Nexperia USA Inc. 74LVC2245APW,118

Overview

74LVC2245APW,118 from Nexperia is an octal 3-state transceiver with integrated 30 Ω series termination resistors, bidirectional direction control (DIR), and active-low output enable (OE). It operates from 1.2 V to 3.6 V, supports 5 V-tolerant I/O, and functions as a level translator between 3.3 V and 5 V domains in bus interface applications such as memory expansion and peripheral interconnects.

For engineers reviewing the 74LVC2245APW,118 datasheet, 74LVC2245APW,118 pinout, 74LVC2245APW,118 application, or 74LVC2245APW,118 equivalent, key selection criteria include its 30 Ω on-die termination for signal integrity, IOFF partial power-down capability, Schmitt-trigger inputs for noise immunity, and guaranteed operation from –40 °C to +125 °C.

Technical Context

The device implements dual-bus bidirectional data flow controlled by DIR and OE: when OE is LOW, data propagates either A→B (DIR HIGH) or B→A (DIR LOW); when OE is HIGH, all outputs enter high-impedance state. Its IOFF circuit actively disables outputs during power-down, blocking backflow current even when input voltages reach 5.5 V while VCC = 0 V.

Each I/O features Schmitt-trigger inputs for robust handling of slow-rising signals and 5 V tolerance achieved via internal clamping diodes. The 30 Ω series resistors are placed on all eight A-side and B-side outputs, reducing reflections on transmission lines without requiring external components.

Key Specifications

Pinout & Package

TSSOP20 package (SOT360-1): plastic thin shrink small outline, 20 leads, 4.4 mm body width, 0.65 mm pitch, exposed pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal transceiver applications.

Compared with SN74LVC2245APWR, the 74LVC2245APW,118 offers broader temperature qualification; versus 74AVC2245PW,118, it trades 1.3 ns lower tpd for 30 μA lower ICC and identical termination behavior-making it preferable for thermally constrained, battery-sensitive designs.

Availability

74LVC2245APW,118 is available at Aetrix Electronics and suitable for memory expansion interfaces, industrial I/O modules, embedded display bridges, and test equipment backplanes requiring stable component supply across extended temperature ranges.

Supply support for 74LVC2245APW,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions for industrial, computing, and consumer markets.

The 74LVC family delivers low-voltage CMOS logic with enhanced noise immunity and mixed-voltage interoperability, designed specifically for space-constrained, power-sensitive embedded systems requiring robust bus interfacing.

FAQ

Can 74LVC2245APW,118 operate with VCC = 1.2 V while driving 5 V-tolerant loads?

Yes. At VCC = 1.2 V, the device maintains full 5 V input tolerance and 5.5 V absolute maximum input voltage rating. Output drive strength is reduced (VOH min = 1.08 V at –40 °C to +85 °C), but inputs remain compatible with 5 V logic thresholds due to Schmitt-trigger hysteresis and clamping diodes.

What is the thermal impact of the 30 Ω series resistors during continuous operation?

The 30 Ω resistors are monolithically integrated into each output driver stage and contribute negligibly to junction temperature rise. Power dissipation remains dominated by CMOS switching (CPD = 14.4 pF) and static supply current (ICC ≤ 40 μA), with total Ptot limited to 500 mW in TSSOP20 at ≤100 °C ambient.

How does IOFF behave when VCC = 0 V and OE = HIGH?

When VCC = 0 V and OE = HIGH, the IOFF circuit forces all outputs into high-impedance state regardless of DIR or input levels. Measured IOFF leakage is ≤±10 μA at VI/VO = 5.5 V, preventing back-current paths that could disrupt upstream 5 V supplies or damage powered-down sections.

Is the GND pad on the TSSOP20 package (SOT360-1) required to be soldered?

No. The exposed thermal pad on the underside of the TSSOP20 package has no electrical function and is not connected to internal GND. Per Nexperia's datasheet, it may be left unsoldered or floated; if soldered, it must remain electrically isolated from PCB ground planes to avoid parasitic coupling.