Nexperia USA Inc. 74LVC2G04GXZ

Overview

74LVC2G04GXZ from Nexperia is a dual CMOS inverter with Schmitt-trigger inputs, designed for level translation between 3.3 V and 5 V logic domains in mixed-voltage digital systems. It operates from 1.65 V to 5.5 V, delivers ±24 mA output drive at 3.0 V, features IOFF partial power-down protection, and is rated for −40 °C to +125 °C operation in the X2SON6 (SOT1255-2) package.

For engineers reviewing the 74LVC2G04GXZ datasheet, 74LVC2G04GXZ pinout, 74LVC2G04GXZ application, or 74LVC2G04GXZ equivalent, key selection criteria include its overvoltage-tolerant 5.5 V inputs, guaranteed propagation delay ≤3.8 ns at 5.5 V, IOFF-enabled bus hold during power sequencing, and thermal-enhanced X2SON6 footprint for high-density PCB layouts.

Technical Context

This device implements two independent inverting buffers with hysteresis on all inputs, enabling robust noise immunity against slow-rising or noisy signals. Its IOFF circuit actively disables outputs when VCC = 0 V, blocking backflow current in partial-power-down configurations such as hot-swap or multi-rail power management.

The logic function follows standard inverter truth table (L→H, H→L), with input thresholds scaled to VCC (e.g., VIH = 0.7VCC at 4.5–5.5 V). Propagation delay is characterized across full voltage and temperature range, with typical tpd = 1.9 ns at VCC = 5.0 V and Tamb = 25 °C.

Key Specifications

Pinout & Package

X2SON6 (SOT1255-2) package: plastic thermal-enhanced extremely thin small outline, no leads, 6 terminals, body size 1.0 × 0.8 × 0.32 mm, exposed thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual inverter applications.

Compared with SN74LVC2G04DBVR and 74AUP2G04GW, the 74LVC2G04GXZ uniquely combines 5.5 V input tolerance, IOFF, and thermal-enhanced X2SON6 packaging-making it optimal for compact, mixed-voltage industrial and automotive control designs requiring robust power sequencing.

Availability

74LVC2G04GXZ is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, USB-C power delivery sequencing, automotive body control modules, and IoT sensor hub signal conditioning requiring stable component supply across extended temperature ranges and mixed-voltage logic interfaces.

Supply support for 74LVC2G04GXZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions for industrial, automotive, and consumer markets.

The 74LVC2G04GXZ belongs to Nexperia's LVC (Low-Voltage CMOS) logic family, engineered for interoperability across voltage domains and robust operation in harsh environments with emphasis on power sequencing safety and ESD resilience.

FAQ

Can 74LVC2G04GXZ be used as a level shifter between 5 V and 3.3 V logic?

Yes. Its inputs tolerate up to 5.5 V regardless of VCC, allowing direct connection to 5 V outputs while powered from 3.3 V. The output swings rail-to-rail (0 V to 3.3 V), making it suitable for unidirectional 5 V → 3.3 V translation. For bidirectional translation, external resistors or dedicated translators are required.

What is the purpose of the IOFF feature in this device?

The IOFF circuit disables both outputs when VCC = 0 V, placing them in high-impedance state. This prevents damaging backflow current from live system buses into a powered-down section-critical for hot-swap capability, multi-rail power sequencing, and partial system shutdown in industrial controllers.

Does the 74LVC2G04GXZ require external pull-up or pull-down resistors on unused inputs?

No. Unused inputs should be tied to VCC or GND to prevent floating states, but external resistors are unnecessary due to the Schmitt-trigger input structure, which inherently avoids metastability. Leaving inputs unconnected risks increased ICC and unpredictable output behavior.

How does the X2SON6 (SOT1255-2) package differ from standard XSON6 variants?

The X2SON6 package features enhanced thermal performance via optimized die attach and internal thermal path design, achieving lower junction-to-board thermal resistance than SOT886/SOT1202. Its 1.0 × 0.8 mm footprint and 0.32 mm height provide superior board space efficiency and thermal dissipation for high-density applications like portable medical devices and automotive ECUs.