Diodes Incorporated 74LVC1G98FZ4-7

Overview

74LVC1G98FZ4-7 from Diodes Incorporated is a single 3-input configurable multiple-function logic gate in X2-DFN1410-6 package, supporting eight logic configurations (MUX, AND, OR, NAND, NOR, inverter, buffer) via input pin states. It operates from 1.65V to 5.5V, features 5.5V-tolerant inputs, ±24mA output drive at 3.3V, and IOFF partial power-down protection. Used for voltage-level shifting and signal routing in portable consumer electronics.

For engineers reviewing the 74LVC1G98FZ4-7 datasheet, 74LVC1G98FZ4-7 pinout, 74LVC1G98FZ4-7 application, or 74LVC1G98FZ4-7 equivalent, this device serves as a space-constrained, multi-logic replacement for discrete gates in mixed-voltage digital interfaces requiring Schmitt-trigger input hysteresis and low static current.

Technical Context

The 74LVC1G98 implements a 3-bit lookup table (LUT) architecture where IN2, IN1, and IN0 collectively determine Y's logic state per an 8-row truth table. All inputs are 5.5V-tolerant CMOS with Schmitt-trigger thresholds (VT+ = 1.50–3.33V, VT− = 0.80–2.35V at VCC = 3–5.5V), enabling noise-immune signal conditioning in noisy environments.

IOFF circuitry disables output leakage (<±200μA at TA = −40°C to +125°C) during partial power-down, preventing backflow when VCC = 0V while IN/OUT pins remain biased. Propagation delay is 0.7–7.9ns (VCC = 1.8–5V, CL = 30–50pF), and power dissipation capacitance is 24pF at 5V.

Key Specifications

Pinout & Package

X2-DFN1410-6 (1.4mm × 1.0mm, 0.30mm height, 0.50mm pitch) - ultra-compact, thermally enhanced leadless package with exposed thermal pad; RoHS-compliant, halogen-free, and fully lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar configurable logic gate applications.

Compared with SN74LVC1G98DRYR and 74LVC1G99GW,125, the 74LVC1G98FZ4-7 offers the lowest typical ICC (10μA), smallest package (X2-DFN1410-6), and widest temperature-rated IOFF performance - making it optimal for miniaturized, battery-sensitive, and extended-temperature industrial designs.

Availability

74LVC1G98FZ4-7 is available at Aetrix Electronics and suitable for mobile device power sequencing, USB-C port configuration logic, IoT sensor node signal conditioning, and industrial HMI button debounce requiring stable component supply across automotive-grade temperature ranges and long production lifecycles.

Supply support for 74LVC1G98FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and communications markets.

The 74LVC1G98 belongs to Diodes' LVC logic family, designed specifically for low-voltage, mixed-signal interfacing in space-constrained portable electronics where configurability, voltage tolerance, and power-down safety are critical.

FAQ

What logic functions can the 74LVC1G98FZ4-7 implement?

The 74LVC1G98FZ4-7 implements eight logic functions determined by its three inputs (IN0–IN2): multiplexer, AND, OR, NAND, NOR, inverter, and non-inverting buffer. The specific function is selected by hardwiring IN0–IN2 to VCC or GND; no external programming interface is required.

Does the 74LVC1G98FZ4-7 support partial power-down operation?

Yes - its IOFF circuitry disables the output and limits leakage current to ±200μA when VCC = 0V, preventing damaging back-current flow from live inputs or outputs into a powered-down system domain. This is verified per JESD78 Class II latch-up testing.

Can the 74LVC1G98FZ4-7 interface between 1.8V and 5V logic domains?

Yes - its inputs tolerate up to 5.5V regardless of VCC (1.65–5.5V), and its output swings rail-to-rail. When VCC = 1.8V, it accepts 5V control signals and drives 1.8V-compatible loads, enabling seamless bidirectional level translation without external components.

What is the thermal performance of the X2-DFN1410-6 package?

The X2-DFN1410-6 package has a junction-to-ambient thermal resistance (θJA) of 430°C/W under standard FR-4 PCB conditions (2oz copper, minimum recommended pad layout). Its exposed thermal pad improves heat dissipation versus SOT363 and supports continuous operation up to +125°C ambient.