Diodes Incorporated 74LVC240AQ20-13
- Part No.:
- 74LVC240AQ20-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
74LVC240AQ20-13.pdf
- Description:
- IC BUF INVERT 3.6V V-QFN4525-20
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
74LVC240AQ20-13 from Diodes Incorporated is an octal buffer/line driver with 3-state outputs in a 20-pin V-QFN4525 package, operating from 1.65V to 3.6V supply, supporting 5.5V-tolerant inputs and delivering ±24 mA output drive at 3.0V - used for bus driving and signal isolation in mixed-voltage embedded systems.
For engineers reviewing the 74LVC240AQ20-13 datasheet, 74LVC240AQ20-13 pinout, 74LVC240AQ20-13 application, or 74LVC240AQ20-13 equivalent, this device serves as a dual 4-bit non-inverting buffer with independent OE controls, IOFF-enabled partial power-down protection, and Schmitt-trigger inputs for noise immunity in high-density PCB layouts.
Technical Context
The 74LVC240AQ20-13 implements two independent 4-bit non-inverting buffers, each with dedicated output-enable (OE) control pins (Pin 1 and Pin 19), enabling selective tri-state operation of Y outputs while A inputs remain active. Its IOFF circuitry disables outputs during power-down to prevent backflow current.
All eight inputs feature Schmitt-trigger action for hysteresis-based noise rejection, and input voltage tolerance up to 5.5V allows direct interfacing with 5V logic while powered from 1.8V or 3.3V rails - critical for voltage translation in modern low-power computing peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.65V to 3.6V - supports single-rail operation across 1.8V and 3.3V system domains without level shifters. |
| Input Voltage Tolerance | Up to 5.5V - enables safe connection to legacy 5V buses without external clamping or translation. |
| Output Drive Strength | ±24 mA at VCC = 3.0V - sufficient to drive 50 Ω transmission lines or multiple CMOS loads in compact routing. |
| Propagation Delay | Typ. 3.8 ns at 3.3V - ensures timing integrity in high-speed data paths up to ~100 MHz clock domains. |
| IOFF Leakage Current | ±10 μA max - guarantees safe hot-insertion and partial power-down in multi-rail systems with unpowered sections. |
| ESD Protection | 2 kV HBM, 1 kV CDM - meets industrial IEC 61000-4-2 surge immunity requirements for board-level robustness. |
| Thermal Resistance θJA | 67 °C/W (V-QFN4525-20) - enables sustained operation at full drive strength without heatsinking in 25°C ambient. |
Pinout & Package
V-QFN4525-20 package: 2.5 mm × 4.5 mm × 0.95 mm body, 0.50 mm lead pitch, exposed thermal pad (Pin 20 not assigned - thermal pad connected to GND internally).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | OE1 | Active-low enable for first 4-bit buffer (controls Y1–Y4 outputs); asserts high-impedance when high. |
| 2 | 1A1 | Input for first buffer channel 1; non-inverting path to 1Y1 (Pin 18). |
| 3 | 2Y4 | Output for second buffer channel 4; driven by 2A4 (Pin 17) when OE2 is low. |
| 4 | 1A2 | Input for first buffer channel 2; non-inverting path to 1Y2 (Pin 16). |
| 5 | 2Y3 | Output for second buffer channel 3; driven by 2A3 (Pin 15) when OE2 is low. |
| 6 | 1A3 | Input for first buffer channel 3; non-inverting path to 1Y3 (Pin 14). |
| 7 | 2Y2 | Output for second buffer channel 2; driven by 2A2 (Pin 13) when OE2 is low. |
| 8 | 1A4 | Input for first buffer channel 4; non-inverting path to 1Y4 (Pin 12). |
| 9 | 2Y1 | Output for second buffer channel 1; driven by 2A1 (Pin 11) when OE2 is low. |
| 10 | GND | Ground reference for all logic and power domains; connects to exposed thermal pad. |
| 11 | 2A1 | Input for second buffer channel 1; non-inverting path to 2Y1 (Pin 9). |
| 12 | 1Y4 | Output for first buffer channel 4; driven by 1A4 (Pin 8) when OE1 is low. |
| 13 | 2A2 | Input for second buffer channel 2; non-inverting path to 2Y2 (Pin 7). |
| 14 | 1Y3 | Output for first buffer channel 3; driven by 1A3 (Pin 6) when OE1 is low. |
| 15 | 2A3 | Input for second buffer channel 3; non-inverting path to 2Y3 (Pin 5). |
| 16 | 1Y2 | Output for first buffer channel 2; driven by 1A2 (Pin 4) when OE1 is low. |
| 17 | 2A4 | Input for second buffer channel 4; non-inverting path to 2Y4 (Pin 3). |
| 18 | 1Y1 | Output for first buffer channel 1; driven by 1A1 (Pin 2) when OE1 is low. |
| 19 | OE2 | Active-low enable for second 4-bit buffer (controls Y1–Y4 of second group); asserts high-impedance when high. |
| 20 | VCC | Primary power supply input (1.65V–3.6V); decoupling capacitor required within 3 mm of this pin. |
Key Features
| Feature | Design Value |
|---|---|
| IOFF Partial Power-Down Support | Prevents damaging back-current flow when VCC = 0V while inputs remain at 5.5V - essential for hot-swap and multi-rail sequencing. |
| Schmitt-Trigger Inputs | Provides >0.3V hysteresis on all A and OE inputs - rejects noise spikes up to 10 ns duration without external filtering. |
| 5.5V Input Tolerance | Eliminates need for external level translators when interfacing with 5V microcontrollers or legacy peripherals in 3.3V systems. |
| Low Dynamic Ground Bounce | VOLP < 0.8V at VCC = 3.3V - maintains signal integrity during simultaneous switching of multiple outputs on shared ground planes. |
| RoHS & Halogen-Free Compliance | Fully lead-free, antimony-free, and halogen-free (<900 ppm Br+Cl) - meets IPC-1752A Class 3 reporting and EU EcoDesign directives. |
Applications
| PC Motherboard Bus Isolation | Industrial PLC I/O Expansion |
|---|---|
|
Use Scenario: Isolating PCIe configuration registers from main CPU bus during firmware updates to prevent corruption. IC Role / Device Role / Timing Role: Dual 4-bit buffer acts as directionally controlled signal gate, enabling/disabling register access via OE1/OE2 under firmware control. Use Value: Prevents unintended writes during power transitions using IOFF, ensuring register state retention even if VCC drops momentarily. |
Use Scenario: Driving 24V digital input modules from 3.3V FPGA I/O banks in modular PLC backplanes. IC Role / Device Role / Timing Role: Level-tolerant buffer translates 3.3V logic to 5.5V-compatible signals while sourcing 24 mA per channel for optocoupler LED biasing. Use Value: Eliminates discrete transistor arrays and reduces BOM count by integrating eight channels in 2.5×4.5 mm footprint. |
| Notebook Memory Subsystem | Automotive Infotainment Display Interface |
|
Use Scenario: Buffering DDR3/DDR4 address/control lines between memory controller and DIMM slots in space-constrained ultrabooks. IC Role / Device Role / Timing Role: Low-skew (≤1.5 ns) non-inverting driver maintains setup/hold timing margins across 8-bit parallel traces routed over flex cables. Use Value: Achieves <10 ps inter-channel skew at 3.3V, enabling reliable 1066 MT/s operation without added termination or delay tuning. |
Use Scenario: Isolating LVDS transmitter enable signals from MCU GPIOs in automotive head unit displays subject to load dump transients. IC Role / Device Role / Timing Role: High-ESD (2 kV HBM) buffer shields MCU pins from transient coupling through shared display harnesses. Use Value: Survives ISO 7637-2 Pulse 5a (75 V/100 ms) events without latch-up due to JESD78 Class I (>250 mA) robustness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC240APW | TSSOP-20 package (6.4×6.5 mm), higher θJA (74 °C/W), same electrical specs. | Less suitable for ultra-thin portable designs requiring minimal Z-height and thermal density. | Select when board assembly uses standard TSSOP reflow profiles and thermal margin exceeds 15°C. |
| 74LVC240ADTR2G | SOIC-20 package (7.5×12.8 mm), no exposed thermal pad, lower I/O drive (±24 mA only at VCC ≥ 2.7V). | Not recommended for high-frequency or thermally constrained applications above 50 MHz. | Choose only for legacy SOIC-compatible designs where footprint compatibility outweighs performance and size constraints. |
Compared with SN74LVC240APW and 74LVC240ADTR2G, the 74LVC240AQ20-13 offers superior thermal performance (67 vs. 74/105 °C/W), smallest footprint (2.5×4.5 mm), and guaranteed 24 mA drive down to 3.0V - making it optimal for space- and power-sensitive embedded systems.
Availability
74LVC240AQ20-13 is available at Aetrix Electronics and suitable for PC motherboard bus isolation, industrial PLC I/O expansion, and notebook memory subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74LVC240AQ20-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for computing, industrial, and automotive markets.
The 74LVC240A belongs to Diodes' LVC logic family, designed specifically for low-voltage, mixed-signal interface applications demanding 5V-tolerant inputs, IOFF protection, and compact packaging in consumer and industrial electronics.
FAQ
Can 74LVC240AQ20-13 operate reliably at 1.65V supply while driving 24 mA loads?
No - the ±24 mA output drive rating is specified only at VCC = 3.0V. At 1.65V, the maximum guaranteed sink/source current is ±4 mA per output (per Recommended Operating Conditions table). Attempting 24 mA at 1.65V violates absolute maximum ratings and risks excessive VOL/VOLH deviation and thermal overstress.
Is the exposed thermal pad on the QFN-20 package electrically connected, and how should it be handled in layout?
Yes - the exposed thermal pad is internally connected to GND. It must be soldered to a solid copper GND plane on the PCB using at least nine thermal vias (0.3 mm diameter, spaced ≤1 mm apart) to achieve the rated θJA of 67 °C/W. Leaving it floating degrades thermal performance by >30% and risks parametric drift under load.
Does 74LVC240AQ20-13 support hot-plug insertion while other system rails remain active?
Yes - its IOFF circuitry actively disables outputs and limits leakage to ±10 μA when VCC = 0V and inputs are held at 5.5V, satisfying JEDEC JESD78 Class I latch-up immunity and enabling safe hot-plug operation in multi-rail backplane systems without auxiliary power sequencing.
What is the maximum clock frequency supported when using 74LVC240AQ20-13 as a data path buffer?
The device has no internal clock; its usable data rate depends on propagation delay and system timing margins. With tPD = 3.8 ns (typ.) at 3.3V, it supports clean data edges up to ~100 MHz in point-to-point configurations. For 200+ MHz applications, interconnect length, termination, and skew between channels become limiting factors - not the buffer itself.
74LVC240AQ20-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74LVC
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- V-QFN4525-20
74LVC240AQ20-13 FAQ
1.How can I place an order for 74LVC240AQ20-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC240AQ20-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC240AQ20-13 reliable?
The price and inventory of 74LVC240AQ20-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC240AQ20-13 is usually 5 days.
3.What payment methods are accepted for 74LVC240AQ20-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC240AQ20-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC240AQ20-13?
74LVC240AQ20-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC240AQ20-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC240AQ20-13?
For technical support, including 74LVC240AQ20-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC240AQ20-13 requirements.
6.How does Aetrix verify that 74LVC240AQ20-13 is sourced from the original manufacturer or authorized distributors?
All 74LVC240AQ20-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC240AQ20-13 meets industry standards.
7.What is the process for return or replacement of 74LVC240AQ20-13?
All 74LVC240AQ20-13 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC240AQ20-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC240AQ20-13 part is unused and in its original packaging.
Return procedure for 74LVC240AQ20-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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