Diodes Incorporated 74LVC1G17FZ4-7

Overview

74LVC1G17FZ4-7 from Diodes Incorporated is a single 1-input Schmitt-trigger buffer with push-pull output, designed for voltage level shifting and noise-immune signal conditioning in mixed-voltage systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs, supports IOFF partial power-down, and delivers ±24mA drive at 3.3V. Used in notebook I/O buffering and USB interface signal cleanup.

For engineers reviewing the 74LVC1G17FZ4-7 datasheet, 74LVC1G17FZ4-7 pinout, 74LVC1G17FZ4-7 application, or 74LVC1G17FZ4-7 equivalent, this page provides verified package mapping (X2-DFN1410-6), Schmitt threshold hysteresis values (0.60–1.20V), IOFF leakage (<±10μA), propagation delay (0.7–6.5ns), and voltage-level translation capability across 1.65–5.5V rails.

Technical Context

The device implements a non-inverting Schmitt-trigger transfer function with separate positive-going (VT+) and negative-going (VT−) input thresholds-e.g., VT+ = 2.61V and VT− = 1.45V at VCC = 5.5V-enabling robust noise rejection on slow or noisy signals. Its IOFF circuit actively disables output during power-down, preventing back-current flow when VCC = 0V while inputs remain at 5.5V.

It features rail-to-rail CMOS-compatible output swing, 5.5V-tolerant inputs independent of VCC, and guaranteed operation across −40°C to +125°C ambient. The X2-DFN1410-6 package provides 0.50mm pitch, 1.40×1.00mm body size, and thermal resistance θJA = 460°C/W on standard FR-4 PCBs.

Key Specifications

Pinout & Package

X2-DFN1410-6 is a 1.40mm × 1.00mm, 0.50mm pitch, 6-terminal chip-scale package with wettable flank side walls for automated optical solder inspection. Pin 1 (A) is marked by a chamfered corner; exposed thermal pad (Pin 7) is not electrically connected and must be grounded per layout guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Compared with SN74LVC1G17DBVR, the 74LVC1G17FZ4-7 saves >60% board area and improves thermal dissipation in compact consumer electronics; versus 74AUP1G17GW, it trades 10× higher static current for 6× stronger output drive and faster edge rates-critical for noise-prone industrial interfaces.

Availability

74LVC1G17FZ4-7 is available at Aetrix Electronics and suitable for voltage level shifting, general-purpose logic interfacing, and power-down signal isolation requiring stable component supply across automotive infotainment, industrial HMIs, and portable medical devices.

Supply support for 74LVC1G17FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and logic solutions for power management, signal integrity, and connectivity applications.

The 74LVC logic family targets low-voltage, high-speed digital interfacing in space- and power-constrained systems-designed specifically for seamless integration across mixed-supply environments in computing, communications, and consumer electronics.

FAQ

What is the maximum input frequency supported by the 74LVC1G17FZ4-7?

The device does not specify a maximum clock frequency, but its propagation delay (tPD) ranges from 0.7ns to 6.5ns depending on VCC and load. With CL = 30pF and VCC = 3.3V, tPD ≤ 5.5ns supports reliable operation up to ~150MHz toggle rate. For clean edge regeneration, ensure input rise/fall times exceed tPD by ≥3× to avoid metastability.

Can the 74LVC1G17FZ4-7 be used with a 1.2V supply?

No. The absolute minimum recommended VCC is 1.65V per the datasheet's Recommended Operating Conditions. At 1.2V, the internal circuitry fails to bias correctly: VT+ and VT− thresholds become undefined, output drive collapses below specification, and IOFF protection may not activate reliably-risking latch-up or excessive ICC.

How should unused NC pins be handled in the X2-DFN1410-6 package?

Pins 2 and 5 are internally unconnected (NC). They must remain electrically floating-do not tie them to VCC or GND. Routing traces to these pads is acceptable only if necessary for mechanical stability; however, solder mask should fully cover them to prevent accidental shorts during reflow or handling.

Does the 74LVC1G17FZ4-7 support hot-swap insertion into a live backplane?

Yes-when used with proper system design. Its IOFF feature disables the output when VCC = 0V, blocking back-current even if A or Y are biased to 5.5V. However, hot-swap reliability also depends on upstream current limiting, slew-rate controlled connectors, and proper sequencing of auxiliary supplies-verify full system behavior per JEDEC JESD63.