Diodes Incorporated 74LVC1G14FX4-7

Overview

74LVC1G14FX4-7 from Diodes Incorporated is a single-channel Schmitt-trigger inverter IC in a 6-pin X2-DFN1409-6 chip-scale package, operating from 1.65V to 5.5V supply, featuring 5.5V-tolerant inputs, ±24mA output drive at 3.3V, IOFF partial power-down protection, and hysteresis of 0.30–1.40V depending on VCC - used for noise-immune signal conditioning in mixed-voltage I/O interfaces.

For engineers reviewing the 74LVC1G14FX4-7 datasheet, 74LVC1G14FX4-7 pinout, 74LVC1G14FX4-7 application, or 74LVC1G14FX4-7 equivalent, key selection criteria include input hysteresis width, IOFF leakage (<±200 µA at –40°C to +125°C), propagation delay (0.7–14.0 ns), thermal resistance (θJA = 470 °C/W), and 0.5 mm pad pitch compatibility with high-density PCB layouts.

Technical Context

This device implements a positive-logic inverting function (Y = A̅) with Schmitt-trigger input thresholds (VT+ = 0.70–3.33V, VT− = 0.30–2.35V) enabling robust noise rejection in slow or noisy digital signals. Its IOFF circuit actively disables outputs during power-down, preventing back-current flow when VCC = 0V while inputs remain at 5.5V.

The logic core uses CMOS technology with rail-to-rail output swing, 5.5V input tolerance independent of VCC, and guaranteed operation across –40°C to +125°C ambient. Propagation delay varies with load capacitance (15/30/50 pF) and supply voltage, ranging from 0.7 ns (VCC = 5V, CL = 15 pF) to 14.0 ns (VCC = 1.8V, CL = 50 pF, TA = +125°C).

Key Specifications

Pinout & Package

X2-DFN1409-6 is a 1.4 mm × 0.9 mm × 0.4 mm chip-scale package with 0.5 mm pad pitch, exposed thermal pad (non-electrical), and bottom-side pin 1 identifier marking (MG). It features wettable flanks for automated optical solder-joint inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger inverter applications.

Compared with SN74LVC1G14DCKR and 74LVC1G14FS3-7, the 74LVC1G14FX4-7 offers optimal balance: smallest height (0.4 mm), moderate thermal resistance (470 °C/W), and robust 0.5 mm pad pitch - making it ideal for automotive and industrial modules requiring reliability under vibration and thermal cycling.

Availability

74LVC1G14FX4-7 is available at Aetrix Electronics and suitable for industrial sensor interfaces, USB-C power delivery sequencers, IoT edge node reset management, and automotive body control module I/O buffering requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for 74LVC1G14FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs, with design centers in Asia, Europe, and the U.S., serving industrial, computing, communications, and consumer markets.

The 74LVC logic family targets low-voltage, high-speed, mixed-supply digital interface applications - designed specifically for robust signal integrity, wide voltage operation, and seamless integration into power-aware embedded systems.

FAQ

Can 74LVC1G14FX4-7 be used with a 1.5V supply?

No - the absolute minimum recommended operating voltage is 1.65V. At 1.5V, the device may not meet guaranteed switching thresholds or output drive specifications; data retention is supported down to 1.5V, but active logic operation is not characterized below 1.65V per DS35123 Rev. 6-2.

What is the maximum capacitive load this device can drive reliably?

The datasheet specifies timing performance up to 50 pF load capacitance. Driving >50 pF will increase propagation delay nonlinearly and may cause marginal timing in high-speed paths; for >100 pF loads, add a series resistor or buffer stage to maintain signal integrity and avoid excessive current spikes.

Is the exposed thermal pad on X2-DFN1409-6 electrically connected?

No - the thermal pad is non-functional and internally isolated. It must be soldered to a copper pour for thermal dissipation but should not be connected to any signal or power net; Diodes' recommended pad layout specifies a 1.0 mm × 0.5 mm thermal pad with solder mask defined (not solder paste defined).

Does IOFF functionality work when VCC = 0.5V?

Yes - IOFF activates whenever VCC drops below approximately 0.8V (per characterization), ensuring output isolation begins well before full power loss. At VCC = 0.5V, IOFF leakage remains within ±200 µA limit, preventing back-current damage to upstream 5.5V sources during brown-out conditions.