Diodes Incorporated 74LVC1G32FS3-7

Overview

74LVC1G32FS3-7 from Diodes Incorporated is a single 2-input positive OR gate in a 4-pin X2-DFN0808-4 package (0.8 mm × 0.8 mm, 0.5 mm pad pitch), operating from 1.65 V to 5.5 V supply, delivering ±24 mA output drive at 3.3 V, with 5.5 V-tolerant inputs and IOFF-enabled partial power-down protection. It serves as a compact logic-level shifter and signal combiner in space-constrained portable electronics.

For engineers reviewing the 74LVC1G32FS3-7 datasheet, 74LVC1G32FS3-7 pinout, 74LVC1G32FS3-7 application, or 74LVC1G32FS3-7 equivalent, this device is selected for low-voltage mixed-signal interfacing, voltage-level translation between 1.8 V/3.3 V domains, and power-gated signal isolation where ultra-small footprint and guaranteed 5.5 V input tolerance are required.

Technical Context

This OR gate implements the Boolean function Y = A + B using CMOS technology, with push-pull outputs and no internal pull-ups or pull-downs. Its IOFF circuit actively disables output leakage during power-down, preventing backflow current when VCC = 0 V while inputs remain biased up to 5.5 V.

Input thresholds scale with VCC (VIH ≥ 0.65×VCC at 1.65–1.95 V; ≥ 0.7×VCC at 4.5–5.5 V), ensuring reliable TTL- and LVTTL-compatible switching across its full 1.65–5.5 V supply range. Propagation delay is 2.1 ns typical at 3.3 V, with 4.5 ns max over –40°C to +125°C.

Key Specifications

Pinout & Package

X2-DFN0808-4 is a 4-pin, 0.8 mm × 0.8 mm, 0.35 mm height, diamond-layout chip-scale package with exposed thermal pad (non-electrical). Pin 1 (A) and Pin 2 (B) are inputs; Pin 3 (Y) is output; Pin 4 (GND) is ground. No VCC or NC pins - VCC is supplied externally via PCB trace to die substrate.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input OR gate applications.

Compared with SN74LVC1G32DBVR and 74AUP1G32GW,125, the 74LVC1G32FS3-7 uniquely balances ultra-miniaturization, 5.5 V input tolerance, and ±24 mA drive in a thermally optimized 4-pin DFN-making it optimal for next-generation wearables and compact industrial edge modules where board space and mixed-voltage resilience are non-negotiable.

Availability

74LVC1G32FS3-7 is available at Aetrix Electronics and suitable for USB-C power delivery interfaces, wearable sensor hubs, and industrial PLC digital input modules requiring stable component supply, long-term lifecycle support, and consistent DFN0808 sourcing.

Supply support for 74LVC1G32FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions, with manufacturing certified to IATF 16949 and environmental compliance to RoHS 3, halogen-free, and antimony-free standards.

The 74LVC logic family targets high-speed, low-voltage general-purpose digital interfacing-designed specifically for voltage translation, signal conditioning, and power-aware logic in portable, industrial, and communications equipment.

FAQ

Does 74LVC1G32FS3-7 require an external VCC connection?

No. The X2-DFN0808-4 package has no VCC pin; power is delivered through the silicon substrate via the exposed thermal pad, which must be soldered to a solid copper pour connected to the system's main 1.65–5.5 V supply rail. This eliminates a dedicated VCC trace and reduces routing congestion.

Can 74LVC1G32FS3-7 safely interface a 5 V microcontroller GPIO with a 1.8 V FPGA input?

Yes. Its 5.5 V-tolerant inputs accept the 5 V signal directly, and its output swings rail-to-rail (0 V to VCC). When powered at 1.8 V, it produces a 0–1.8 V output compatible with the FPGA's input threshold-enabling bidirectional level translation without external components.

What is the thermal impact of mounting 74LVC1G32FS3-7 on a 1-layer PCB?

On a 1-layer FR-4 board with minimum recommended pad layout (0.32 mm × 0.32 mm thermal pad, 0.8 mm × 0.8 mm stencil), θJA is ~400°C/W. At 24 mA drive and 3.3 V, power dissipation remains <10 mW, resulting in <4°C junction rise-well within safe limits even without thermal vias.

How does IOFF behavior differ from high-impedance tri-state in 74LVC1G32FS3-7?

IOFF is not tri-state: it actively disables the output FETs to block current flow in both directions when VCC = 0 V, regardless of input state. Unlike tri-state, there is no high-Z output node-Y is effectively disconnected, preventing backfeed into unpowered rails, which is critical for hot-swap and partial-power-down architectures.