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Diodes Incorporated 74LVC1G125FX4-7

Part No.:
74LVC1G125FX4-7
Manufacturer:
Diodes Incorporated
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
6-XFDFN
Datasheet:
Aetrix74LVC1G125FX4-7.pdf
Description:
IC BUFF NON-INVERT 5.5V 6XFDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,996

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Product details

Overview

74LVC1G125FX4-7 from Diodes Incorporated is a single non-inverting 3-state buffer IC designed for voltage-level shifting and signal isolation in mixed-voltage digital systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs, delivers ±24mA output drive at 3.3V, and features IOFF circuitry for partial power-down protection-used in notebook I/O expansion, USB peripheral interface logic, and embedded controller bus buffering.

For engineers reviewing the 74LVC1G125FX4-7 datasheet, 74LVC1G125FX4-7 pinout, 74LVC1G125FX4-7 application, or 74LVC1G125FX4-7 equivalent, key selection criteria include its 1.65–5.5V supply range, 5.5V-tolerant inputs, IOFF-enabled power-down safety, and X2-DFN1409-6 chip-scale package footprint for space-constrained portable designs.

Technical Context

This device implements a single-channel CMOS buffer with active-low 3-state output enable (OE), enabling bidirectional bus control and signal gating in low-power digital subsystems. Its IOFF functionality disables both output and input paths during power-down, preventing back-current flow when VCC = 0V while inputs remain biased at up to 5.5V.

The logic is fully specified across –40°C to +125°C ambient, supports TTL-level interfacing, and exhibits propagation delays as low as 0.5ns (typ) at 3.3V. Input transition rate limits (5–20 ns/V) and ESD robustness (2kV HBM, 1kV CDM) ensure reliable operation in noisy industrial and consumer environments.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 1.65V to 5.5V - Enables direct interface between 1.8V, 2.5V, 3.3V, and 5V logic domains without level shifters.
Input Voltage Tolerance Up to 5.5V - Allows safe connection to higher-voltage buses while powered from lower VCC (e.g., 1.8V core).
Output Drive Strength ±24mA at 3.3V - Sufficient to drive multiple LVC loads or short PCB traces without external buffering.
IOFF Leakage Current ±200μA max at –40°C to +125°C - Prevents damaging current backflow during partial power-down sequences.
Propagation Delay 0.5ns (typ) to 6.0ns (max) at 3.3V - Supports high-speed data routing in timing-critical control paths.
ESD Protection 2kV HBM, 1kV CDM, 200V MM - Meets industrial-grade robustness requirements without external protection diodes.
Operating Temperature –40°C to +125°C - Qualified for under-hood automotive modules, industrial PLC I/O, and ruggedized portable electronics.

Pinout & Package

X2-DFN1409-6 is a 0.4mm-thick, 1.4mm × 0.9mm chip-scale package with six solder pads and no leads; requires controlled thermal pad layout per Diodes Inc. recommended footprint (C = 1.000mm, G = 0.200mm, X = 0.400mm, Y = 0.150mm).

Pin/Terminal Circuit Role Design Meaning
1 (GND) Ground reference Primary return path for all internal logic and output current; must be low-inductance connection to system ground plane.
2 (A) Data input Non-inverting input signal node; accepts 5.5V-tolerant logic levels independent of VCC voltage.
3 (OE) Active-low output enable Drives output Y to high-impedance state when HIGH; enables bus sharing and power-gated signal routing.
4 (VCC) Power supply Supplies core logic and output drivers; decoupling capacitor (100nF) required within 2mm of this pad.
5 (NC) No connection Internally unconnected pad; must remain un-soldered and un-bonded per Diodes Inc. design rules.
6 (Y) 3-state output Buffered, non-inverted copy of A when OE = LOW; enters high-Z state when OE = HIGH for bus contention avoidance.

Key Features

Feature Design Value
Wide supply range (1.65–5.5V) Eliminates need for separate level translators in multi-rail systems such as USB-C PD controllers or FPGA I/O banks.
IOFF partial power-down support Prevents reverse current flow into powered-down sections-critical for hot-plug interfaces and battery-backed subsystems.
5.5V-tolerant inputs Allows direct connection to legacy 5V peripherals (e.g., SPI EEPROMs, UART transceivers) while operating from 1.8V/3.3V rails.
Low dynamic power (19pF Cpd) Reduces switching noise and supply ripple in high-density PCB layouts with >100MHz clocked I/O.
Chip-scale X2-DFN1409-6 package 0.9mm × 1.4mm footprint saves >60% board area vs. SOT25, enabling ultra-compact wearable and IoT sensor node designs.

Applications

USB Peripheral Interface Embedded Controller Bus Isolation

Use Scenario: Isolating USB 2.0 D+ and D– lines between host MCU and external hub IC during suspend mode.

IC Role / Device Role / Timing Role: 3-state buffer enabling/disabling signal path based on USB suspend/resume handshake signals.

Use Value: Prevents signal contention and leakage current during low-power states while maintaining fast 0.5ns propagation for full-speed signaling.

Use Scenario: Buffering GPIO-controlled I²C/SPI lines between an ARM Cortex-M4 and external PMIC or sensor array.

IC Role / Device Role / Timing Role: Non-inverting gate with OE-controlled output disable to isolate bus segments during firmware updates or fault recovery.

Use Value: Ensures clean bus release with <10ns disable time (tdis), avoiding arbitration errors during hot-reconfiguration.

Laptop Keyboard Backlight Control Industrial Sensor Signal Conditioning

Use Scenario: Driving PWM-dimmed LED backlight strings from a 1.8V microcontroller GPIO through a 3.3V LED driver IC.

IC Role / Device Role / Timing Role: Level-shifting buffer translating 1.8V logic to 3.3V-compatible enable signal with 5.5V-tolerant input.

Use Value: Eliminates discrete MOSFET level shifter; ±24mA drive ensures fast edge rates for flicker-free dimming at 20kHz PWM.

Use Scenario: Isolating analog-to-digital converter (ADC) serial interface lines from noisy motor-control MCU during high-current switching events.

IC Role / Device Role / Timing Role: 3-state gate placed between ADC SDO and MCU MISO, disabled during motor commutation bursts.

Use Value: Blocks induced noise coupling via high-Z state; IOFF prevents ground bounce injection into ADC reference domain.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-state buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC1G125DBVR Same logic function and 1.65–5.5V range; uses SOT-23-5 (5-pin) package with no NC pin and different pinout (OE on pin 1). Suitable for legacy SMT lines using standard SOT-23 tooling; lacks chip-scale footprint advantage. Select when board rework compatibility with existing SOT-23 footprints is required over size reduction.
74LVC1G125FS3-7 Identical electrical specs but packaged in X2-DFN0808-4 (0.8mm × 0.8mm), smaller than FX4 but with only 4 pads (no NC, GND shared). Better for ultra-dense layouts where 0.8mm × 0.8mm is mandatory; lacks dedicated GND and NC pins for noise-sensitive routing. Choose when minimum footprint is critical and simplified 4-pad layout suffices for EMI control.

Compared with SN74LVC1G125DBVR and 74LVC1G125FS3-7, the 74LVC1G125FX4-7 offers superior thermal resistance (θJA = 470°C/W vs. ~200°C/W for SOT-23) and dedicated GND/NC pads for improved signal integrity-making it optimal for thermally constrained, high-reliability portable designs.

Availability

74LVC1G125FX4-7 is available at Aetrix Electronics and suitable for USB peripheral interface, embedded controller bus isolation, and industrial sensor signal conditioning requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for 74LVC1G125FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for industrial, computing, and consumer markets.

The 74LVC logic family targets space- and power-constrained digital interface applications, emphasizing voltage flexibility, robust ESD performance, and compact packaging for next-generation portable and embedded systems.

FAQ

What is the maximum allowable input voltage when VCC = 0V?

The 74LVC1G125FX4-7 supports 5.5V-tolerant inputs regardless of VCC state. When VCC = 0V, the IOFF circuitry actively disables input and output paths, limiting leakage to ±200μA max. This allows safe "live" signal injection into unpowered systems-common in hot-swap PCIe add-in cards and modular power supplies.

Can the NC pin (Pin 5) be grounded or left floating?

Pin 5 is internally unconnected and must remain unsoldered and unconnected per Diodes Inc. design guidelines. Grounding or routing it risks mechanical stress-induced solder joint fracture due to CTE mismatch, and floating poses no electrical risk. The pad serves only as mechanical anchor and thermal relief-not a functional node.

How does the IOFF feature differ from standard high-impedance output disable?

Standard 3-state disable only isolates the output driver; IOFF additionally disconnects input circuitry from VCC/GND, eliminating leakage paths through input clamps. This prevents back-current flow when downstream circuits remain powered-essential for battery-backed real-time clocks or always-on wake-up logic in portable devices.

Is the X2-DFN1409-6 package RoHS and halogen-free compliant?

Yes. The 74LVC1G125FX4-7 meets EU RoHS Directive 2011/65/EU and is halogen- and antimony-free ("Green"), containing <900ppm bromine, <900ppm chlorine (<1500ppm total Br+Cl), and <1000ppm antimony compounds-verified per Diodes Inc. material declarations and certified test reports.

74LVC1G125FX4-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
74LVC
Package/Case:
6-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
1
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
32mA, 32mA
Voltage - Supply:
1.65V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1409-6

74LVC1G125FX4-7 FAQ

1.How can I place an order for 74LVC1G125FX4-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC1G125FX4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC1G125FX4-7 reliable?

The price and inventory of 74LVC1G125FX4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC1G125FX4-7 is usually 5 days.

3.What payment methods are accepted for 74LVC1G125FX4-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC1G125FX4-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC1G125FX4-7?

74LVC1G125FX4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC1G125FX4-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC1G125FX4-7?

For technical support, including 74LVC1G125FX4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC1G125FX4-7 requirements.

6.How does Aetrix verify that 74LVC1G125FX4-7 is sourced from the original manufacturer or authorized distributors?

All 74LVC1G125FX4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC1G125FX4-7 meets industry standards.

7.What is the process for return or replacement of 74LVC1G125FX4-7?

All 74LVC1G125FX4-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC1G125FX4-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC1G125FX4-7 part is unused and in its original packaging.

Return procedure for 74LVC1G125FX4-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVC1G125FX4-7 Tags

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