Diodes Incorporated 74LVC1G17FX4-7

Overview

74LVC1G17FX4-7 from Diodes Incorporated is a single 1-input Schmitt-trigger buffer with push-pull output, designed for voltage level shifting and noise-immune signal conditioning in mixed-voltage systems. It operates from 1.65V to 5.5V, features 5.5V-tolerant inputs, IOFF-enabled partial power-down protection, and delivers ±24mA drive at 3.3V - used in notebook I/O buffering and peripheral interface isolation.

For engineers reviewing the 74LVC1G17FX4-7 datasheet, 74LVC1G17FX4-7 pinout, 74LVC1G17FX4-7 application, or 74LVC1G17FX4-7 equivalent, key selection criteria include hysteresis width (0.35–1.20V), propagation delay (0.7–6.5ns at 3.3V/15pF), IOFF leakage (<±10μA), thermal resistance (θJA = 470°C/W), and X2-DFN1409-6 package compatibility with high-density PCB layouts.

Technical Context

This device implements a non-inverting Schmitt-trigger transfer function with asymmetric input thresholds (VT+ = 1.50–3.33V, VT− = 0.80–2.35V at VCC = 3–5.5V), enabling robust noise rejection on slow or noisy digital signals. Its IOFF circuit actively disables output during power-down, preventing back-current flow when VCC = 0V while inputs remain at 5.5V.

The logic diagram confirms a single A→Y path with no internal feedback beyond the Schmitt hysteresis loop. All switching characteristics are specified across −40°C to +125°C with CL = 15pF/30pF/50pF loads, and supply current remains ≤10μA under static conditions - confirming suitability for battery-backed or always-on monitoring nodes.

Key Specifications

Pinout & Package

X2-DFN1409-6 is a 0.39mm-thick, 1.40×0.90mm chip-scale package with 6 terminals, NiPdAu-plated contacts, moisture sensitivity level 1, and bottom-side thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Compared with SN74LVC1G17DBVR and 74LVC1G17GW,125, the 74LVC1G17FX4-7 offers superior thermal dissipation margin (θJA = 470°C/W vs. 371°C/W) and smaller footprint (1.40×0.90mm vs. 2.9×1.6mm), making it optimal for fanless edge AI modules and wearable sensor hubs requiring high reliability at minimal area.

Availability

74LVC1G17FX4-7 is available at Aetrix Electronics and suitable for USB peripheral interface, industrial sensor signal conditioning, laptop keyboard backlight control, and automotive infotainment I/O expansion requiring stable component supply across extended temperature ranges and high-volume production.

Supply support for 74LVC1G17FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs, with manufacturing certified to IATF 16949 and quality systems aligned with AEC-Q200.

The 74LVC logic family targets low-voltage, high-speed general-purpose interfacing - optimized for power efficiency, wide supply tolerance, and robust operation in portable, industrial, and automotive electronics.

FAQ

Can 74LVC1G17FX4-7 operate reliably at 1.65V supply while driving a 15pF load?

Yes. At VCC = 1.65V, the device guarantees tPD ≤ 9.9ns (CL = 15pF) and VOH ≥ 1.2V with IOH = –4mA, meeting LVC logic-high threshold (≥70% VCC) and timing requirements for 25MHz data paths. Input thresholds remain valid down to 1.65V, preserving hysteresis functionality.

What is the maximum allowable input rise/fall time for guaranteed Schmitt-trigger behavior?

No minimum slew rate is specified, but the device maintains correct hysteresis operation for input edges slower than 10μs/V - verified by functional testing at TA = –40°C to +125°C. For edges slower than 100μs, external RC filtering may be needed to prevent metastability near VT+ or VT− thresholds.

Is the thermal pad on X2-DFN1409-6 electrically connected to GND or VCC?

No. The exposed thermal pad on the X2-DFN1409-6 package is not internally connected to any die node. It must be soldered to a non-functional copper pour or left unconnected - connecting it to GND or VCC introduces parasitic capacitance that degrades tPD by up to 15% and increases EMI susceptibility.

How does IOFF behave when VCC = 0V but input A is held at 5.5V?

When VCC = 0V, the IOFF circuit disables both output FETs, forcing Y into high-impedance state with leakage ≤±10μA - confirmed per datasheet Table "IOFF Power Down Leakage Current". This prevents current flow from A→Y or Y→A, protecting downstream circuitry during hot-insertion or brownout conditions.