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NXP Semiconductors 74LVC1G125GW/DG,12
- Part No.:
- 74LVC1G125GW/DG,12
- Manufacturer:
- NXP Semiconductors
- Package:
- 5-TSSOP, SC-70-5, SOT-353
- Datasheet:
-
74LVC1G125GW/DG,12.pdf
- Description:
- IC BUFF NON-INVERT 5.5V 5TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,926
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Product details
Overview
74LVC1G125GW/DG,12 from NXP Semiconductors is a single non-inverting 3-state bus buffer/line driver in TSSOP5 (SOT353-1) package, operating from 1.65 V to 5.5 V supply, delivering ±24 mA output drive at 3.0 V, and supporting mixed-voltage interfacing between 3.3 V and 5 V logic systems in industrial control I/O expansion.
For engineers reviewing the 74LVC1G125GW/DG,12 datasheet, 74LVC1G125GW/DG,12 pinout, 74LVC1G125GW/DG,12 application, or 74LVC1G125GW/DG,12 equivalent, key selection criteria include IOFF-enabled partial power-down protection, 5-pin TSSOP thermal performance up to +125 °C, JEDEC-compliant voltage thresholds, and sub-5 ns propagation delay at 3.3 V.
Technical Context
This device implements a single-channel CMOS buffer with active-low 3-state enable (OE), where HIGH on OE forces Y into high-impedance OFF-state. Its IOFF circuitry actively disables outputs during VCC = 0 V, blocking backflow current in hot-swap or partial-power-down systems.
Input tolerance up to 5.5 V enables direct interface with TTL and higher-voltage logic without level-shifting. Static characteristics are fully specified across −40 °C to +125 °C, with VIH/VIL thresholds varying by VCC range per JESD8 standards, ensuring robust noise immunity in noisy industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.65 V to 5.5 V - supports single-rail operation across legacy 3.3 V and modern low-voltage microcontrollers while tolerating 5 V inputs. |
| Output Drive Strength | ±24 mA at VCC = 3.0 V - sufficient to drive 50 Ω transmission lines or multiple LVC/LVT inputs without external buffering. |
| Propagation Delay | 0.5 ns (min) to 6.0 ns (max) at VCC = 3.0–3.6 V - enables timing-critical signal routing in high-speed digital interfaces. |
| IOFF Leakage Current | ±10 µA max at VCC = 0 V - prevents damaging backflow when powered down in live-bus applications like PCIe slot muxing. |
| Operating Temperature | −40 °C to +125 °C - qualified for under-hood automotive modules, industrial PLCs, and outdoor telecom equipment. |
| ESD Protection | HBM > 2000 V, MM > 200 V - meets IEC 61000-4-2 Level 2 requirements for board-level ESD robustness. |
| Input Voltage Range | 0 V to 5.5 V - allows direct connection to 5 V sensors, legacy peripherals, or open-drain pull-ups without clamping diodes. |
Pinout & Package
TSSOP5 (SOT353-1) package: plastic thin shrink small outline, 5-lead, body width 1.25 mm, 0.65 mm pitch, exposed pad optional, rated for 250 mW total power dissipation at +87.5 °C ambient before linear derating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OE) | Output Enable Input | Active-low control: HIGH forces Y into high-impedance state; compatible with standard GPIO or dedicated enable signals. |
| 2 (A) | Data Input | Non-inverting input accepting 0–5.5 V; internally terminated with CMOS gate structure for low static current. |
| 3 (GND) | Ground Reference | 0 V return path for all internal logic and output drivers; must be low-inductance connection to minimize ground bounce. |
| 4 (Y) | Data Output | 3-state buffered output with rail-to-rail swing; capable of sourcing/sinking ±24 mA at 3.0 V with <0.8 V VOL. |
| 5 (VCC) | Supply Voltage | Primary power rail; decoupling capacitor (100 nF ceramic) required within 5 mm for stable high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Wide Supply Range | 1.65–5.5 V operation eliminates need for separate voltage translators in multi-rail systems. |
| IOFF Power-Down Protection | Prevents destructive current flow when VCC = 0 V, enabling safe insertion/removal in live backplanes. |
| 5 V-Tolerant Inputs | Accepts 5 V logic levels regardless of VCC setting - simplifies interface to legacy peripherals without external resistors. |
| JEDEC Compliance | Fully conforms to JESD8-7 (1.65–1.95 V), JESD8-5 (2.3–2.7 V), and JESD8-B/JESD36 (2.7–3.6 V) standards. |
| High Noise Immunity | VIL/VIL thresholds defined across full VCC range ensure reliable operation in electrically noisy factory-floor environments. |
Applications
| Industrial I/O Expansion | Low-Power Sensor Interface |
|---|---|
Use Scenario: Adding isolated digital inputs/outputs to a PLC mainboard using shared data bus architecture. IC Role / Device Role / Timing Role: Bidirectional bus buffer isolating MCU GPIO from field-side transceivers and relays. Use Value: Enables hot-swappable I/O modules via IOFF protection and 5 V-tolerant inputs for direct 24 V sensor signal conditioning. | Use Scenario: Interfacing ultra-low-power environmental sensors (e.g., I²C temperature/humidity) to a battery-powered edge node MCU. IC Role / Device Role / Timing Role: Level-shifting and bus isolation buffer between 1.8 V sensor domain and 3.3 V host processor. Use Value: Eliminates external level shifters while maintaining <10 µA ICC at 1.65 V, extending battery life in wireless sensor nodes. |
| Embedded Display Control | Automotive Body Controller |
Use Scenario: Driving parallel RGB data lines from an SoC GPU to a small-format TFT panel with variable backlight dimming. IC Role / Device Role / Timing Role: Non-inverting line driver with 3-state control synchronized to display blanking intervals. Use Value: Sub-5 ns tpd ensures pixel clock alignment; ±24 mA drive sustains signal integrity over 10 cm flex PCB traces. | Use Scenario: Signal conditioning for door lock actuator feedback lines in a centralized body control module. IC Role / Device Role / Timing Role: Isolation buffer between LIN transceiver and MCU GPIO, handling wake-up pulse detection. Use Value: −40 °C to +125 °C rating and HBM > 2000 V ESD withstand support under-hood deployment without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G125DBVR | SOT-23-5 package (larger footprint, 2.92 × 1.62 mm vs TSSOP5's 2.25 × 1.35 mm); identical electrical specs and IOFF behavior. | Better thermal mass for high-duty-cycle driving; less suitable for ultra-dense PCB layouts. | Select when board space permits and thermal margin is prioritized over miniaturization. |
| 74AUP1G125GW,125 | Lower ICC (0.9 µA typical vs 10 µA max), wider VCC range (0.8–3.6 V), but no 5 V input tolerance and reduced drive (±4 mA at 3.0 V). | Optimized for sub-1 V logic domains and battery-sensitive designs; incompatible with 5 V peripherals. | Select only for ultra-low-power, single-supply 1.8/2.5 V systems where 5 V tolerance is unnecessary. |
Compared with SN74LVC1G125DBVR and 74AUP1G125GW,125, the 74LVC1G125GW/DG,12 uniquely balances compact TSSOP5 packaging, full 5 V input compatibility, and industrial-grade temperature/ESD performance - making it optimal for space-constrained, mixed-voltage embedded control.
Availability
74LVC1G125GW/DG,12 is available at Aetrix Electronics and suitable for industrial I/O expansion, low-power sensor interface, embedded display control, and automotive body controller applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74LVC1G125GW/DG,12 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in mixed-signal IC design and automotive-grade reliability.
The 74LVC1G125GW/DG,12 belongs to NXP's LVC logic family, engineered for low-voltage, high-speed, mixed-signal interfacing in space-constrained industrial and automotive control systems where robustness and interoperability are critical.
FAQ
What is the maximum allowable input voltage for the 74LVC1G125GW/DG,12 when VCC = 1.8 V?
The 74LVC1G125GW/DG,12 accepts input voltages up to 5.5 V regardless of VCC setting. When VCC = 1.8 V, VI may safely reach 5.5 V due to built-in input clamping and 5 V-tolerant gate oxide design - enabling direct interface with 5 V sensors or legacy peripherals without external level shifters. This capability is explicitly confirmed in Table 5 (VI max = +6.5 V) and Section 1.
Does the 74LVC1G125GW/DG,12 support hot-plug operation in backplane systems?
Yes, the 74LVC1G125GW/DG,12 supports hot-plug operation via its IOFF circuitry. When VCC = 0 V, the IOFF feature disables outputs and limits power-off leakage current to ±10 µA max (Table 7), preventing damaging backflow current through the device during live insertion/removal. This behavior is validated in Section 1 and Table 7 under IOFF parameter.
What is the propagation delay of the 74LVC1G125GW/DG,12 at 3.3 V supply and 25 °C ambient?
At VCC = 3.3 V and Tamb = 25 °C, the 74LVC1G125GW/DG,12 exhibits a typical propagation delay (tpd) of 2.1 ns with a maximum of 4.5 ns over −40 °C to +85 °C, and 6.0 ns over −40 °C to +125 °C (Table 8). These values are measured A-to-Y under standard test conditions with 30 pF load and 500 Ω termination.
Can the 74LVC1G125GW/DG,12 be used to replace a 74HC1G125 in an existing design?
Yes, the 74LVC1G125GW/DG,12 can directly replace 74HC1G125 in most cases due to identical pinout (TSSOP5), function table, and 3-state behavior. However, note that LVC has lower VCC min (1.65 V vs 2.0 V), higher speed, and superior 5 V input tolerance - requiring verification of VCC stability and potential layout adjustments for improved noise immunity in high-frequency operation.
What package variant does the 74LVC1G125GW/DG,12 use and what are its key mechanical dimensions?
The 74LVC1G125GW/DG,12 uses the TSSOP5 package (SOT353-1): 5-lead thin shrink small outline with body dimensions 2.25 mm × 1.35 mm × 1.1 mm, 0.65 mm lead pitch, and 1.25 mm body width. Pin 1 indicator is located on the lower left corner below the "VM" marking code, per Figure 4 and Table 2.
74LVC1G125GW/DG,12 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74LVC
- Package/Case:
- 5-TSSOP, SC-70-5, SOT-353
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-TSSOP
74LVC1G125GW/DG,12 FAQ
1.How can I place an order for 74LVC1G125GW/DG,12 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC1G125GW/DG,12 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC1G125GW/DG,12 reliable?
The price and inventory of 74LVC1G125GW/DG,12 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC1G125GW/DG,12 is usually 5 days.
3.What payment methods are accepted for 74LVC1G125GW/DG,12?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC1G125GW/DG,12 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC1G125GW/DG,12?
74LVC1G125GW/DG,12 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC1G125GW/DG,12 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC1G125GW/DG,12?
For technical support, including 74LVC1G125GW/DG,12 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC1G125GW/DG,12 requirements.
6.How does Aetrix verify that 74LVC1G125GW/DG,12 is sourced from the original manufacturer or authorized distributors?
All 74LVC1G125GW/DG,12 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC1G125GW/DG,12 meets industry standards.
7.What is the process for return or replacement of 74LVC1G125GW/DG,12?
All 74LVC1G125GW/DG,12 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC1G125GW/DG,12, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC1G125GW/DG,12 part is unused and in its original packaging.
Return procedure for 74LVC1G125GW/DG,12:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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