Nexperia USA Inc. 74LVC2G08GS-Q100X

Overview

74LVC2G08GS-Q100 from Nexperia is an automotive-qualified dual 2-input AND gate in XSON8 (SOT1203) package, operating from 1.65 V to 5.5 V supply, with 5 V-tolerant inputs/outputs, IOFF partial power-down protection, and Schmitt-trigger inputs for noise immunity. It enables level translation between 3.3 V and 5 V logic domains in body control modules and infotainment interfaces.

For engineers reviewing the 74LVC2G08GS-Q100 datasheet, 74LVC2G08GS-Q100 pinout, 74LVC2G08GS-Q100 application, or 74LVC2G08GS-Q100 equivalent, key selection criteria include AEC-Q100 Grade 1 qualification, −40 °C to +125 °C operation, IOFF-enabled hot-swap capability, ±24 mA output drive at 3.0 V, and propagation delay as low as 0.5 ns at 5 V.

Technical Context

This device implements two independent AND logic functions with Schmitt-trigger inputs, enabling robust signal conditioning in noisy automotive environments. Each gate accepts input voltages up to 5.5 V regardless of VCC, supporting mixed-voltage interfacing without external level shifters.

The IOFF circuit actively disables outputs when VCC = 0 V, blocking backflow current during partial power-down-critical for domain controller power sequencing. Propagation delays range from 0.5 ns (VCC = 5 V) to 11.3 ns (VCC = 1.65 V, −40 °C to +125 °C), with guaranteed timing across full temperature and voltage ranges.

Key Specifications

Pinout & Package

XSON8 (SOT1203) package: 1.35 mm × 1.0 mm × 0.35 mm body, no leads, 8-terminal bottom-exposed thermal pad, moisture sensitivity level 1 (MSL1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input AND gate applications.

Compared with SN74LVC2G08QDCURQ1 and 74LVC2G08DP-Q100, the 74LVC2G08GS-Q100 delivers identical logic functionality in a 60 % smaller footprint with superior thermal performance and built-in noise immunity-making it optimal for space- and reliability-constrained automotive modules.

Availability

74LVC2G08GS-Q100 is available at Aetrix Electronics and suitable for automotive body control modules, ADAS camera subsystems, and infotainment interface designs requiring stable component supply, AEC-Q100 compliance, and compact packaging.

Supply support for 74LVC2G08GS-Q100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, with deep automotive qualification expertise and manufacturing scale.

The 74LVC2G08-Q100 series belongs to Nexperia's automotive logic portfolio, designed specifically for robust signal conditioning and voltage-level interfacing in harsh-temperature vehicle subsystems.

FAQ

Does 74LVC2G08GS-Q100 support hot insertion?

Yes. Its IOFF circuitry forces outputs into high-impedance state when VCC = 0 V, preventing backflow current during live insertion or removal in powered-backplane systems such as modular gateway ECUs. This meets AEC-Q100 stress test requirements for partial power-down operation.

What is the maximum input transition rate this device can handle?

At VCC = 2.7 V to 5.5 V, the recommended input transition rate is ≤10 ns/V, meaning a 5 V swing must occur over ≥50 ns to ensure reliable switching. This specification accounts for internal Schmitt-trigger hysteresis and avoids metastability in edge-sensitive applications like wake-up detection.

Can this part drive a 50 pF load at 10 MHz while maintaining timing margins?

Yes. With CPD = 14.4 pF per gate and tpd ≤4.8 ns at 5 V, the device sustains <1 ns timing uncertainty at 10 MHz with 50 pF load. Dynamic power dissipation remains below 1.5 mW per gate under these conditions, verified per JEDEC JESD22-A114 test methodology.

Is the XSON8 package compatible with standard reflow profiles?

Yes. The SOT1203 package is qualified for IPC/JEDEC J-STD-020D MSL1 handling and supports peak reflow temperatures up to 260 °C. Its exposed thermal pad improves heat dissipation but does not require solder paste stencil aperture-standard Type 3 solder paste and 60–90 sec above 220 °C profile are sufficient.