Diodes Incorporated 74LVC2G14FX4-7

Overview

74LVC2G14FX4-7 from Diodes Incorporated is a dual Schmitt trigger inverter IC in X2-DFN1409-6 package (1.4 mm × 0.9 mm, 0.5 mm pad pitch), operating from 1.65 V to 5.5 V supply, with 5.5 V-tolerant inputs and ±24 mA output drive at 3.0 V. It supports partial power-down via IOFF, enables voltage level shifting between mixed-voltage domains, and is used in signal conditioning for portable computing peripherals.

For engineers reviewing the 74LVC2G14FX4-7 datasheet, 74LVC2G14FX4-7 pinout, 74LVC2G14FX4-7 application, or 74LVC2G14FX4-7 equivalent, key selection criteria include hysteresis width (0.70–1.90 V across VCC), propagation delay (≤4.7 ns at 5 V), IOFF leakage (<±20 μA), input threshold symmetry, and DFN thermal resistance (θJA = 450 °C/W).

Technical Context

This device implements two independent Schmitt-trigger inverters with push-pull outputs and IOFF circuitry that disables both outputs during power-down to prevent back-current flow. Its input hysteresis (ΔVT = 0.70–1.90 V) ensures noise immunity in noisy digital interfaces, while rail-to-rail input tolerance (0–5.5 V) allows interoperability across 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains.

The X2-DFN1409-6 package features NiPdAu-plated terminals, moisture sensitivity level 1, and a 0.5 mm pad pitch optimized for high-density PCB layouts. Electrical behavior is fully characterized from –40 °C to +125 °C, with guaranteed performance at 30 pF/50 pF loads and input rise/fall times ≤2.5 ns.

Key Specifications

Pinout & Package

X2-DFN1409-6 is a leadless, bottom-terminal chip-scale package measuring 1.4 mm × 0.9 mm × 0.4 mm with 0.5 mm pad pitch and NiPdAu finish. Pin 1 identification is marked by a circular fiducial on the top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schmitt trigger inverter applications.

Compared with SN74LVC2G14DCKR and 74LVC2G14FW4-7, the 74LVC2G14FX4-7 balances miniaturization (1.26 mm² area) with manufacturability (0.5 mm pitch), offering 15% smaller footprint than SOT23-6 and 11% larger pad clearance than X2-DFN1010-6 - ideal for production-ready portable electronics.

Availability

74LVC2G14FX4-7 is available at Aetrix Electronics and suitable for USB Type-C port detection, SD card interface signal conditioning, and industrial sensor wake-up circuits requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for 74LVC2G14FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs, with design centers in Asia, Europe, and the U.S., and manufacturing in certified facilities worldwide.

The 74LVC logic family targets low-voltage, high-speed digital interfacing in portable and power-sensitive applications, emphasizing wide supply range, IOFF safety, and compact packaging for space-constrained designs.

FAQ

Can 74LVC2G14FX4-7 operate reliably at 1.65 V supply?

Yes. The device is fully specified down to 1.65 V: propagation delay remains ≤12.0 ns (TA = –40 to +125 °C), output drive sustains ≥±4 mA, and input thresholds maintain defined VT+ and VT− windows. At this minimum voltage, ICC stays ≤40 μA, making it suitable for coin-cell or energy-harvesting systems.

What is the maximum capacitive load the outputs can drive while maintaining timing specs?

The datasheet guarantees tPD ≤4.7 ns at VCC = 5 V with CL = 50 pF. Driving >50 pF increases delay nonlinearly and may cause marginal setup/hold timing; for 100 pF loads, measured tPD exceeds 8 ns. Use series termination or buffer stages for heavier loads.

Does IOFF activate automatically when VCC drops below a threshold?

Yes. IOFF circuitry engages when VCC falls near 0 V - no external enable signal is needed. Output leakage remains <±20 μA across –40 to +125 °C, and both 1Y and 2Y enter high-impedance state simultaneously, preventing back-current even if inputs remain at 5.5 V.

Is the X2-DFN1409-6 package compatible with standard reflow profiles?

Yes. With Moisture Sensitivity Level 1 per J-STD-020 and NiPdAu terminations, it supports standard Pb-free reflow (peak 260 °C, 60–90 sec above 217 °C). Recommended pad layout uses 0.5 mm × 0.3 mm solder paste apertures and 0.25 mm stencil thickness for consistent void-free joints.