Nexperia USA Inc. 74LVC1G157GM,115

Overview

74LVC1G157GM,115 from Nexperia is a single 2-input CMOS multiplexer in XSON6 (SOT886) package, operating from 1.65 V to 5.5 V supply. It features Schmitt-trigger inputs for noise immunity, IOFF partial power-down protection, and 5.5 V overvoltage-tolerant inputs-enabling level translation between 3.3 V and 5 V logic domains in mixed-voltage I/O interfaces.

For engineers reviewing the 74LVC1G157GM,115 datasheet, 74LVC1G157GM,115 pinout, 74LVC1G157GM,115 application, or 74LVC1G157GM,115 equivalent, this device serves as a compact, low-power signal selector in space-constrained digital systems requiring robust input timing, rail-to-rail voltage compatibility, and guaranteed static operation across -40 °C to +125 °C.

Technical Context

The 74LVC1G157GM,115 implements a single-pole double-throw (SPDT) analog/digital multiplexer with active-high select (S) control and complementary data paths (I0, I1 → Y). Its Schmitt-trigger inputs provide hysteresis of typically 0.3 V at VCC = 3.3 V, enabling reliable switching with slow-rising signals.

IOFF circuitry ensures output isolation when VCC = 0 V, limiting backflow current to ±2 μA at 5.5 V applied to I/O pins. Propagation delay is 2.7 ns typical (VCC = 3.3 V, CL = 50 pF), with tPLH/tPHL symmetry maintained across temperature and supply voltage ranges.

Key Specifications

Pinout & Package

XSON6 (SOT886) package: plastic extremely thin small outline, no leads, 6 terminals, body dimensions 1.0 × 1.45 × 0.5 mm. Exposed die pad not electrically connected; terminal 1 index located on lower-left corner below marking code "YP".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input multiplexer applications.

Compared with SN74LVC1G157DBVR, the 74LVC1G157GM,115 saves 68% board area and improves thermal performance; versus 74LVC1G3157GM,115, it delivers deterministic digital timing and noise-immune inputs essential for control-path reliability.

Availability

74LVC1G157GM,115 is available at Aetrix Electronics and suitable for industrial sensor interfaces, portable device power sequencing, automotive body control modules, and IoT edge node data aggregation requiring stable component supply across extended temperature ranges.

Supply support for 74LVC1G157GM,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, serving automotive, industrial, and consumer markets with JEDEC-compliant products.

The 74LVC1G157 belongs to Nexperia's LVC (Low-Voltage CMOS) logic family, designed specifically for low-power, mixed-voltage digital interfacing in space- and energy-constrained embedded systems.

FAQ

Can the 74LVC1G157GM,115 operate with VCC = 1.65 V while accepting 5 V inputs?

Yes. The device supports overvoltage-tolerant inputs up to 5.5 V regardless of VCC level. At VCC = 1.65 V, VIH is 0.65 × VCC = 1.07 V and VIL is 0.35 × VCC = 0.58 V, ensuring correct logic interpretation of 5 V signals without external clamping or resistors.

Does the IOFF feature protect against backfeed when only VCC is disconnected but GND remains connected?

Yes. IOFF activates when VCC = 0 V, disabling the output driver and limiting I/O pin leakage to ±2 μA maximum-even with GND intact and 5.5 V applied to I0, I1, S, or Y. This meets JEDEC JESD78 Class II latch-up immunity requirements.

What is the maximum capacitive load the 74LVC1G157GM,115 can drive while maintaining specified propagation delay?

The datasheet specifies tpd ≤ 5.0 ns (VCC = 3.3 V) with CL = 50 pF. Driving >50 pF increases delay nonlinearly; for 100 pF, typical tpd rises to ~7.2 ns. For timing-critical paths, keep load ≤50 pF or add series termination to manage reflections.

Is the SOT886 package of the 74LVC1G157GM,115 compatible with standard reflow profiles for lead-free assembly?

Yes. SOT886 (XSON6) is rated for JEDEC J-STD-020D MSL1 handling and withstands peak reflow temperatures up to 260 °C for 30 seconds. Its 0.5 mm height and thermal pad design support uniform heating and void-free solder joint formation under standard Pb-free profiles.