Diodes Incorporated 74LVC1G57FZ4-7

Overview

74LVC1G57FZ4-7 from Diodes Incorporated is a single 3-input configurable multiple-function logic gate in X2-DFN1410-6 package, supporting AND, OR, NAND, NOR, XNOR, inverter, and non-inverting buffer functions via input pattern selection. It operates from 1.65V to 5.5V, features ±24mA output drive at 3.3V, 5.1ns max propagation delay at 5V, and IOFF-enabled partial power-down protection. Used for voltage-level shifting in mixed-voltage I/O interfaces on portable computing and consumer electronics PCBs.

For engineers reviewing the 74LVC1G57FZ4-7 datasheet, 74LVC1G57FZ4-7 pinout, 74LVC1G57FZ4-7 application, or 74LVC1G57FZ4-7 equivalent, this device serves as a space-efficient, low-power reconfigurable logic element for dynamic signal routing, power-down isolation, and interface bridging where footprint and supply flexibility are critical.

Technical Context

The 74LVC1G57 implements a fixed 3-input combinational logic block with eight possible output states determined solely by the IN2/IN1/IN0 input combination - no internal registers or clocking. Its Schmitt-trigger inputs provide hysteresis (0.3–1.4V ΔVT), enabling noise-immune signal conditioning in noisy environments.

IOFF circuitry actively disables outputs during VCC = 0V, blocking back-current flow from live buses into unpowered sections - essential for hot-swap and partial-power-down system architectures. Input tolerance up to 5.5V allows direct interfacing with 5V signals while operating from 1.8V or 3.3V supplies.

Key Specifications

Pinout & Package

X2-DFN1410-6 (1.4mm × 1.0mm, 0.3mm height, 0.5mm pitch) - ultra-compact, leadless, thermally enhanced surface-mount package with exposed thermal pad; RoHS-compliant, halogen-free "Green" molding compound.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar configurable logic gate applications.

Compared with SN74LVC1G57DBVR and 74LVC1G97GW,125, the 74LVC1G57FZ4-7 delivers the smallest footprint and highest temperature-rated IOFF protection - making it optimal for production-grade miniaturized designs where thermal density and full industrial temperature compliance are mandatory.

Availability

74LVC1G57FZ4-7 is available at Aetrix Electronics and suitable for USB peripheral interface, smartphone power sequencing, IoT sensor hub signal routing, and industrial PLC I/O expansion requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for 74LVC1G57FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance, energy-efficient solutions for consumer, industrial, and communications markets.

The 74LVC1G57 belongs to Diodes' LVC logic family - designed specifically for low-voltage, mixed-supply system interfacing with emphasis on small size, wide VCC range, and robust power-down behavior.

FAQ

Can the 74LVC1G57FZ4-7 be used as a level shifter between 1.8V and 5V logic domains?

Yes. Its 5.5V-tolerant inputs accept 5V signals while operating from a 1.8V VCC supply, and its push-pull output swings rail-to-rail - enabling bidirectional level translation without external resistors or direction control. Verified operation confirmed across VCC = 1.65V–5.5V with VI = 0–5.5V.

Does the device require external pull-up or pull-down resistors on unused inputs?

No. Unused inputs may be directly tied to VCC or GND per datasheet recommendation (Note 5). The internal structure does not require external biasing; floating inputs are prohibited due to undefined logic state and potential increased ICC.

What is the maximum capacitive load the 74LVC1G57FZ4-7 can drive reliably?

The device is characterized up to 50pF load capacitance with guaranteed tPD ≤ 6.4ns over full temperature range. Driving >50pF increases propagation delay nonlinearly and may cause marginal timing in high-speed paths; for >75pF loads, add series termination or buffer stage.

Is the X2-DFN1410-6 package compatible with standard reflow profiles for lead-free soldering?

Yes. The package complies with IPC/JEDEC J-STD-020D moisture sensitivity level 1 and supports peak reflow temperatures up to 260°C. Recommended profile follows SnAgCu alloy specifications with ramp rates ≤3°C/s and time above liquidus 60–90 seconds.