Diodes Incorporated 74LVC2G06FZ4-7

Overview

74LVC2G06FZ4-7 from Diodes Incorporated is a dual CMOS inverter with open-drain outputs, designed for voltage-level shifting and signal isolation in mixed-voltage systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs, supports IOFF partial power-down mode, delivers up to 32mA sink current at 4.5V, and is packaged in X2-DFN1410-6 (1.4mm × 1.0mm × 0.4mm).

For engineers reviewing the 74LVC2G06FZ4-7 datasheet, 74LVC2G06FZ4-7 pinout, 74LVC2G06FZ4-7 application, or 74LVC2G06FZ4-7 equivalent, this device serves as a compact, low-power logic buffer for I²C bus extension, power-down signal gating, and wired-OR logic implementation in space-constrained embedded designs.

Technical Context

The 74LVC2G06FZ4-7 integrates two independent inverters, each with an open-drain output enabling active-low wired-OR and active-high wired-AND configurations. Its IOFF circuitry disables both outputs when VCC = 0V, preventing back-current flow during partial power-down sequences.

Input thresholds are VIL ≤ 0.35×VCC (1.65–1.95V), VIH ≥ 0.65×VCC (1.65–1.95V), ensuring reliable TTL- and CMOS-compatible switching across its full 1.65–5.5V supply range. Propagation delay is 2.9ns max at 5V (CL = 50pF, TA = –40°C to +85°C).

Key Specifications

Pinout & Package

X2-DFN1410-6 package: 1.4mm × 1.0mm × 0.4mm body, 0.5mm pad pitch, bottom-side thermal pad, leadless RoHS-compliant construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual inverter with open-drain output applications.

Compared with SN74LVC2G06DBVR and 74LVC2G06FW5-7, the 74LVC2G06FZ4-7 offers optimal balance: 1.4mm × 1.0mm footprint fits dense layouts, 0.5mm pad pitch eases manufacturability, and 430°C/W θJA supports moderate power dissipation without thermal derating.

Availability

74LVC2G06FZ4-7 is available at Aetrix Electronics and suitable for I²C bus extension, power-down signal isolation, and wired-OR logic applications requiring stable component supply across automotive, industrial, and consumer electronics programs.

Supply support for 74LVC2G06FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for power management, signal integrity, and protection.

The 74LVC2G06 belongs to Diodes' LVC logic family-designed specifically for low-voltage, mixed-signal interfacing in portable, automotive, and industrial systems where voltage translation and power-aware operation are essential.

FAQ

Can 74LVC2G06FZ4-7 drive an I²C bus directly?

Yes. Its open-drain outputs, 5.5V-tolerant inputs, and 32mA sink capability allow direct connection to I²C SDA/SCL lines with appropriate external pull-up resistors. It supports standard (100kHz) and fast-mode (400kHz) speeds with propagation delay under 3ns, meeting I²C timing budgets without additional buffering.

What happens to outputs during power-down?

When VCC = 0V, the IOFF circuit activates, placing both 1Y and 2Y outputs in high-impedance state. Measured IOFF leakage is ±20μA maximum, preventing damaging back-current flow into powered-down sections-critical for hot-swap and multi-rail system reliability.

Is external pull-up required for open-drain operation?

Yes. Open-drain outputs cannot source current; an external pull-up resistor to a valid voltage rail (e.g., 3.3V or 5V) is mandatory for logic HIGH generation. Typical values range from 1kΩ (for speed-critical 10MHz signals) to 10kΩ (for low-power I²C), selected based on rise time and bus capacitance.

How does thermal performance compare across DFN variants?

The X2-DFN1410-6 package has θJA = 430°C/W, lower than X2-DFN1409-6 (450°C/W) and X1-DFN1010-6 (495°C/W). This 65°C/W improvement reduces junction temperature rise by ~14°C at 10mW dissipation, enhancing long-term reliability in enclosed industrial enclosures without forced airflow.