Diodes Incorporated 74LVC1G08FW5-7

Overview

74LVC1G08FW5-7 from Diodes Incorporated is a single 2-input positive AND gate in a 1.0 mm × 1.0 mm X1-DFN1010-6 (Type B) package, operating from 1.65 V to 5.5 V supply, with 5.5 V-tolerant inputs and ±24 mA output drive at 3.3 V. It supports partial power-down via IOFF, enabling safe signal isolation in mixed-voltage systems such as USB interface level-shifting and portable device power management.

For engineers reviewing the 74LVC1G08FW5-7 datasheet, 74LVC1G08FW5-7 pinout, 74LVC1G08FW5-7 application, or 74LVC1G08FW5-7 equivalent, key selection criteria include input voltage tolerance, IOFF-enabled power-down behavior, propagation delay under 4.5 ns at 3.3 V, thermal resistance of 435 °C/W (J-A), and compatibility with 0.35 mm pitch DFN layout constraints.

Technical Context

This device implements standard Boolean AND logic (Y = A · B) using CMOS technology with push-pull outputs. Its IOFF circuit actively disables output terminals during power-down, preventing back-current flow when VCC = 0 V while inputs remain biased at up to 5.5 V.

Input thresholds are voltage-ratio-based (e.g., VIH ≥ 0.65×VCC for 1.65–1.95 V operation) and support direct interfacing with TTL logic levels. Propagation delay varies from 0.5 ns (min) to 6.0 ns (max) at 3.3 V across –40°C to +125°C, with typical Cpd = 16 pF at 10 MHz.

Key Specifications

Pinout & Package

X1-DFN1010-6 (Type B) is a 1.0 mm × 1.0 mm, 0.5 mm height, 6-terminal leadless package with 0.35 mm pad pitch and exposed thermal pad (non-electrical). Pin 1 identifier is marked by a chamfered corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input AND gate applications.

Compared with SN74LVC1G08DBVR and 74LVC1G08FS3-7, the 74LVC1G08FW5-7 balances compactness (1.0 mm²), thermal margin (435 °C/W), and layout flexibility (6-pin with NC), making it optimal for dense portable PCBs requiring mixed-voltage signal integrity.

Availability

74LVC1G08FW5-7 is available at Aetrix Electronics and suitable for USB interface design, portable device power sequencing, and IoT sensor hub applications requiring stable component supply, consistent DFN-6 sourcing, and long-term industrial lifecycle support.

Supply support for 74LVC1G08FW5-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for consumer, computing, and industrial markets.

The 74LVC logic family targets low-voltage, mixed-signal system integration, emphasizing voltage translation, power-aware logic, and small-footprint timing-critical functions in space-constrained designs.

FAQ

What is the function of the NC pin on the 74LVC1G08FW5-7?

The NC (No Connection) pin on the X1-DFN1010-6 (Type B) package is internally unconnected. It serves mechanical stabilization and thermal relief purposes. Diodes Incorporated recommends leaving it floating or connecting it to GND for improved solder joint reliability-never tie it to VCC or signal lines.

Can the 74LVC1G08FW5-7 operate reliably at 1.65 V supply?

Yes. The device is fully characterized down to 1.65 V, with guaranteed VOL ≤ 0.45 V and VOH ≥ VCC – 0.1 V at –40°C to +85°C. At this minimum voltage, propagation delay increases to 8.0 ns (max), and output drive reduces to ±4 mA, which remains sufficient for driving LVC inputs or short PCB traces.

How does IOFF protect the device during partial power-down?

When VCC = 0 V, the IOFF circuit disables both output FETs, limiting leakage current to ±10 μA (max) even if inputs or outputs are held at 5.5 V. This prevents damaging reverse current flow into a powered-down domain, satisfying JEDEC JESD78 latch-up immunity requirements (>100 mA).

Is the X1-DFN1010-6 (Type B) package compatible with standard reflow profiles?

Yes. The package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 (MSL-1) and withstands peak reflow temperatures up to 260°C. Recommended profile uses ramp rate ≤ 3°C/s, preheat 150–200°C for 90–120 s, and time above liquidus (217°C) of 60–90 s with controlled cooling.