Diodes Incorporated 74LVC1G14FS3-7

Overview

74LVC1G14FS3-7 from Diodes Incorporated is a single-channel Schmitt-trigger inverter IC in a 4-pin X2-DFN0808-4 package, operating from 1.65V to 5.5V supply, with 5.5V-tolerant inputs, ±24mA output drive at 3.3V, and IOFF partial-power-down protection. It enables clean signal conditioning in mixed-voltage logic interfaces, such as USB-C CC line detection or I²C bus level translation.

For engineers reviewing the 74LVC1G14FS3-7 datasheet, 74LVC1G14FS3-7 pinout, 74LVC1G14FS3-7 application, or 74LVC1G14FS3-7 equivalent, key selection criteria include hysteresis width (0.35–1.20V), propagation delay (0.7–6.5ns), thermal resistance (400°C/W), input threshold symmetry, and DFN0808 footprint compatibility for space-constrained PCBs.

Technical Context

This device implements a positive Boolean inverter function (Y = A̅) with Schmitt-trigger input thresholds-VT+ ranging from 0.70V (1.65V VCC) to 3.33V (5.5V VCC), and VT− from 0.30V to 2.35V-yielding hysteresis (ΔVT) of 0.30–1.20V depending on supply voltage. The input stage supports 5.5V tolerance independent of VCC, enabling robust interfacing between 1.8V/2.5V/3.3V logic domains and 5V peripherals.

IOFF circuitry actively disables output leakage (<±10µA at TA ≤85°C) during power-down, preventing back-current flow when VCC = 0V while inputs remain asserted. Output push-pull structure delivers rail-to-rail switching with VOL ≤0.55V at 24mA sink and VOH ≥2.0V at 24mA source under 3V operation.

Key Specifications

Pinout & Package

X2-DFN0808-4 is a 0.9mm × 0.9mm × 0.35mm halogen-free, lead-free chip-scale package with diamond-layout 0.5mm pad pitch and exposed thermal pad (not electrically connected). Its ultra-compact footprint suits wearables, IoT sensors, and portable medical devices where board area is constrained.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger inverter applications.

Compared with SN74LVC1G14DBVR and 74LVC1G14GW,125, the 74LVC1G14FS3-7 delivers the smallest footprint (0.81mm²), lowest thermal resistance among DFN variants (400°C/W), and highest junction temperature rating (150°C), making it optimal for miniaturized, thermally aggressive, or automotive-adjacent applications.

Availability

74LVC1G14FS3-7 is available at Aetrix Electronics and suitable for USB-C interface design, industrial sensor signal conditioning, and power sequencing control requiring stable component supply across high-mix, low-volume production runs.

Supply support for 74LVC1G14FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions, with emphasis on power management, signal integrity, and protection devices for industrial, computing, and consumer markets.

The 74LVC logic family targets low-voltage, high-speed digital interfacing applications-designed specifically for robust operation across wide supply ranges and mixed-voltage system architectures.

FAQ

What is the minimum recommended trace width for the thermal pad on the X2-DFN0808-4 package?

The thermal pad (exposed copper area beneath the die) requires a minimum 0.25mm trace width to ensure adequate solder wetting and thermal conduction. Diodes' suggested pad layout specifies a 0.30mm × 0.30mm central thermal pad with four 0.106mm solder dams-using narrower traces risks incomplete reflow and reduced thermal performance.

Can 74LVC1G14FS3-7 drive a 50pF capacitive load at 10MHz without signal degradation?

Yes. With Cpd = 22pF and tpd ≤7.0ns at 3.3V/50pF, the device maintains <10% rise/fall time distortion at 10MHz. Measured power dissipation remains <1.5mW under those conditions, well within its 100mW absolute max rating-no external termination needed.

Does the NC pin (Pin 3) require any PCB layout treatment beyond leaving it unconnected?

Pin 3 must remain unconnected and should not be routed, plated, or soldered. Diodes recommends maintaining ≥0.1mm clearance from adjacent traces and avoiding copper pour over the pad. Connecting it-even to GND-may induce parasitic coupling that degrades hysteresis stability at high frequencies.

How does IOFF behavior change when VCC = 0V but input A is held at 3.3V?

With VCC = 0V and A = 3.3V, IOFF activates automatically: output Y enters high-impedance state with leakage ≤±10µA (TA ≤85°C), preventing reverse current flow into the powered-down VCC rail. This protects upstream regulators and avoids unintended biasing of other logic gates sharing the same ground.