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NXP Semiconductors 74LVC1G125GX125

Part No.:
74LVC1G125GX125
Manufacturer:
NXP Semiconductors
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
-
Datasheet:
Aetrix74LVC1G125GX125.pdf
Description:
IC BUFFER NON-INVERTING
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Inventory:4,979

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Product details

Overview

74LVC1G125GX125 from Nexperia is a single 3-state bus buffer/line driver with Schmitt-trigger inputs, operating from 1.65 V to 5.5 V supply. It enables level translation between 3.3 V and 5 V logic domains, supports partial power-down via IOFF, and delivers ±24 mA output drive at 3.0 V - used in I²C bus isolation, sensor interface signal conditioning, and mixed-voltage microcontroller GPIO expansion.

For engineers reviewing the 74LVC1G125GX125 datasheet, 74LVC1G125GX125 pinout, 74LVC1G125GX125 application, or 74LVC1G125GX125 equivalent, key selection criteria include its X2SON5 (SOT1226-3) 5-terminal thermal-enhanced package, 0.8 × 0.8 × 0.32 mm footprint, IOFF-enabled power-down leakage < ±2 μA, and propagation delay as low as 0.5 ns at 5 V.

Technical Context

This device implements a non-inverting buffer with active-low 3-state enable (OE), where output Y follows input A when OE = LOW and enters high-impedance state when OE = HIGH. Schmitt-trigger inputs tolerate slow-rising signals up to 10 ns/V transition rate, enabling robust operation with noisy or RC-filtered sources.

The IOFF circuitry actively disables both output and input paths when VCC = 0 V, blocking backflow current and supporting hot-swap and partial-power-down system architectures. Input voltage tolerance to 5.5 V allows direct interfacing with 5 V TTL outputs even when powered at 1.65 V.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage1.65 V to 5.5 V - supports single-rail operation across LVC logic families and mixed-voltage board design.
IOFF Leakage< ±2 μA at VCC = 0 V - prevents damaging back-current during power sequencing or hot-plug events.
Output Drive±24 mA at VCC = 3.0 V - sufficient to drive 50 pF loads with <6 ns propagation delay in 3.3 V systems.
Propagation Delay0.5 ns (min) to 5.5 ns (max) at VCC = 4.5–5.5 V - enables use in high-speed control signaling up to ~100 MHz toggle rates.
Input ThresholdsVIL ≤ 0.3×VCC, VIH ≥ 0.7×VCC - ensures noise margins >0.4 V at 3.3 V and compatibility with standard CMOS/TTL logic levels.
ESD RatingHBM >2000 V, CDM >1000 V - meets industrial-grade robustness requirements without external protection.
Operating Temp-40 °C to +125 °C - qualified for under-hood automotive, industrial PLC, and extended-temperature embedded applications.

Pinout & Package

X2SON5 (SOT1226-3) package: plastic thermal-enhanced extremely thin small outline, no leads, 5 terminals, body size 0.8 × 0.8 × 0.32 mm, side-wettable flanks not present, pin 1 index located at lower-left corner below marking code.

Pin/TerminalCircuit RoleDesign Meaning
1 (OE)Output Enable inputActive-low control: drives Y to high-Z when HIGH; enables buffer pass-through when LOW.
2 (VCC)Positive supplyPrimary power rail; powers internal logic and output stage; IOFF activates when VCC = 0 V.
3 (A)Data inputNon-inverting input with Schmitt-trigger hysteresis; accepts 0–5.5 V regardless of VCC level.
4 (Y)Data output3-state buffered output; drives HIGH/LOW or floats; supports bus sharing and load isolation.
5 (GND)Ground reference0 V return path for all currents; required for proper IOFF and ESD clamp operation.

Key Features

FeatureDesign Value
Wide VCC range1.65–5.5 V operation enables drop-in replacement across legacy and modern logic families without redesign.
Overvoltage-tolerant inputsInputs withstand 5.5 V regardless of VCC - eliminates level shifters when interfacing 5 V peripherals to 1.8/2.5/3.3 V controllers.
IOFF partial power-downBlocks I/O current flow when unpowered - critical for PCIe add-in cards, modular backplanes, and hot-swap subsystems.
Schmitt-trigger inputsInput hysteresis rejects noise on slow edges - allows direct connection to mechanical switches, potentiometers, or long PCB traces.
Thermal-enhanced X2SON50.8 × 0.8 mm footprint with improved thermal resistance vs. TSSOP5 - supports higher ambient temps in space-constrained designs.

Applications

Industrial Sensor InterfaceI²C Bus Isolation

Use Scenario: Connecting analog sensor outputs (e.g., thermistor divider, RTD bridge) to a 3.3 V MCU ADC input while rejecting EMI from nearby motor drivers.

IC Role / Device Role / Timing Role: Signal conditioning buffer with noise-immune Schmitt inputs and 3-state isolation during MCU sleep mode.

Use Value: Eliminates external RC filtering and pull-up resistors; IOFF prevents sensor bias current leakage during MCU deep-sleep states.

Use Scenario: Isolating multiple I²C slave devices on shared SDA/SCL lines to prevent address conflicts or bus contention during firmware updates.

IC Role / Device Role / Timing Role: Bidirectional bus buffer controlled by MCU GPIO to gate SDA/SCL segments during reconfiguration.

Use Value: Enables dynamic I²C topology switching without hardware changes; ±24 mA drive sustains rise time specs across 100 cm PCB traces.

Microcontroller GPIO ExpansionMixed-Voltage Logic Translation

Use Scenario: Extending limited GPIO count of an ARM Cortex-M0+ MCU to drive 8-bit parallel LCD data bus and control lines.

IC Role / Device Role / Timing Role: Single-bit buffer per line, with OE tied to dedicated chip-select GPIO for synchronized enable/disable.

Use Value: Provides clean 3.3 V logic levels to LCD while maintaining <6 ns propagation delay - avoids timing violations at 10 MHz pixel clock rates.

Use Scenario: Interfacing a 5 V UART transceiver to a 1.8 V FPGA serial peripheral with strict voltage domain separation.

IC Role / Device Role / Timing Role: Unidirectional level translator using VCC = 1.8 V and 5 V-tolerant inputs to accept TXD from transceiver.

Use Value: Removes need for discrete MOSFET translators or dedicated level-shifter ICs; supports 10 Mbps UART with guaranteed VIH/VIL margins.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
74LVC1G125GVSC-74A (SOT753) 5-lead package; 3.1 × 2.7 mm body; no thermal enhancement; 3.8 mW/K derating above 85 °C.Less suitable for high-density layouts or >85 °C ambient; requires larger PCB area and lacks side-wettable flanks for automated optical inspection.Select GV only when legacy SC-74A footprint compatibility is mandatory and thermal budget permits.
74LVC1G125GWTSSOP5 (SOT353-1) package; 2.2 × 1.3 mm body; 1.25 mm width; 3.3 mW/K derating above 74 °C; exposed pad absent.Better hand-solderability than X2SON5 but higher thermal resistance; not recommended for >100 mW continuous dissipation.Choose GW for prototyping or low-volume assembly where rework accessibility outweighs miniaturization needs.

Compared with 74LVC1G125GV and 74LVC1G125GW, the 74LVC1G125GX125 offers the smallest footprint (0.64 mm²), lowest thermal resistance, and highest reliability in automated SMT lines due to its X2SON5 geometry - making it optimal for wearables, medical sensors, and compact industrial modules.

Availability

74LVC1G125GX125 is available at Aetrix Electronics and suitable for industrial sensor interface, I²C bus isolation, and microcontroller GPIO expansion requiring stable component supply across automotive, medical, and industrial OEM programs.

Supply support for 74LVC1G125GX125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, discrete, and MOSFET solutions for automotive, industrial, and consumer markets.

The 74LVC1G125GX125 belongs to Nexperia's LVC logic family, engineered for ultra-low power consumption, wide supply flexibility, and robust operation in mixed-voltage embedded systems - targeting space-constrained, thermally demanding applications.

FAQ

What is the maximum input voltage rating for 74LVC1G125GX125 when VCC = 1.65 V?

The 74LVC1G125GX125 supports overvoltage-tolerant inputs up to 5.5 V regardless of VCC level. When powered at 1.65 V, inputs may safely accept 0–5.5 V signals - enabling direct interfacing with 5 V microcontrollers or sensors without external level shifting. This capability is confirmed in Table 3 (Pin description) and Section 2 (Features and benefits) of the official Nexperia datasheet Rev. 17.1.

Does 74LVC1G125GX125 support hot-swap operation, and how is it implemented?

Yes, 74LVC1G125GX125 supports hot-swap operation via its IOFF circuitry. When VCC = 0 V, the IOFF feature disables both input and output paths, limiting power-off leakage current to < ±2 μA (Table 7). This prevents damaging backflow current through the device during live insertion/removal - a requirement verified in Section 1 (General description) and Table 5 (Limiting values) of the Nexperia datasheet.

What is the propagation delay of 74LVC1G125GX125 at VCC = 3.3 V and 25 °C?

At VCC = 3.3 V and Tamb = 25 °C, the typical propagation delay (tpd) of 74LVC1G125GX125 is 2.1 ns, with a maximum of 4.5 ns over -40 °C to +85 °C (Table 8). These values apply to the A-to-Y path and are measured with 50 pF load and ≤2.5 ns input rise/fall times - consistent with high-speed digital control signaling in real-time embedded systems.

Can 74LVC1G125GX125 be used as a level shifter between 1.8 V and 5 V logic domains?

Yes, 74LVC1G125GX125 functions as a unidirectional level shifter: when VCC = 1.8 V, its 5.5 V-tolerant inputs accept 5 V signals, and its output swings between 0 V and 1.8 V. The device does not translate in reverse (output-to-input), and bidirectional translation requires two units. This behavior is explicitly documented in Section 1 and validated in Table 6 (Recommended operating conditions).

What is the thermal resistance (RθJA) of the X2SON5 package used by 74LVC1G125GX125?

The X2SON5 (SOT1226-3) package of 74LVC1G125GX125 has a total power dissipation derating factor of 3.0 mW/K above 67 °C (Table 5). While absolute RθJA is not published, this derating implies an effective junction-to-ambient thermal resistance of approximately 333 K/W - significantly lower than TSSOP5 (303 K/W) and SC-74A (263 K/W) variants, confirming its thermal-enhanced design for compact, high-density layouts.

74LVC1G125GX125 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74LVC
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Logic Type:
-
Number of Elements:
-
Number of Bits per Element:
-
Input Type:
-
Output Type:
-
Current - Output High, Low:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

74LVC1G125GX125 FAQ

1.How can I place an order for 74LVC1G125GX125 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC1G125GX125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 74LVC1G125GX125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC1G125GX125 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC1G125GX125?

For technical support, including 74LVC1G125GX125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC1G125GX125 requirements.

6.How does Aetrix verify that 74LVC1G125GX125 is sourced from the original manufacturer or authorized distributors?

All 74LVC1G125GX125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC1G125GX125 meets industry standards.

7.What is the process for return or replacement of 74LVC1G125GX125?

All 74LVC1G125GX125 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC1G125GX125, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC1G125GX125 part is unused and in its original packaging.

Return procedure for 74LVC1G125GX125:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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