Nexperia USA Inc. 74LVC1G17GM,115

Overview

74LVC1G17GM,115 from Nexperia is a single-channel Schmitt-trigger buffer IC designed for signal conditioning in mixed-voltage digital systems. It operates from 1.65 V to 5.5 V, accepts overvoltage-tolerant inputs up to 5.5 V, delivers ±24 mA output drive at 3.0 V, and features IOFF circuitry for partial power-down protection. It is used in noise-prone sensor interface and level translation circuits between 3.3 V and 5 V domains.

For engineers reviewing the 74LVC1G17GM,115 datasheet, 74LVC1G17GM,115 pinout, 74LVC1G17GM,115 application, or 74LVC1G17GM,115 equivalent, key selection criteria include hysteresis voltage (VH = 0.47–0.88 V), propagation delay (tpd ≤ 7.0 ns at 3.3 V), input threshold symmetry (VT+ and VT−), IOFF leakage (< ±2 μA), and XSON6 package compatibility with high-density PCB layouts.

Technical Context

The 74LVC1G17GM,115 implements a CMOS-based Schmitt-trigger transfer function with asymmetric positive- and negative-going input thresholds (e.g., VT+ = 1.29 V, VT− = 0.88 V at VCC = 3.0 V), delivering 0.41 V typical hysteresis. Its IOFF circuit actively disables outputs during power-down, blocking backflow current when VCC = 0 V.

It supports JEDEC-compliant voltage interfaces across four supply ranges (1.65–1.95 V, 2.3–2.7 V, 2.7–3.6 V, 4.5–5.5 V) and meets HBM ESD immunity >2000 V and CDM >1000 V. Input capacitance is 5 pF, and dynamic power dissipation is characterized by CPD = 16.6 pF at 3.3 V.

Key Specifications

Pinout & Package

XSON6 plastic extremely thin small outline package (SOT886); no leads; 6 terminals; body dimensions 1.0 mm × 1.45 mm × 0.5 mm; thermal pad not present; side-wettable flanks absent; pin 1 index located on lower-left corner below marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Compared with SN74LVC1G17DBVR and 74LVC1G17GW,115, the 74LVC1G17GM,115 offers the smallest PCB footprint (1.0 × 1.45 mm) and lowest profile (0.5 mm), making it optimal for space-constrained portable and wearable designs where thermal load is moderate and automated placement is required.

Availability

74LVC1G17GM,115 is available at Aetrix Electronics and suitable for industrial sensor interface, automotive body control, and portable medical device applications requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for 74LVC1G17GM,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, with leadership in automotive-grade components and advanced packaging.

The 74LVC1G17 belongs to Nexperia's LVC (Low-Voltage CMOS) logic family, engineered for robust mixed-voltage interoperability, low static/dynamic power, and industrial-temperature reliability in space-constrained embedded systems.

FAQ

What is the maximum input voltage the 74LVC1G17GM,115 can tolerate when VCC = 1.8 V?

The device accepts input voltages up to 5.5 V regardless of VCC level, as confirmed in Table 5 (Limiting Values) and Table 6 (Recommended Operating Conditions). This overvoltage tolerance eliminates external clamping components when interfacing with higher-voltage sources in mixed-supply systems.

Does the 74LVC1G17GM,115 support true bidirectional signal translation?

No - it is a unidirectional Schmitt-trigger buffer (A → Y only). It does not provide automatic direction sensing or bus arbitration. For bidirectional level translation, discrete solutions or dedicated translators like TXB0104 are required.

How does the IOFF feature behave during power sequencing?

When VCC drops to 0 V, the IOFF circuit disables the output stage and limits leakage current to ±2 μA maximum (Table 7), preventing reverse current flow from driven outputs into the unpowered IC - essential for safe hot-swap and multi-rail power sequencing.

Can the n.c. pins (1 and 5) on the XSON6 package be tied to GND or VCC?

No - pins 1 and 5 are internally unconnected (Table 3). They must remain floating per datasheet guidance; connecting them to any potential may cause unpredictable behavior or violate package stress limits due to internal routing constraints.