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Texas Instruments 74LVC2G240DCURE4

Part No.:
74LVC2G240DCURE4
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
8-VFSOP (0.091", 2.30mm Width)
Datasheet:
Aetrix74LVC2G240DCURE4.pdf
Description:
IC BUFFER INVERT 5.5V 8VSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,795

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Product details

Overview

74LVC2G240DCURE4 from Texas Instruments is a dual noninverting buffer/driver with independent 3-state outputs, designed for 1.65-V to 5.5-V VCC operation. It features ±24-mA output drive at 3.3 V, 4.6-ns max propagation delay at 3.3 V, and Ioff support for live insertion and partial-power-down applications. It serves as a level-translating bus driver in low-voltage microcontroller I/O expansion interfaces.

For engineers reviewing the 74LVC2G240DCURE4 datasheet, 74LVC2G240DCURE4 pinout, 74LVC2G240DCURE4 application, or 74LVC2G240DCURE4 equivalent, key selection considerations include its dual-channel 3-state control logic, NanoFree™ VSSOP (DCU) 8-pin package, 5.5-V tolerant inputs, and compatibility with mixed-voltage system interfacing where translation from 5-V logic down to 1.8-V/2.5-V/3.3-V domains is required.

Technical Context

This device implements two independent noninverting buffer channels, each with dedicated active-low output-enable (OE) control. Each channel passes A→Y when OE is low; outputs enter high-impedance state when OE is high. The Ioff circuitry ensures no current backflow during power-off or partial-power-down states.

Input voltage tolerance extends to 5.5 V regardless of VCC (1.65–5.5 V), enabling use as a down-translator. Output VOH/VOL specifications are guaranteed across the full VCC range, with ground bounce (VOLP) <0.8 V and undershoot (VOHV) >2 V at 3.3 V - critical for signal integrity in high-speed digital buses.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 1.65 V to 5.5 V - supports interoperability across 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains.
Max tpd 4.6 ns at 3.3 V - enables reliable timing in sub-100-MHz digital control and address/data bus applications.
Output Drive ±24 mA at 3.3 V - sufficient to drive 50-Ω transmission lines or fan-out to ≥10 LVC loads.
Ioff Current ±10 µA max at 125°C - prevents damaging back-current during hot-swap or partial-power-down sequences.
Input Tolerance 0 V to 5.5 V - allows direct connection of 5-V signals into lower-VCC systems without external level shifters.
ESD Rating 2000-V HBM, 1000-V CDM - meets industrial-grade robustness requirements for board-level handling and operation.
Power Consumption 10 µA max ICC - supports ultra-low-quiescent-power modes in battery-backed or always-on subsystems.

Pinout & Package

VSSOP (DCU) 8-pin package: 2.3 mm × 2.0 mm body, 0.5-mm lead pitch, 0.9-mm max height, exposed pad not present, RoHS-compliant NiPdAu finish, MSL Level-1.

Pin/Terminal Circuit Role Design Meaning
1 1OE Active-low enable for Buffer 1 - drives 1Y high-impedance when high; ties to VCC via pullup for power-up safety.
2 1A Input for Buffer 1 - accepts 0–5.5 V, compatible with 5-V TTL and CMOS logic regardless of VCC.
3 2Y Inverted output? No - noninverting output of Buffer 2 - matches 2A polarity; 3-state when 2OE = high.
4 GND Digital ground reference - must be low-inductance connection to minimize switching noise coupling.
5 2A Input for Buffer 2 - electrically identical to 1A; supports independent signal routing per channel.
6 2OE Active-low enable for Buffer 2 - fully independent of 1OE; enables asymmetric channel control.
7 1Y Noninverting output of Buffer 1 - driven low/high or high-Z based on 1A and 1OE states.
8 VCC Supply voltage input - bypassing with 100-nF ceramic capacitor near pin essential for noise suppression.

Key Features

Feature Design Value
Down-translation capability Accepts 5.5-V inputs while operating at VCC as low as 1.65 V - eliminates need for discrete level shifters in mixed-supply systems.
NanoFree™ packaging Die-as-package construction reduces footprint by >50% vs. standard SOIC-8 - ideal for space-constrained portable and IoT PCBs.
Live-insertion support Ioff limits leakage to ±10 µA during power-off - enables safe hot-plug of daughterboards or modular peripherals.
Low ground bounce VOLP <0.8 V at 3.3 V - maintains signal integrity and reduces EMI in dense, high-speed digital layouts.
Wide temperature range –40°C to +125°C operation - qualified for under-hood automotive, industrial motor control, and outdoor embedded applications.

Applications

Microcontroller I/O Expansion Memory Address Buffering

Use Scenario: Expanding GPIO count of an ARM Cortex-M0+ MCU operating at 3.3 V while interfacing with legacy 5-V peripheral ICs.

IC Role / Device Role / Timing Role: Dual buffer isolates MCU pins from 5-V bus loading; provides level translation and 3-state isolation during reset or sleep.

Use Value: Eliminates external level shifters and reduces BOM count; ±24-mA drive ensures clean edges into 5-V capacitive loads up to 30 pF.

Use Scenario: Driving 16-bit address lines from a low-power FPGA to multiple SRAM chips sharing a common data/address bus.

IC Role / Device Role / Timing Role: Buffers and strengthens address signals; independent OE pins allow dynamic bus partitioning between memory banks.

Use Value: 4.6-ns tpd guarantees setup/hold timing margins at 50-MHz bus clocks; low ICC minimizes static power in always-on memory subsystems.

Industrial Sensor Interface Hub USB-to-Parallel Bridge Logic

Use Scenario: Aggregating digital outputs from eight 24-V industrial sensors (via optocouplers) into a 3.3-V microcontroller input bus.

IC Role / Device Role / Timing Role: Provides noise-immune signal conditioning and voltage translation; 3-state outputs prevent contention during sensor polling cycles.

Use Value: 5.5-V input tolerance accommodates optocoupler output swing; Ioff protects MCU during field-replaceable sensor module hot-swap.

Use Scenario: Converting parallel printer port signals (5-V TTL) to a USB bridge controller's 3.3-V logic interface in embedded print servers.

IC Role / Device Role / Timing Role: Bidirectional buffer stage with controlled enable sequencing - isolates USB controller from legacy parallel bus transients.

Use Value: VOLP <0.8 V prevents false triggering on shared ground planes; ±24-mA drive sustains signal integrity over 10-cm ribbon cables.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC2G240DCTR SSOP-8 (DCT) package: 3.0 mm × 3.0 mm, 0.65-mm pitch, 1.3-mm height - larger footprint, higher θJA (220°C/W). Preferred where hand-soldering, thermal margin, or legacy board compatibility outweigh size constraints. Select DCTR for prototyping, repair, or designs requiring mechanical robustness over miniaturization.
74LVC2G240YZPR DSBGA-8 (YZP) package: 1.5 mm × 1.5 mm, 0.4-mm ball pitch, 0.5-mm height - smallest footprint, requires BGA rework capability. Used in ultra-compact wearables or medical patches where PCB area is premium and automated assembly is available. Choose YZPR only when board space is critical and assembly process supports fine-pitch BGA placement and inspection.

Compared with 74LVC2G240DCURE4, the DCTR offers easier manual handling but sacrifices board density; the YZPR maximizes miniaturization at the cost of assembly complexity - DCU delivers optimal balance of size, thermal performance, and manufacturability for high-volume SMT production.

Availability

74LVC2G240DCURE4 is available at Aetrix Electronics and suitable for industrial automation interfaces, automotive body control modules, and IoT edge node designs requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for 74LVC2G240DCURE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-reliability logic and interface solutions.

The SN74LVC2G240 belongs to TI's LVC logic family - engineered for low-voltage, high-speed, mixed-signal interfacing in space- and power-constrained applications such as portable instrumentation and automotive infotainment gateways.

FAQ

What is the maximum input voltage rating for 74LVC2G240DCURE4?

The 74LVC2G240DCURE4 supports input voltages from –0.5 V to 5.5 V, independent of VCC level. This allows direct connection of 5-V signals even when VCC is as low as 1.65 V, making it suitable as a down-translator in mixed-voltage systems without external components.

Does 74LVC2G240DCURE4 support hot-swap or live-insertion applications?

Yes, the 74LVC2G240DCURE4 incorporates Ioff circuitry that limits off-state current to ±10 µA maximum at 125°C. This prevents damaging back-current flow when the device is powered down while system signals remain active - a key requirement for hot-pluggable modules and modular industrial hardware.

What is the typical propagation delay of 74LVC2G240DCURE4 at 3.3 V?

At VCC = 3.3 V and TA = 25°C, the maximum propagation delay (tpd) of 74LVC2G240DCURE4 is 4.6 ns. This value is measured from input transition (10% to 90%) to output transition (10% to 90%) under standard load conditions (CL = 50 pF, RL = 500 Ω), ensuring timing predictability in 50-MHz digital control paths.

Can 74LVC2G240DCURE4 be used with a 1.8-V supply?

Yes, 74LVC2G240DCURE4 is fully specified for VCC from 1.65 V to 5.5 V. At 1.8 V, it delivers ±8-mA output drive and maintains VIH/VIL thresholds scaled to VCC (e.g., VIH = 0.65 × VCC), enabling seamless integration into 1.8-V FPGA or ASIC I/O banks with guaranteed noise margins.

What package type does 74LVC2G240DCURE4 use, and what are its key mechanical dimensions?

74LVC2G240DCURE4 uses the VSSOP (DCU) 8-pin package: 2.3 mm × 2.0 mm body size, 0.5-mm lead pitch, 0.9-mm maximum height, and JEDEC MO-187 variation CA compliance. Its compact footprint and low profile make it ideal for high-density consumer and portable electronics PCBs.

74LVC2G240DCURE4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LVC
Package/Case:
8-VFSOP (0.091", 2.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Buffer, Inverting
Number of Elements:
2
Number of Bits per Element:
1
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
32mA, 32mA
Voltage - Supply:
1.65V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-VSSOP

74LVC2G240DCURE4 FAQ

1.How can I place an order for 74LVC2G240DCURE4 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC2G240DCURE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC2G240DCURE4 reliable?

The price and inventory of 74LVC2G240DCURE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC2G240DCURE4 is usually 5 days.

3.What payment methods are accepted for 74LVC2G240DCURE4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC2G240DCURE4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC2G240DCURE4?

74LVC2G240DCURE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC2G240DCURE4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC2G240DCURE4?

For technical support, including 74LVC2G240DCURE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC2G240DCURE4 requirements.

6.How does Aetrix verify that 74LVC2G240DCURE4 is sourced from the original manufacturer or authorized distributors?

All 74LVC2G240DCURE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC2G240DCURE4 meets industry standards.

7.What is the process for return or replacement of 74LVC2G240DCURE4?

All 74LVC2G240DCURE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC2G240DCURE4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC2G240DCURE4 part is unused and in its original packaging.

Return procedure for 74LVC2G240DCURE4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVC2G240DCURE4 Tags

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