Diodes Incorporated 74LVC2G00HK3-7

Overview

74LVC2G00HK3-7 from Diodes Incorporated is a dual 2-input NAND gate in X2-DFN1410-8 package, operating from 1.65V to 5.5V supply, delivering ±24mA output drive at 3.3V, with IOFF-enabled partial power-down protection and Schmitt-trigger inputs (100mV hysteresis at VCC = 3.0V), used for voltage level shifting and signal isolation in portable computing peripherals.

For engineers reviewing the 74LVC2G00HK3-7 datasheet, 74LVC2G00HK3-7 pinout, 74LVC2G00HK3-7 application, or 74LVC2G00HK3-7 equivalent, key selection criteria include supply voltage range compatibility, IOFF leakage performance (<±10μA at 5.5V), propagation delay (0.7–5.4ns across 1.8–5.0V), and DFN1410 footprint constraints in space-constrained PCB layouts.

Technical Context

This device implements two independent NAND logic functions with push-pull CMOS outputs and fully specified IOFF circuitry that disables outputs during power-down to prevent backflow current. Each input includes Schmitt-trigger action, enabling robust operation with slow-rising/falling signals.

It supports mixed-voltage interfacing across 1.65–5.5V domains, accepts 5.5V-tolerant inputs regardless of VCC, and maintains guaranteed logic thresholds (VIH = 0.65×VCC min at 1.65–1.95V; VIL = 0.3×VCC max at 4.5–5.5V) across industrial temperature range (–40°C to +125°C).

Key Specifications

Pinout & Package

X2-DFN1410-8 (1.35mm × 1.0mm × 0.35mm, 0.4mm lead pitch) thermally enhanced, bottom-exposed pad package with wettable flank option for automated optical inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input NAND gate applications.

Compared with SN74LVC2G00DCKR and 74AUP2G00GW,125, the 74LVC2G00HK3-7 uniquely balances compact DFN1410 size, full 1.65–5.5V operation, IOFF safety, and 5.5V-tolerant inputs-making it optimal for portable electronics requiring voltage translation and power-state integrity.

Availability

74LVC2G00HK3-7 is available at Aetrix Electronics and suitable for USB peripheral control, mobile display interface isolation, hard disk activity indication, and GPS wake signal conditioning requiring stable component supply across high-volume consumer electronics production.

Supply support for 74LVC2G00HK3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and logic devices, with design centers in Asia, Europe, and the U.S., serving industrial, computing, and consumer markets.

The 74LVC logic family targets high-speed, low-voltage, mixed-signal interfacing applications-designed specifically for voltage translation, bus isolation, and power-aware digital control in space- and power-constrained portable electronics.

FAQ

Can 74LVC2G00HK3-7 be used with 1.8V and 5V logic simultaneously?

Yes. Its inputs tolerate up to 5.5V regardless of VCC setting, and its supply range (1.65–5.5V) allows direct connection to 1.8V, 2.5V, 3.3V, or 5V rails. When VCC = 1.8V, inputs from a 5V microcontroller remain compatible without external resistors or translators.

What is the purpose of the IOFF feature in practical system design?

IOFF disables both outputs when VCC = 0V, preventing current backflow from live buses into a powered-down section. This protects downstream ICs during hot-plug events, enables safe power sequencing in multi-rail systems, and avoids latch-up in partially powered subsystems like USB suspend/resume states.

How does the Schmitt-trigger input improve reliability in noisy environments?

The 100mV typical hysteresis at VCC = 3.0V creates distinct high/low thresholds, eliminating multiple transitions caused by slow or noisy edges. This prevents glitches on mechanical switch inputs, long PCB traces, or unshielded cables-reducing firmware debounce overhead and improving deterministic timing behavior.

Is the X2-DFN1410-8 package compatible with standard reflow profiles and AOI inspection?

Yes. The package uses industry-standard wettable flank geometry and 0.4mm pitch, supporting IPC-7095-compliant reflow profiles and enabling reliable solder joint inspection via side-view AOI systems. Its 1.35mm × 1.0mm footprint also fits tight layout constraints common in smartphones and wearables.