Diodes Incorporated 74LVC2G00RA3-7

Overview

74LVC2G00RA3-7 from Diodes Incorporated is a dual 2-input NAND gate in X2-DFN1210-8 package, operating from 1.65V to 5.5V supply, delivering ±24mA output drive at 3.3V with IOFF-enabled partial power-down isolation. It features Schmitt-trigger inputs (100mV typical hysteresis at VCC = 3.0V) and supports voltage-level shifting between mixed-supply domains in portable electronics.

For engineers reviewing the 74LVC2G00RA3-7 datasheet, 74LVC2G00RA3-7 pinout, 74LVC2G00RA3-7 application, or 74LVC2G00RA3-7 equivalent, key selection criteria include IOFF leakage (<±10μA), propagation delay (0.7–5.4ns across VCC), input tolerance up to 5.5V, and thermal resistance (θJA = 395°C/W) for compact DFN layout.

Technical Context

This logic gate implements two independent positive-logic NAND functions (Y = A·B) with push-pull CMOS outputs. Its IOFF circuitry actively disables outputs during power-down, blocking reverse current flow when VCC = 0V while inputs remain biased at up to 5.5V - critical for hot-swap and multi-rail isolation.

Schmitt-trigger inputs provide noise immunity against slow-rising/falling signals (Δt/ΔV ≤10 ns/V above 2.7V), and the device meets JESD22 ESD ratings (2kV HBM, >1kV CDM) and JESD78 latch-up immunity (>100mA), enabling robust operation in consumer and industrial edge nodes.

Key Specifications

Pinout & Package

X2-DFN1210-8 package: 1.2mm × 1.0mm × 0.35mm body, 0.3mm lead pitch, exposed thermal pad (pin #4 GND), compliant with IPC-7351B footprint standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input NAND gate applications.

Compared with SN74LVC2G00DPWR and 74AUP2G00GW,125, the 74LVC2G00RA3-7 uniquely combines sub-1.3mm² footprint, IOFF-enabled power-domain isolation, and Schmitt-trigger noise immunity - making it optimal for space-constrained, multi-rail portable designs requiring robust signal conditioning.

Availability

74LVC2G00RA3-7 is available at Aetrix Electronics and suitable for USB peripheral control, smartphone display interface, IoT sensor node wake-up logic, and industrial PLC input conditioning requiring stable component supply and guaranteed long-term sourcing.

Supply support for 74LVC2G00RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, computing, and industrial markets.

The 74LVC logic family targets low-voltage, mixed-supply digital interfacing with emphasis on power-down safety, wide voltage compatibility, and compact packaging for portable and space-constrained applications.

FAQ

Does 74LVC2G00RA3-7 support true bidirectional level shifting?

No - it is a unidirectional logic gate. While its inputs tolerate 5.5V with VCC as low as 1.65V, the outputs swing only between GND and VCC. True bidirectional level shifting requires dedicated translators like TXB0104 or ADG3304, not NAND gates.

Can unused inputs be left floating?

No - per datasheet Note 9, all unused inputs must be tied to VCC or GND. Floating inputs cause increased ICC, potential oscillation due to Schmitt-trigger metastability, and elevated EMI susceptibility. A 10kΩ pull-up/down resistor is recommended for unused pins.

What is the maximum capacitive load this device can drive reliably?

At 3.3V supply and 24mA drive, the device maintains specified tpd up to 30pF (per test condition in Figure 1). Driving >30pF increases propagation delay nonlinearly and may cause ringing; add series termination or buffer for loads exceeding this value.

Is the exposed thermal pad electrically connected?

Yes - the exposed pad (pin #4 GND) is internally connected to the substrate ground plane. It must be soldered to a PCB thermal pad tied to system GND for both thermal dissipation (θJA = 395°C/W assumes this) and electrical stability; floating the pad degrades ESD performance and timing.