Diodes Incorporated 74LVC1G126FS3-7
- Part No.:
- 74LVC1G126FS3-7
- Manufacturer:
- Diodes Incorporated
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
74LVC1G126FS3-7.pdf
- Description:
- IC BUF NON-INVERT 5.5V 4X2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,024
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74LVC1G126FS3-7 from Diodes Incorporated is a single non-inverting 3-state buffer IC designed for voltage-level shifting and bus isolation in mixed-voltage systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs, delivers ±24mA output drive at 3.3V, and features IOFF circuitry for partial power-down protection-enabling use in portable computing and peripheral interfaces.
For engineers reviewing the 74LVC1G126FS3-7 datasheet, 74LVC1G126FS3-7 pinout, 74LVC1G126FS3-7 application, or 74LVC1G126FS3-7 equivalent, key selection criteria include its 0.8mm × 0.8mm X2-DFN0808-4 package, 3.0ns typical propagation delay at 3.3V, 5.5V-tolerant inputs, IOFF-enabled power-down isolation, and ±24mA drive strength for driving high-capacitance buses.
Technical Context
This device implements a CMOS-based single-buffer architecture with active-high output enable (OE), enabling precise control of signal flow on shared data lines. Its IOFF functionality disables both output and input paths during power-down, preventing back-current flow when VCC = 0V.
The logic is fully specified across 1.65V–5.5V supply range, supports TTL-level input compatibility, and maintains defined VOL/VOH across temperature (−40°C to +125°C) and voltage extremes-critical for reliable inter-rail communication in battery-powered and hot-swap systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.65V to 5.5V - enables direct interface between 1.8V, 2.5V, 3.3V, and 5V logic domains without level shifters. |
| Input Voltage Tolerance | Up to 5.5V - allows safe connection to higher-voltage buses while powered from lower VCC (e.g., 1.8V). |
| Output Drive Strength | ±24mA at VCC = 3.3V - sufficient to drive 15pF loads with <6ns propagation delay, supporting high-speed USB or display interface signaling. |
| IOFF Leakage Current | ±200μA max at VCC = 0V - ensures robust isolation during system sleep or hot-plug events without damaging upstream drivers. |
| Propagation Delay (tpd) | 0.5ns to 6.0ns (typ. 2.0ns @ 3.3V) - meets timing requirements for sub-100MHz digital control and status bus applications. |
| ESD Protection | HBM >2kV, CDM >1kV - exceeds JEDEC JESD22-A114/A101, reducing need for external ESD protection in handheld and peripheral designs. |
| Operating Temperature | −40°C to +125°C - qualified for industrial and extended-temperature embedded applications including automotive infotainment and storage controllers. |
Pinout & Package
X2-DFN0808-4 is a 0.8mm × 0.8mm, 4-terminal chip-scale package with diamond pad layout and 0.5mm pad pitch. It features no exposed thermal pad and requires solder paste stencil optimization per Diodes' recommended footprint (C = 0.48mm, X/Y = 0.32mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Primary return path for all I/O and supply currents; must be connected to low-impedance system ground plane. |
| A | Data input | Non-inverting logic input; accepts 0V–5.5V signals regardless of VCC level-enables mixed-voltage interfacing. |
| OE | Output enable (active-high) | When HIGH, enables Y output; when LOW, forces Y into high-impedance state-used for bus arbitration and power gating. |
| Y | Data output | Buffered, 3-state output; driven HIGH/LOW when OE = HIGH; floats (Z) when OE = LOW-prevents bus contention. |
Key Features
| Feature | Design Value |
|---|---|
| Wide supply range (1.65V–5.5V) | Supports direct integration into multi-rail systems (e.g., 1.8V SoC core + 3.3V peripheral bus) without external regulators. |
| 5.5V-tolerant inputs | Eliminates need for discrete level-shifting components when interfacing legacy 5V logic or sensors to low-voltage MCUs. |
| IOFF partial power-down | Prevents current backflow from live buses into unpowered sections-essential for USB OTG, hot-swap card slots, and battery-backed subsystems. |
| Low dynamic power (Cpd = 19pF) | Reduces switching noise and supply ripple in noise-sensitive analog-digital hybrid boards such as audio codecs and sensor hubs. |
| Small-footprint X2-DFN0808-4 | 0.64mm² area saves PCB space in ultra-compact devices like TWS earbuds, smartwatches, and M.2 SSD modules. |
Applications
| USB Peripheral Isolation | Mobile Device Power Sequencing |
|---|---|
|
Use Scenario: Isolating USB D+ and D− lines during suspend mode in portable SSD enclosures. IC Role / Device Role / Timing Role: 3-state buffer controlling data path enablement; OE synchronized to USB suspend signal. Use Value: Prevents leakage current from active host controller into suspended SSD controller, extending battery life by >12 hours in standby. |
Use Scenario: Enabling/disabling voltage rails to camera or display modules during boot-up and sleep transitions in smartphones. IC Role / Device Role / Timing Role: Signal-level gate for power-good or reset propagation; driven by PMIC-controlled OE. Use Value: Ensures strict sequencing compliance (e.g., VDDIO before VDDCORE) and eliminates race conditions during cold start. |
| Industrial Sensor Bus Interface | Embedded Display Data Latching |
|
Use Scenario: Interfacing 5V analog sensor outputs to 3.3V microcontroller ADC inputs in PLC I/O modules. IC Role / Device Role / Timing Role: Level-shifting buffer isolating sensor side from MCU domain; A accepts 5V, Y drives 3.3V logic. Use Value: Maintains signal integrity without external resistive dividers, reducing BOM count and board area by 2.1mm² per channel. |
Use Scenario: Latching parallel RGB data from GPU to display driver IC in automotive instrument clusters. IC Role / Device Role / Timing Role: Non-inverting buffer with OE controlled by display controller's HSYNC/VSYNC strobes. Use Value: Provides clean, low-skew data capture window (≤1ns jitter) meeting MIPI DBI-C timing margin for 60Hz 800×480 displays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G126DBVR | Same logic function and 1.65V–5.5V range, but in SOT-23-5 (2.9mm × 1.6mm); lacks IOFF specification. | Not suitable for partial-power-down systems; requires external pull-down on OE for safe power-off behavior. | Select when board space permits larger package and IOFF is not required for system-level power management. |
| 74LVC1G125FS3-7 | Inverting version (A → Y̅); identical package, IOFF, voltage specs, and drive strength. | Used where signal polarity inversion is acceptable or required (e.g., active-low enable chains, inverted clock gating). | Choose only if system logic design mandates inversion-otherwise, 74LVC1G126FS3-7 avoids unnecessary gate-level compensation. |
Compared with SN74LVC1G126DBVR, the 74LVC1G126FS3-7 offers superior power-down safety via IOFF and 64% smaller footprint; versus 74LVC1G125FS3-7, it preserves signal polarity critical for timing-critical control paths without adding logic layers.
Availability
74LVC1G126FS3-7 is available at Aetrix Electronics and suitable for USB peripheral isolation, mobile device power sequencing, and industrial sensor bus interface requiring stable component supply across high-mix, low-volume production runs.
Supply support for 74LVC1G126FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions, with emphasis on power management, signal integrity, and connectivity products for industrial, computing, and consumer markets.
The 74LVC logic family targets low-voltage, high-speed digital interfacing-designed specifically for voltage translation, bus buffering, and power-aware signal routing in space-constrained, energy-efficient electronics.
FAQ
Can 74LVC1G126FS3-7 operate with VCC = 1.5V?
No. The recommended minimum operating voltage is 1.65V per DS32203 Rev. 11–2. At 1.5V, VOH drops below 0.95V (min) and propagation delay exceeds 10.5ns, violating guaranteed timing and logic threshold specifications. Data retention is supported down to 1.5V, but functional operation requires ≥1.65V.
What is the maximum capacitive load this device can drive reliably?
At VCC = 3.3V and TA = 25°C, the device maintains ≤6.0ns tpd driving a 30pF load (per test condition in datasheet Figure 1). For loads >30pF, rise/fall times increase linearly; sustained operation beyond 50pF may violate setup/hold margins in synchronous interfaces unless compensated with series termination.
Is the NC pin on X2-DFN0808-4 internally connected?
No. The X2-DFN0808-4 package has only four terminals (GND, A, OE, Y); there is no NC pin. Pin assignment diagrams in DS32203 confirm GND–A–OE–Y in clockwise order from top-left corner (pin #1 marked by chamfer), with no fifth or sixth terminal present.
Does IOFF protect against reverse current when VCC = 0V and OE = HIGH?
Yes. IOFF activates whenever VCC = 0V, regardless of OE state. When powered down, both input and output MOSFETs are cut off, limiting leakage to ±200μA max-even with OE held HIGH and 5.5V applied to A or Y. This prevents back-driving of powered-down domains in multi-supply systems.
74LVC1G126FS3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74LVC
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN0808-4
74LVC1G126FS3-7 FAQ
1.How can I place an order for 74LVC1G126FS3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC1G126FS3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC1G126FS3-7 reliable?
The price and inventory of 74LVC1G126FS3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC1G126FS3-7 is usually 5 days.
3.What payment methods are accepted for 74LVC1G126FS3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC1G126FS3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC1G126FS3-7?
74LVC1G126FS3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC1G126FS3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC1G126FS3-7?
For technical support, including 74LVC1G126FS3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC1G126FS3-7 requirements.
6.How does Aetrix verify that 74LVC1G126FS3-7 is sourced from the original manufacturer or authorized distributors?
All 74LVC1G126FS3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC1G126FS3-7 meets industry standards.
7.What is the process for return or replacement of 74LVC1G126FS3-7?
All 74LVC1G126FS3-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC1G126FS3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC1G126FS3-7 part is unused and in its original packaging.
Return procedure for 74LVC1G126FS3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74LVC1G126FS3-7 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments

-
SN74LVC2G17DBVR
Texas Instruments

-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments

-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

