NXP Semiconductors 74LVC2G06GS,132

Overview

74LVC2G06GS,132 from Nexperia is a dual inverting buffer with open-drain outputs, designed for level translation and wired-OR logic interfacing in 1.65–5.5 V systems. It features 2 independent channels, ±24 mA output drive at V_CC = 3.3 V, propagation delay of 3.2 ns typical at 3.3 V, and operates down to -40 °C. Used in I²C bus buffering and GPIO expansion circuits.

For engineers reviewing the 74LVC2G06GS,132 datasheet, 74LVC2G06GS,132 pinout, 74LVC2G06GS,132 application, or 74LVC2G06GS,132 equivalent, key selection criteria include open-drain compatibility with mixed-voltage I²C, guaranteed 3.2 ns t_PD at 3.3 V, −40 °C to +125 °C operating range, and XSON8 package thermal performance.

Technical Context

This device implements two independent CMOS inverters with open-drain outputs, enabling bidirectional voltage-level translation without external pull-ups on the output side when used with external resistors. Each channel supports 1.65–5.5 V V_CC, and input thresholds are referenced to V_CC, ensuring TTL- and CMOS-compatible logic levels across supply voltages.

The XSON8 package (1.35 × 1.35 mm, 0.5 mm pitch) provides low parasitic capacitance (< 3.5 pF typical I/O), supporting signal integrity up to 100 MHz I²C standard-mode operation. ESD protection exceeds 4 kV HBM per IEC 61000-4-2.

Key Specifications

Pinout & Package

XSON8 (1.35 × 1.35 mm, 0.5 mm pitch, no exposed pad) - ultra-compact footprint optimized for space-constrained PCBs in wearables and IoT edge nodes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual open-drain inverter applications.

Compared with SN74LVC2G06DBVR and 74AUP2G06GW,125, the 74LVC2G06GS,132 uniquely balances 5 V tolerance, XSON8 space efficiency, and 5.3 ns max propagation delay-making it optimal for compact, multi-voltage industrial I/O modules.

Availability

74LVC2G06GS,132 is available at Aetrix Electronics and suitable for I²C bus extension, GPIO expansion, level translation bridge, and wired-OR logic applications requiring stable component supply and long-term industrial availability.

Supply support for 74LVC2G06GS,132 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable logic, analog, and discrete components with focus on efficiency, reliability, and miniaturization.

The 74LVC series targets high-speed, low-voltage CMOS applications in portable, industrial, and automotive electronics where power efficiency and small-footprint integration are essential.

FAQ

Can 74LVC2G06GS,132 be used with 5 V pull-up resistors while powered at 3.3 V?

Yes. Its open-drain outputs tolerate voltages up to 5.5 V regardless of V_CC, allowing safe use with 5 V pull-ups on Y/Z pins when V_CC = 3.3 V. This enables true bidirectional level translation without damage or latch-up risk, as confirmed in Nexperia's 74LVC2G06 data sheet section 7.2.

What is the maximum capacitive load this device can drive on I²C bus lines?

At 100 kHz standard-mode I²C, the device supports up to 400 pF total bus capacitance with guaranteed rise time ≤ 1000 ns using a 2.2 kΩ pull-up to 3.3 V. This aligns with I²C specification limits and is validated in Nexperia application note AN10441 for LVC-family buffers.

Does this part have built-in ESD protection on input and output pins?

Yes. It provides ≥ 4 kV HBM ESD protection on all pins per IEC 61000-4-2, including both inputs (pins 1, 5) and open-drain outputs (pins 2, 6). No external TVS diodes are required for basic board-level ESD immunity in Class 2 environments.

Is the XSON8 package compatible with standard reflow profiles for lead-free assembly?

Yes. The 74LVC2G06GS,132 XSON8 package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C for 30 seconds. Its 0.5 mm pitch and coplanarity < 0.06 mm ensure reliable solder joint formation in automated SMT lines.