Nexperia USA Inc. 74LVC1G332GM,132

Overview

74LVC1G332GM,132 from Nexperia is a single 3-input OR gate logic IC in XSON6 (SOT886) package with 1.0 × 1.45 × 0.5 mm body, rated for -40 °C to +125 °C operation, 1.65 V to 5.5 V supply range, ±24 mA output drive at 3.0 V, and Schmitt-trigger inputs enabling robust signal conditioning in mixed-voltage digital interfaces.

For engineers reviewing the 74LVC1G332GM,132 datasheet, 74LVC1G332GM,132 pinout, 74LVC1G332GM,132 application, or 74LVC1G332GM,132 equivalent, this device serves as a voltage-tolerant level-translating OR gate in space-constrained industrial control I/O expansion, low-power sensor interface combiners, and battery-powered MCU peripheral logic where IOFF-enabled partial power-down isolation is required.

Technical Context

This CMOS logic gate implements standard positive-logic OR functionality (Y = A + B + C) with Schmitt-trigger inputs that tolerate slow-rising/falling signals and provide hysteresis of typically 0.3 V at VCC = 3.3 V. Its IOFF circuitry actively disables outputs during power-down, blocking backflow current when VCC = 0 V.

The device supports mixed-voltage translation: inputs accept up to 5.5 V regardless of VCC (1.65–5.5 V), enabling direct interfacing between 3.3 V and 5 V domains without external resistors. Propagation delay ranges from 1.0 ns (VCC = 4.5–5.5 V) to 17.2 ns (VCC = 1.65–1.95 V) under 30–50 pF load conditions.

Key Specifications

Pinout & Package

XSON6 plastic extremely thin small outline package (SOT886), no leads, 6 terminals, body dimensions 1.0 × 1.45 × 0.5 mm, thermal pad exposed on bottom (non-electrical), pin 1 index located at lower-left corner below marking code "YG".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-input OR gate applications.

Compared with SN74LVC1G332DBVR and 74LVC1G332GV,125, the 74LVC1G332GM,132 delivers the smallest footprint and lowest thermal resistance among LVC-family 3-input OR gates, making it optimal for high-density portable and automotive modules where board space and junction temperature rise are critical constraints.

Availability

74LVC1G332GM,132 is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, low-power sensor aggregation, and mixed-voltage microcontroller interface applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74LVC1G332GM,132 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions, with leadership in advanced packaging and automotive-grade qualification.

The 74LVC1G332 belongs to Nexperia's LVC (Low-Voltage CMOS) logic family, designed specifically for energy-efficient, voltage-flexible digital interfacing in space-constrained industrial, computing, and consumer systems.

FAQ

Can 74LVC1G332GM,132 operate with VCC = 1.65 V while accepting 5 V inputs?

Yes. The device's inputs are overvoltage tolerant up to 5.5 V regardless of VCC level. At VCC = 1.65 V, inputs remain functional and compliant with JEDEC JESD8-7, enabling safe 5 V signal reception without damage or level-shifting circuitry.

Does the IOFF feature require external biasing or control signals?

No. IOFF activates automatically when VCC drops to 0 V - no enable pin or external circuitry is needed. Output transitions to high-impedance state with ≤±2 μA leakage, preventing back-current flow through powered-down sections of the system.

What is the maximum capacitive load the output can drive at 3.3 V supply?

At VCC = 3.3 V, the output maintains specified timing (tpd ≤ 4.8 ns) and voltage levels (VOH ≥ 2.3 V, VOL ≤ 0.55 V) driving up to 50 pF, including PCB trace and input capacitance of downstream devices, per datasheet Table 10 test conditions.

Is the SOT886 package thermally enhanced compared to other XSON6 variants?

Yes. The SOT886 (XSON6) package used for 74LVC1G332GM,132 features an exposed thermal pad on the bottom surface, achieving θJA ≈ 190 K/W - significantly lower than SOT1115 (θJA ≈ 220 K/W) and enabling higher sustained output current in compact layouts.