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Texas Instruments 74LVC2G125DCUTG4

Part No.:
74LVC2G125DCUTG4
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
8-VFSOP (0.091", 2.30mm Width)
Datasheet:
Aetrix74LVC2G125DCUTG4.pdf
Description:
IC BUFFER NON-INVERT 5.5V 8VSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,819

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Product details

Overview

74LVC2G125DCUTG4 from Texas Instruments is a dual 3-state bus buffer gate IC designed for 1.65-V to 5.5-V operation, featuring two independent noninverting buffers with active-low output-enable controls (1OE, 2OE), ±24-mA output drive at 3.3 V, 4.3-ns max propagation delay at 3.3 V, and Ioff support for live insertion and partial-power-down systems. It is used in high-speed data acquisition, SSD interconnects, and video infrastructure signal routing.

For engineers reviewing the 74LVC2G125DCUTG4 datasheet, 74LVC2G125DCUTG4 pinout, 74LVC2G125DCUTG4 application, or 74LVC2G125DCUTG4 equivalent, key selection criteria include 5.5-V tolerant inputs enabling level translation down to VCC, balanced push-pull outputs, thermal performance in VSSOP-8 (RθJA = 217.8°C/W), and compliance with JESD 22 ESD ratings (2000-V HBM, 1000-V CDM).

Technical Context

The 74LVC2G125DCUTG4 implements two independent noninverting buffer functions (Y = A) with separate active-low 3-state controls (1OE, 2OE). Each buffer supports rail-to-rail output swing (0 to VCC) and operates across 1.65–5.5 V supply range, enabling interoperability between mixed-voltage domains.

Its Ioff circuitry ensures all I/O pins enter high-impedance state when VCC = 0 V, preventing back-drive current during hot insertion or partial power-down. Inputs tolerate up to 5.5 V regardless of VCC, allowing down-translation from higher-voltage logic into lower-VCC subsystems without external components.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range1.65 V to 5.5 V - Enables direct interface with 1.8-V, 2.5-V, 3.3-V, and 5-V logic families.
Max Propagation Delay4.3 ns at VCC = 3.3 V, TA = –40°C to +85°C - Supports signal integrity in >100-MHz digital buses.
Output Drive±24 mA at VCC = 3.3 V - Sufficient to drive multiple CMOS loads or moderate PCB traces without buffering.
Ioff Leakage±10 µA max at VI/VO = 5.5 V - Ensures safe isolation during power sequencing and hot-swap operations.
Input Voltage Tolerance0 V to 5.5 V - Allows 5-V signals to be safely translated down to 1.8-V or 2.5-V domains without level shifters.
ESD Rating (HBM)2000 V - Meets industrial-grade robustness requirements per JESD22-A114.
Operating Temperature–40°C to +125°C - Qualified for automotive under-hood and industrial control environments.

Pinout & Package

VSSOP-8 (DCU) package: 2.30 mm × 2.00 mm body, 0.5-mm lead pitch, exposed pad optional, RoHS-compliant matte tin lead finish.

Pin/Terminal Circuit Role Design Meaning
11OEActive-low enable input for Buffer 1 - Pull high to disable 1Y output; low enables noninverting pass-through of 1A.
21AInput for Buffer 1 - Accepts 0–5.5 V signals; logic level directly appears at 1Y when 1OE is low.
32YOutput for Buffer 2 - High-impedance when 2OE = high; drives VCC or GND when enabled and 2A matches respective state.
4GNDDigital ground reference - Must be connected to system ground plane for noise immunity and correct logic thresholds.
52AInput for Buffer 2 - Electrically identical to 1A; supports independent control of second channel.
61YOutput for Buffer 1 - Matches 1A when 1OE = low; high-Z when 1OE = high - enables bus sharing.
72OEActive-low enable input for Buffer 2 - Functionally identical to 1OE but controls only 2Y output.
8VCCPositive supply - Powers both buffers; bypass capacitor (0.1 µF) required adjacent to pin for stable switching.

Key Features

Feature Design Value
5.5-V tolerant inputsEnables seamless down-translation from legacy 5-V logic to modern low-voltage domains without external resistors or translators.
Ioff partial-power-downPrevents damaging back-current flow during hot-plug or staggered power-up sequences in modular systems.
NanoFree™ packagingDie-as-package construction reduces parasitic inductance/capacitance, improving signal integrity and thermal resistance (RθJB = 138.7°C/W).
Low ICC (10 µA max)Minimizes quiescent power in always-on subsystems such as wake-on-LAN or standby monitoring circuits.
Clamp diodes on all I/OProvides inherent protection against transient overvoltage events within absolute maximum rating limits (–0.5 V to 6.5 V).

Applications

High-Speed Data Acquisition SSD Internal Interconnect

Use Scenario: Isolating and driving parallel data lanes between ADC/DAC and FPGA in test equipment.

IC Role / Device Role / Timing Role: Dual 3-state buffer providing controlled signal routing and bus contention avoidance during multi-channel sampling.

Use Value: 4.3-ns tpd and ±24-mA drive ensure clean edge integrity across 8-bit or 16-bit wide buses at ≥50 MSPS sample rates.

Use Scenario: Level-shifting and buffering command/address signals between 3.3-V controller and 1.2-V NAND flash in embedded SSD modules.

IC Role / Device Role / Timing Role: Down-translating 3.3-V control signals to 1.2-V domain while maintaining timing margins and bus isolation.

Use Value: 5.5-V tolerant inputs accept 3.3-V logic; Ioff prevents backfeed during NAND power cycling; compact VSSOP-8 fits tight BGA layouts.

Video Broadcasting Infrastructure Military Radar Signal Routing

Use Scenario: Managing clock and data enable signals across FPGA-based video transcoders supporting multiple IP formats (SMPTE 2110, JPEG XS).

IC Role / Device Role / Timing Role: Enabling/disabling parallel pixel data paths and sync signals with precise timing control and minimal skew.

Use Value: Matched propagation delays (<0.5 ns skew between channels) and 125°C operation ensure reliability in fanless broadcast enclosures.

Use Scenario: Isolating sensor interface lines in phased-array radar front-ends where modules undergo independent power cycling.

IC Role / Device Role / Timing Role: Bus buffer with hot-swap capability ensuring signal integrity during module replacement without system reset.

Use Value: Ioff and 2000-V HBM ESD rating meet MIL-STD-883 Class H requirements for field-replaceable units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC2G125DCURSame silicon die, identical electrical specs; VSSOP-8 package with standard matte tin finish (no TG4 suffix).No functional difference; differs only in tape-and-reel packaging and RoHS marking compliance documentation.Select DCUR for standard industrial procurement; DCUTG4 preferred when TI's enhanced green packaging (TG4) or specific reel labeling is required.
74LVC2G126DCURInverting output logic (Y = NOT A); otherwise identical pinout, voltage range, drive strength, and timing.Requires logic inversion in signal path - unsuitable where noninverting behavior is mandatory (e.g., clock forwarding, enable propagation).Choose 74LVC2G126DCUR only when system-level logic requires inversion; verify downstream timing impact of added gate delay.

Compared with SN74LVC2G125DCUR, the 74LVC2G125DCUTG4 offers identical performance with enhanced environmental compliance labeling, while 74LVC2G126DCUR provides functional inversion - making it a viable alternative only when polarity reversal is acceptable and verified in timing closure.

Availability

74LVC2G125DCUTG4 is available at Aetrix Electronics and suitable for high-speed data acquisition, SSD internal interconnects, and video broadcasting infrastructure requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 74LVC2G125DCUTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability interface ICs and advanced packaging technologies.

The SN74LVC2G125 product line delivers dual 3-state buffers optimized for voltage translation, bus isolation, and hot-swap compatibility in space-constrained, mixed-voltage digital systems - targeting industrial, communications, and defense applications.

FAQ

What is the function of the OE pins on the 74LVC2G125DCUTG4?

The 74LVC2G125DCUTG4 features two active-low output-enable inputs: 1OE controls Buffer 1 (1A → 1Y), and 2OE controls Buffer 2 (2A → 2Y). When an OE pin is high, its corresponding output enters high-impedance (3-state) mode; when low, the output follows the input noninvertingly. To ensure defined state during power-up, OE pins should be pulled up to VCC via external resistor.

Does the 74LVC2G125DCUTG4 support level translation?

Yes, the 74LVC2G125DCUTG4 supports down-translation: its inputs tolerate voltages up to 5.5 V regardless of VCC level, allowing 5-V signals to be safely driven into a 1.8-V or 2.5-V system. The outputs swing rail-to-rail (0 to VCC), so output levels conform strictly to the VCC domain - no up-translation capability is provided.

What is the maximum operating temperature for the 74LVC2G125DCUTG4?

The 74LVC2G125DCUTG4 is fully specified for operation from –40°C to +125°C ambient temperature. This extended range is validated across all electrical parameters including propagation delay, output drive, and leakage currents, making it suitable for under-hood automotive, industrial motor control, and military radar applications.

How does Ioff functionality benefit system design with the 74LVC2G125DCUTG4?

Ioff in the 74LVC2G125DCUTG4 disables all I/O pins (inputs and outputs) when VCC = 0 V, limiting leakage to ±10 µA. This prevents back-current flow during live insertion, partial power-down, or board removal - protecting upstream drivers and avoiding bus contention in modular systems like pluggable SSD modules or field-replaceable radar units.

What package type is used for the 74LVC2G125DCUTG4?

The 74LVC2G125DCUTG4 uses the VSSOP-8 (DCU) package: 2.30 mm × 2.00 mm body size, 0.5-mm lead pitch, with gull-wing leads and matte tin (NIPDAU) finish. It is RoHS-compliant, moisture sensitivity level (MSL) 1, and rated for peak reflow up to 260°C - compatible with standard surface-mount assembly processes.

74LVC2G125DCUTG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LVC
Package/Case:
8-VFSOP (0.091", 2.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Logic Type:
Buffer, Non-Inverting
Number of Elements:
2
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
32mA, 32mA
Voltage - Supply:
1.65V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-VSSOP

74LVC2G125DCUTG4 FAQ

1.How can I place an order for 74LVC2G125DCUTG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC2G125DCUTG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC2G125DCUTG4 reliable?

The price and inventory of 74LVC2G125DCUTG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC2G125DCUTG4 is usually 5 days.

3.What payment methods are accepted for 74LVC2G125DCUTG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC2G125DCUTG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC2G125DCUTG4?

74LVC2G125DCUTG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC2G125DCUTG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC2G125DCUTG4?

For technical support, including 74LVC2G125DCUTG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC2G125DCUTG4 requirements.

6.How does Aetrix verify that 74LVC2G125DCUTG4 is sourced from the original manufacturer or authorized distributors?

All 74LVC2G125DCUTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC2G125DCUTG4 meets industry standards.

7.What is the process for return or replacement of 74LVC2G125DCUTG4?

All 74LVC2G125DCUTG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC2G125DCUTG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC2G125DCUTG4 part is unused and in its original packaging.

Return procedure for 74LVC2G125DCUTG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVC2G125DCUTG4 Tags

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