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Nexperia USA Inc. 74LVC1G157GN,132
- Part No.:
- 74LVC1G157GN,132
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 6-XFDFN
- Datasheet:
-
74LVC1G157GN,132.pdf
- Description:
- NEXPERIA 74LVC1G157GN - MULTIPLE
- Quantity:
- Payment:
- Shipping:
Inventory:37,124
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Product details
Overview
74LVC1G157GN,132 from Nexperia is a single 2-channel analog multiplexer/demultiplexer IC in a ultra-small XSON8 (1.5 × 1.0 mm) package, operating from 1.65 V to 5.5 V, with 4.5 Ω typical on-resistance at 3.3 V, and <1 ns propagation delay. It serves as a signal routing switch in portable sensor interfaces and low-voltage I/O expansion circuits.
For engineers reviewing the 74LVC1G157GN,132 datasheet, 74LVC1G157GN,132 pinout, 74LVC1G157GN,132 application, or 74LVC1G157GN,132 equivalent, key selection factors include supply voltage range compatibility, channel on-resistance matching, propagation delay budget, and thermal performance in space-constrained PCB layouts.
Technical Context
This device implements a single-pole double-throw (SPDT) analog switch controlled by one select input (S), with two independent data paths (Y0 and Y1) routed to common output Y. It features break-before-make switching behavior and rail-to-rail analog signal handling across its full supply range.
Designed for low-power mixed-signal systems, it supports bidirectional signal flow, exhibits <0.1 pF off-capacitance, and maintains <0.5 Ω on-resistance flatness over 0–3.3 V signal swing at VCC = 3.3 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.65 V to 5.5 V - Enables direct interface with 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains without level shifters. |
| On-Resistance (RON) | 4.5 Ω typical at VCC = 3.3 V - Minimizes signal attenuation and distortion in precision analog routing paths. |
| Propagation Delay (tPD) | 0.7 ns typical - Supports high-speed digital control of analog signal paths up to ~500 MHz bandwidth. |
| Off-Capacitance (COFF) | 0.09 pF - Reduces crosstalk and loading in high-frequency sensor front-ends and RF-adjacent traces. |
| ESD Protection | HBM ±4 kV - Provides robust handling during board assembly and field-level electrostatic events. |
| Operating Temperature | −40 °C to +125 °C - Qualified for automotive cabin and industrial control environments. |
Pinout & Package
XSON8 (1.5 × 1.0 mm, 0.5 mm pitch) thermally enhanced plastic package with exposed die pad for improved power dissipation in compact layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Y) | Common Output | Bidirectional analog/digital signal path shared between both inputs; connects to downstream ADC or MCU pin. |
| 2 (Y0) | Input/Output Channel 0 | Analog or digital signal source A; passes to Y when S = 0. |
| 3 (GND) | Ground Reference | Return path for analog and digital currents; must be low-impedance and adjacent to exposed pad. |
| 4 (Y1) | Input/Output Channel 1 | Analog or digital signal source B; passes to Y when S = 1. |
| 5 (VCC) | Supply Voltage | Power rail for internal logic and switch biasing; requires local 100 nF decoupling. |
| 6 (S) | Select Control Input | Digital control line determining active channel; compatible with CMOS/LVTTL logic thresholds. |
| 7 (NC) | No Connect | Internally unconnected pin; must remain floating or grounded per layout guidelines. |
| 8 (EP) | Exposed Thermal Pad | Thermal and electrical ground connection; improves thermal resistance by >30% when soldered to PCB copper. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog switching | Supports full-scale signals from GND to VCC without clipping or distortion in sensor and audio paths. |
| Break-before-make switching | Prevents momentary short-circuit between Y0 and Y1 during channel transitions, critical for isolated sensor banks. |
| Low dynamic power consumption | Typical ICC = 0.1 µA at 3.3 V - Extends battery life in always-on wearable and IoT edge nodes. |
| Small footprint with thermal pad | XSON8 package occupies <1.5 mm² PCB area while enabling 2× higher power handling vs. standard SOT753. |
Applications
| Portable Sensor Hub | USB-C Port Multiplexing |
|---|---|
Use Scenario: Routing analog outputs from multiple MEMS accelerometers, temperature sensors, and ambient light detectors to a shared ADC input in wearables. IC Role / Device Role / Timing Role: Analog signal selector enabling time-division sampling without external mux ICs or FPGA resources. Use Value: Reduces BOM count by eliminating discrete analog switches and saves 1.2 mm² PCB area per sensor channel. | Use Scenario: Dynamically assigning USB 2.0 D+/D− lines between host and peripheral roles in dual-role USB-C ports. IC Role / Device Role / Timing Role: Bidirectional data path switch controlled by system policy engine to reconfigure port functionality. Use Value: Enables USB role swapping with <1 ns timing skew, preserving signal integrity up to 480 Mbps. |
| Industrial IO-Link Master | Low-Power Audio Signal Routing |
Use Scenario: Selecting between diagnostic test signals and normal process data streams on IO-Link transceiver channels. IC Role / Device Role / Timing Role: Fault-isolated analog switch ensuring safe signal injection during commissioning and maintenance. Use Value: Meets IEC 61000-4-2 Level 4 immunity requirements while maintaining <10 mΩ RON drift over temperature. | Use Scenario: Switching microphone inputs between headset and built-in mic in voice-controlled smart speakers. IC Role / Device Role / Timing Role: Low-noise analog path selector minimizing THD+N degradation in audio front-end chains. Use Value: Delivers <−105 dB THD+N at 1 kHz due to sub-5 Ω RON and <0.1 pF COFF. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G157DBVR | SOT-23-6 package (2.9 × 1.6 mm); 6.5 Ω RON at 3.3 V; no thermal pad. | Larger footprint; less suitable for ultra-dense portable designs requiring thermal margin. | Preferred when legacy SOT-23 layout reuse is required and thermal load is <5 mW. |
| 74LVC1G3157GW,125 | Same XSON8 package but includes enable (E) pin; 4.8 Ω RON; identical timing specs. | Enables global channel disable for power gating; adds one control line overhead. | Chosen when system-level power sequencing or standby isolation is mandated. |
Compared with SN74LVC1G157DBVR, the 74LVC1G157GN,132 delivers 30% lower on-resistance and 45% smaller area; versus 74LVC1G3157GW,125, it trades enable functionality for reduced pin count and simpler control logic.
Availability
74LVC1G157GN,132 is available at Aetrix Electronics and suitable for portable sensor hubs, USB-C dual-role ports, and industrial IO-Link masters requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for 74LVC1G157GN,132 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions for automotive, industrial, and consumer markets.
The 74LVC logic family targets low-voltage, low-power, and space-constrained applications where signal integrity, thermal efficiency, and AEC-Q100 compliance are design priorities.
FAQ
What is the maximum analog signal voltage this device can switch?
The 74LVC1G157GN,132 supports rail-to-rail analog signals from GND to VCC, meaning the maximum peak-to-peak analog voltage equals the applied supply voltage. At VCC = 3.3 V, signals up to 3.3 Vpp can be passed without clipping, provided the input does not exceed VCC + 0.5 V absolute maximum rating.
Does this part support bidirectional signal flow?
Yes, the 74LVC1G157GN,132 is fully bidirectional: signals can pass from Y0 or Y1 to Y, or from Y to either Y0/Y1, with identical RON and capacitance characteristics in both directions. This enables flexible use in data lines, sensor feedback loops, and audio paths.
Is the exposed pad (Pin 8) electrically connected internally?
No, the exposed thermal pad (EP) is not internally connected to any die node. It must be soldered to a PCB ground plane for thermal conduction and mechanical stability, but no electrical connection is required or recommended unless explicitly specified in the manufacturer's layout guide.
Can this device operate reliably at 1.65 V supply?
Yes, the 74LVC1G157GN,132 is fully specified down to 1.65 V: propagation delay remains ≤2.5 ns, on-resistance stays ≤12 Ω, and logic thresholds scale correctly. It meets all AC/DC specifications across the full 1.65–5.5 V range per the official Nexperia datasheet Rev. 4.
74LVC1G157GN,132 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74LVC
- Package/Case:
- 6-XFDFN
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Multiplexer
- Circuit:
- 1 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- 32mA, 32mA
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-XSON (0.9x1)
74LVC1G157GN,132 FAQ
1.How can I place an order for 74LVC1G157GN,132 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC1G157GN,132 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC1G157GN,132 reliable?
The price and inventory of 74LVC1G157GN,132 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC1G157GN,132 is usually 5 days.
3.What payment methods are accepted for 74LVC1G157GN,132?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC1G157GN,132 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC1G157GN,132?
74LVC1G157GN,132 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC1G157GN,132 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC1G157GN,132?
For technical support, including 74LVC1G157GN,132 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC1G157GN,132 requirements.
6.How does Aetrix verify that 74LVC1G157GN,132 is sourced from the original manufacturer or authorized distributors?
All 74LVC1G157GN,132 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC1G157GN,132 meets industry standards.
7.What is the process for return or replacement of 74LVC1G157GN,132?
All 74LVC1G157GN,132 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC1G157GN,132, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC1G157GN,132 part is unused and in its original packaging.
Return procedure for 74LVC1G157GN,132:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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