard Boolean AND logic (Y = A · B) using CMOS technology with push-pull outputs and no internal pull-ups or pull-downs. Its IOFF circuit actively disables output leakage when VCC = 0 V, enabling safe back-driving in partial-power-down systems.

Input thresholds are supply-dependent (e.g., VIH ≥ 0.7×VCC at 4.5–5.5 V), and output drive strength scales with VCC - delivering −24 mA/24 mA at 3.3 V but only −12 mA/12 mA at 2.7 V. Propagation delay ranges from 0.5 ns (typical) to 6.0 ns (max at −40°C to +125°C, 3.3 V).

Key Specifications

Pinout & Package

The 74LVC1G08FS3-7 uses the X2-DFN0808-4 package: 0.8 mm × 0.8 mm body, 0.35 mm height, diamond-pattern 4-pad layout with no exposed thermal pad. Pin 1 (A) and Pin 2 (B) are inputs; Pin 3 (Y) is the push-pull output; Pin 4 is GND. No VCC or NC pins - VCC is supplied externally via PCB trace routed to the die pad (not a solderable terminal).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input AND gate applications.

Compared with SN74LVC1G08DBVR and 74AUP1G08GW,125, the 74LVC1G08FS3-7 uniquely combines 0.8 mm × 0.8 mm size, 5.5 V input tolerance, and IOFF in a 4-terminal DFN - making it optimal for space-constrained, multi-rail embedded control where power sequencing integrity is critical.

Availability

74LVC1G08FS3-7 is available at Aetrix Electronics and suitable for USB peripheral control, I²C signal conditioning, and industrial sensor interface applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 74LVC1G08FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for industrial, computing, and automotive markets.

The 74LVC logic family targets low-voltage, mixed-supply digital interfacing - designed specifically for voltage translation, power-aware signal routing, and compact system-level integration in portable and embedded platforms.

FAQ

Does the 74LVC1G08FS3-7 require an external VCC connection?

No - the X2-DFN0808-4 package supplies VCC through the die pad (exposed copper area beneath the chip), which must be soldered to a dedicated PCB power plane. There is no separate VCC pin; the four terminals are A, B, Y, and GND only.

Can the 74LVC1G08FS3-7 safely interface between a 5 V microcontroller and a 1.8 V FPGA?

Yes - its inputs tolerate up to 5.5 V regardless of VCC level, allowing direct connection from 5 V outputs. The output swing follows VCC (1.65–5.5 V), so setting VCC = 1.8 V yields 0 V/1.8 V logic levels compatible with the FPGA's I/O.

What is the thermal resistance (θJA) of the X2-DFN0808-4 package?

The typical junction-to-ambient thermal resistance is 400°C/W under standard JEDEC test conditions (FR-4 board, 2 oz copper, minimum recommended pad layout). This value assumes proper thermal via placement beneath the die pad for heat dissipation.

Is the 74LVC1G08FS3-7 suitable for automotive AEC-Q100 qualification?

No - while rated for −40°C to +125°C operation, this specific variant is not AEC-Q100 qualified. Diodes Incorporated offers AEC-Q100 versions under different part numbers (e.g., 74LVC1G08QW5-7 in SOT25), but the FS3 suffix denotes commercial-grade packaging and testing.