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Diodes Incorporated 74LVC1G32FZ4-7

Part No.:
74LVC1G32FZ4-7
Manufacturer:
Diodes Incorporated
Category:
Gates and Inverters
Package:
6-XFDFN
Datasheet:
Aetrix74LVC1G32FZ4-7.pdf
Description:
IC GATE OR 1CH 2-INP DFN1410-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:13,947

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Product details

Overview

74LVC1G32FZ4-7 from Diodes Incorporated is a single 2-input positive OR gate in X2-DFN1410-6 package, operating from 1.65V to 5.5V supply, with 5.5V-tolerant inputs and ±24mA output drive at 3.3V. It supports partial power-down via IOFF circuitry and enables voltage-level shifting in mixed-voltage digital interfaces such as USB peripheral logic control and I²C bus signal conditioning.

For engineers reviewing the 74LVC1G32FZ4-7 datasheet, 74LVC1G32FZ4-7 pinout, 74LVC1G32FZ4-7 application, or 74LVC1G32FZ4-7 equivalent, key selection criteria include IOFF-enabled power-down isolation, 0.5mm pitch DFN footprint compatibility, propagation delay ≤4.5ns at 3.3V, and 5.5V input tolerance for interfacing with legacy 5V logic domains.

Technical Context

This device implements a non-inverting Boolean OR function (Y = A + B) using CMOS technology with push-pull output stage. Its IOFF circuit actively disables output leakage during VCC = 0V, preventing back-current flow in powered-down subsystems.

Input thresholds scale with VCC (e.g., VIH ≥ 0.7×VCC at 4.5–5.5V), and output drive strength is specified across full 1.65–5.5V range - delivering –24mA/24mA at 3V and –32mA/32mA at 4.5V - enabling direct TTL-level interfacing without external level shifters.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 1.65V to 5.5V - supports operation across 1.8V, 2.5V, 3.3V, and 5V logic domains
Input Voltage Tolerance Up to 5.5V - allows safe connection to higher-voltage signals without clamping diodes
Output Drive Strength ±24mA at VCC = 3.3V - sufficient to drive multiple LVC/LVT inputs or small capacitive loads
Propagation Delay ≤4.5ns (max) at VCC = 3.3V - ensures timing compliance in sub-10ns logic paths
IOFF Leakage Current ±200μA max at TA = –40°C to +125°C - maintains signal integrity during partial power-down
ESD Protection HBM >2000V, CDM >1000V - exceeds JEDEC JESD22-A114/A101 for board-level robustness
Operating Temperature –40°C to +125°C - qualified for industrial and extended-temperature embedded applications

Pinout & Package

X2-DFN1410-6 is a 1.4mm × 1.0mm × 0.4mm leadless surface-mount package with 0.5mm pad pitch and exposed thermal pad (non-electrical). Pin 1 identification is marked by a chamfered corner on top view.

Pin/Terminal Circuit Role Design Meaning
A Data Input First OR gate input; accepts 0–5.5V logic levels independent of VCC
B Data Input Second OR gate input; fully 5.5V tolerant with no external protection required
Y Data Output Push-pull CMOS output; drives high/low actively; sinks/sourcing up to ±24mA at 3.3V
VCC Supply Voltage Primary power rail; must be decoupled locally; supports 1.65–5.5V operation
GND Ground Reference Return path for all currents; connects to PCB ground plane under thermal pad
NC No Connection Unbonded die pad; electrically isolated; must not be connected to any net

Key Features

Feature Design Value
Wide Supply Range 1.65–5.5V operation enables drop-in use across 1.8V, 2.5V, 3.3V, and 5V systems
IOFF Partial Power-Down Output automatically high-impedance when VCC = 0V, preventing backfeed into powered-down rails
5.5V-Tolerant Inputs Accepts 5V signals while powered from 1.8V or 2.5V - eliminates need for discrete level shifters
Low Dynamic Power ICC ≤ 200μA at 5.5V - reduces quiescent current in always-on logic monitoring circuits
Small Footprint 1.4mm × 1.0mm X2-DFN1410-6 saves >60% board area vs. SOT25 and supports high-density routing

Applications

USB Peripheral Control Logic I²C Bus Signal Conditioning

Use Scenario: OR-ing of multiple interrupt request lines from USB device controllers before feeding to host MCU.

IC Role / Device Role / Timing Role: Single-gate combinatorial logic element performing active-high interrupt aggregation with sub-5ns propagation.

Use Value: Eliminates need for larger logic arrays; 5.5V-tolerant inputs accept legacy USB PHY interrupt signals while operating from 3.3V system rail.

Use Scenario: Level translation and noise filtering for bidirectional I²C clock/data lines between 1.8V sensor nodes and 3.3V master controller.

IC Role / Device Role / Timing Role: Input buffer and voltage-domain interface; used in open-drain pull-up configurations with controlled rise/fall times.

Use Value: IOFF prevents contention during master power cycling; low input capacitance (5pF) preserves I²C timing margins.

Power Sequencing Monitoring Industrial Sensor Interface Logic

Use Scenario: Combining multiple power-good signals (e.g., from DC-DC converters) to generate a system-ready flag.

IC Role / Device Role / Timing Role: Fault-tolerant status aggregator; operates across varying supply voltages during startup/shutdown sequences.

Use Value: Wide VCC range and IOFF ensure reliable flag generation even when individual rails power up/down asynchronously.

Use Scenario: Interfacing discrete limit switches and analog sensor enable lines to microcontroller GPIOs in factory automation PLC modules.

IC Role / Device Role / Timing Role: Robust input conditioner providing ESD-hardened, 5.5V-tolerant signal reception for noisy industrial environments.

Use Value: HBM >2000V and latch-up immunity >100mA meet IEC 61000-4-2 Level 4 requirements without external protection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input OR gate applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC1G32DBVR SOT-23-5 package (3.0×2.8mm); higher θJA (204°C/W); no NC pin; same electrical specs Less space-constrained designs where manual rework or test probing is needed Select when board layout allows larger footprint and thermal management uses standard SOT-23 pads
74LVC1G32FS3-7 X2-DFN0808-4 (0.8×0.8mm); 4-pin, no NC; requires different PCB layout and solder stencil Ultra-dense portable electronics where 0.8mm² footprint is mandatory Choose only if size reduction outweighs need for NC pin and reduced thermal performance (θJA = 400°C/W)

Compared with SN74LVC1G32DBVR and 74LVC1G32FS3-7, the 74LVC1G32FZ4-7 provides optimal balance of compact size (1.4×1.0mm), thermal performance (θJA = 460°C/W), and design flexibility via the NC pin for future routing or grounding options.

Availability

74LVC1G32FZ4-7 is available at Aetrix Electronics and suitable for USB peripheral control, I²C signal conditioning, and industrial sensor interface applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 74LVC1G32FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for industrial, computing, and consumer markets.

The 74LVC logic family delivers low-voltage, high-speed CMOS performance with wide supply range and robust I/O tolerance - designed specifically for mixed-voltage digital interfacing in space- and power-constrained embedded systems.

FAQ

What is the maximum allowable input voltage when VCC = 1.8V?

The 74LVC1G32FZ4-7 supports input voltages up to 5.5V regardless of VCC level. When VCC = 1.8V, inputs A and B may safely accept 0–5.5V signals without damage or functional degradation, enabling direct connection to 5V peripherals in mixed-voltage systems.

Does the NC pin require PCB connection or grounding?

No. The NC (No Connection) pin on the X2-DFN1410-6 package is an unconnected die pad with no internal bond wire. It must remain electrically floating - neither connected to GND nor any other net - to avoid unintended coupling or thermal stress.

Can this device be used in partial-power-down mode with VCC = 0V?

Yes. The integrated IOFF circuit disables the output stage when VCC drops below ~0.8V, placing Y in high-impedance state. This prevents reverse current flow from live inputs (e.g., 5.5V signals) into the unpowered VCC rail, satisfying JEDEC JESD76 requirements.

What is the recommended PCB pad layout for X2-DFN1410-6?

Use Diodes' documented footprint: 0.25mm × 0.525mm solder pads (6 total), 0.5mm center-to-center spacing, with a 1.25mm × 1.25mm thermal pad (non-plated) centered beneath the package. Avoid solder mask defined (SMD) pads; use non-solder-mask-defined (NSMD) for reliable reflow wetting.

74LVC1G32FZ4-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
74LVC
Package/Case:
6-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
OR Gate
Number of Circuits:
1
Number of Inputs:
2
Features:
-
Voltage - Supply:
1.65V ~ 5.5V
Current - Quiescent (Max):
200 µA
Current - Output High, Low:
32mA, 32mA
Input Logic Level - Low:
0.7V ~ 0.8V
Input Logic Level - High:
1.7V ~ 2V
Max Propagation Delay @ V, Max CL:
5.5ns @ 5V, 50pF
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1410-6

74LVC1G32FZ4-7 FAQ

1.How can I place an order for 74LVC1G32FZ4-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC1G32FZ4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC1G32FZ4-7 reliable?

The price and inventory of 74LVC1G32FZ4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC1G32FZ4-7 is usually 5 days.

3.What payment methods are accepted for 74LVC1G32FZ4-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC1G32FZ4-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC1G32FZ4-7?

74LVC1G32FZ4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC1G32FZ4-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC1G32FZ4-7?

For technical support, including 74LVC1G32FZ4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC1G32FZ4-7 requirements.

6.How does Aetrix verify that 74LVC1G32FZ4-7 is sourced from the original manufacturer or authorized distributors?

All 74LVC1G32FZ4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC1G32FZ4-7 meets industry standards.

7.What is the process for return or replacement of 74LVC1G32FZ4-7?

All 74LVC1G32FZ4-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC1G32FZ4-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC1G32FZ4-7 part is unused and in its original packaging.

Return procedure for 74LVC1G32FZ4-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVC1G32FZ4-7 Tags

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