Diodes Incorporated 74LVC2G07FW4-7

Overview

74LVC2G07FW4-7 from Diodes Incorporated is a dual buffer IC with open-drain outputs, designed for voltage-level shifting and signal isolation in mixed-voltage systems. It operates from 1.65V to 5.5V, tolerates 5.5V inputs, supports IOFF partial power-down mode, delivers up to 32mA sink current at 4.5V, and uses the X2-DFN1010-6 (1.0mm × 1.0mm) package for space-constrained logic interfacing.

For engineers reviewing the 74LVC2G07FW4-7 datasheet, 74LVC2G07FW4-7 pinout, 74LVC2G07FW4-7 application, or 74LVC2G07FW4-7 equivalent, this device is selected for bidirectional level translation, power-down-safe bus driving, and wired-OR logic implementation where low quiescent current (<40μA), ESD robustness (>2kV HBM), and 3.7ns max propagation delay at 3.3V are critical design requirements.

Technical Context

This dual buffer implements two independent 1-input logic gates with open-drain outputs, enabling active-low wired-OR and active-high wired-AND configurations when multiple outputs share a common pull-up. Its IOFF circuit actively disables output leakage during power-down, preventing backflow currents in partially powered systems.

The device features 5.5V-tolerant inputs across its full 1.65V–5.5V VCC range, allowing seamless interface between 1.8V, 2.5V, 3.3V, and 5V domains. Input thresholds scale with VCC (e.g., VIH = 0.7×VCC at 4.5–5.5V), and output VOL remains ≤0.60V at 16mA sink under 3V operation.

Key Specifications

Pinout & Package

X2-DFN1010-6 is a 6-pin, leadless, bottom-terminal chip-scale package with 0.35mm pad pitch and exposed thermal pad (not electrically connected). Pin 1 identification is marked by a chamfered corner on the top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual open-drain buffer applications.

Compared with SN74LVC2G07DPWR, 74LVC2G07FW4-7 offers identical performance and footprint but different tape-and-reel packaging and manufacturer-specific quality documentation; versus 74LVC2G07GW,125, it provides tighter propagation delay and superior ESD immunity at marginally higher unit cost.

Availability

74LVC2G07FW4-7 is available at Aetrix Electronics and suitable for USB interface design, IoT sensor aggregation, industrial PLC input conditioning, and SSD power sequencing requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for 74LVC2G07FW4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal devices, with emphasis on high-reliability, energy-efficient components for industrial, computing, and consumer markets.

The 74LVC logic family targets low-voltage, high-speed digital interfacing applications, emphasizing wide supply range, voltage tolerance, and power-down safety for modern multi-rail electronic systems.

FAQ

Can 74LVC2G07FW4-7 be used for bidirectional level shifting?

No - it is unidirectional: inputs accept 5.5V signals regardless of VCC, but outputs are open-drain and can only sink current. True bidirectional level shifting requires dedicated translators like TXB0104. This device supports level translation only from higher-voltage inputs to lower-voltage logic domains via pull-up configuration.

What is the purpose of the IOFF feature in practical system design?

IOFF disables the output FETs when VCC = 0V, blocking current flow from powered downstream circuits (e.g., 3.3V bus) into the unpowered IC. This prevents damage and unintended logic states during hot-plug events, partial power-down sequences, or firmware-controlled rail shutdown in complex power architectures.

Is an external pull-up resistor required for 74LVC2G07FW4-7 operation?

Yes - open-drain outputs cannot source current. A pull-up resistor must connect each Y output (pins 4 and 6) to the target logic domain's supply (e.g., 3.3V or 5V). Value selection balances speed (lower R) against power (higher R); typical values range from 1kΩ to 10kΩ depending on bus capacitance and rise-time requirements.

How does the X2-DFN1010-6 package differ from X1-DFN1010-6 in layout and thermal performance?

X2-DFN1010-6 has a thinner profile (0.4mm vs. 0.5mm), different terminal geometry (b = 0.17mm vs. 0.15mm), and higher thermal resistance (θJA = 510°C/W vs. 495°C/W). Its pad layout requires tighter solder mask definition and is optimized for automated reflow with reduced warpage risk in fine-pitch assembly processes.