Diodes Incorporated 74LVC1G17Z-7

Overview

74LVC1G17Z-7 from Diodes Incorporated is a single-channel Schmitt-trigger buffer IC with push-pull output, designed for voltage-level shifting and noise-immune signal conditioning in mixed-voltage digital systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs regardless of V_CC, supports IOFF partial power-down protection, delivers ±24mA drive at 3.3V, and features 0.35V–1.20V hysteresis depending on supply voltage - enabling reliable operation in noisy industrial sensor interfaces and USB peripheral data lines.

For engineers reviewing the 74LVC1G17Z-7 datasheet, 74LVC1G17Z-7 pinout, 74LVC1G17Z-7 application, or 74LVC1G17Z-7 equivalent, key selection criteria include input hysteresis width across V_CC range, IOFF leakage (<±10 μA), propagation delay (0.7–6.5 ns at 3.3V/15pF), 5.5V-tolerant inputs, and SOT553 package thermal resistance (231°C/W).

Technical Context

This device implements a non-inverting positive-logic buffer (Y = A) with Schmitt-trigger input thresholds - VT+ ranges from 0.70V (1.65V V_CC) to 3.33V (5.5V V_CC), and VT− from 0.30V to 2.35V - yielding hysteresis (ΔVT) from 0.30V to 1.40V. Its IOFF circuit actively disables output during power-down, preventing back-current flow when V_CC = 0V while inputs remain at 5.5V.

The logic core uses CMOS technology with rail-to-rail output swing, specified for operation from −40°C to +125°C ambient. Input clamp diodes and ESD protection exceed 2kV HBM and 1kV CDM, and latch-up immunity exceeds 100mA per JESD78 Class I - supporting robust deployment in portable and automotive-adjacent electronics.

Key Specifications

Pinout & Package

SOT553 package: 5-pin ultra-small surface-mount package (1.60 × 1.60 × 0.60 mm), lead-free, RoHS 3 compliant, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Compared with SN74LVC1G17DBVR, the 74LVC1G17Z-7 offers 27% smaller PCB area and improved high-frequency noise immunity due to tighter hysteresis control at 3.3V; versus 74AUP1G17GW, it provides 6× higher drive strength and full 5V input tolerance - making it optimal for mixed-voltage industrial and USB-adjacent designs.

Availability

74LVC1G17Z-7 is available at Aetrix Electronics and suitable for industrial sensor interfaces, USB peripheral signal conditioning, and portable device power sequencing requiring stable component supply, long-term lifecycle support, and RoHS 3 compliance.

Supply support for 74LVC1G17Z-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-reliability, low-power, and application-optimized components for industrial, computing, and consumer markets.

The 74LVC1G17 belongs to Diodes' LVC logic family - engineered for wide-supply flexibility, robust ESD performance, and seamless integration into mixed-voltage digital systems with minimal external components.

FAQ

What is the maximum input frequency supported by the 74LVC1G17Z-7?

The 74LVC1G17Z-7 does not specify a maximum clock frequency, as it is a combinational buffer - not a clocked device. Its usable edge rate is determined by propagation delay (0.7–6.5 ns) and load capacitance. For a 15pF load at 3.3V, t_PD ≤4.6 ns supports clean transitions up to ~150 MHz fundamental frequency in well-designed layouts with controlled impedance and minimal stubs.

Can the 74LVC1G17Z-7 be used with a 1.8V supply and 3.3V input signals?

Yes. The 74LVC1G17Z-7 accepts input voltages up to 5.5V independent of V_CC. With V_CC = 1.8V, it correctly buffers 3.3V logic-high inputs while producing a 0–1.8V output swing. This makes it ideal for translating from higher-voltage domains into low-voltage logic without external biasing or resistive dividers.

Does the SOT553 package require special PCB layout considerations?

Yes. The SOT553 (1.6 × 1.6 mm, 0.5 mm pitch) demands precise pad geometry per Diodes' recommended layout: 0.375 mm × 0.5 mm pads with 0.8 mm center-to-center spacing, solder mask defined, and thermal relief for GND/V_CC. A 0.2 mm stencil aperture and nitrogen reflow profile with peak temperature ≤260°C are recommended to ensure void-free solder joints and mechanical reliability.

How does the IOFF feature behave during power-down sequences?

When V_CC drops below ~0.5V, the IOFF circuit activates automatically - disconnecting both output FETs to place Y in high-impedance state. This prevents current from flowing backward into the powered-down IC from external 5.5V sources (e.g., pull-up resistors or driven buses), eliminating risk of latch-up or excessive quiescent current in multi-rail systems.