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Texas Instruments 74LVC2G241DCURE4
- Part No.:
- 74LVC2G241DCURE4
- Manufacturer:
- Texas Instruments
- Package:
- 8-VFSOP (0.091", 2.30mm Width)
- Datasheet:
-
74LVC2G241DCURE4.pdf
- Description:
- IC BUFFER NON-INVERT 5.5V 8VSSOP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
74LVC2G241DCURE4 from Texas Instruments is a dual 1-bit noninverting buffer/driver with independent 3-state outputs, designed for 1.65-V to 5.5-V operation. It delivers ±24-mA output drive at 3.3 V, achieves 4.1-ns max propagation delay, and supports 5.5-V tolerant inputs - enabling level translation from higher-voltage sources into lower-VCC domains. It serves as a redriver in memory-address and clock distribution paths in compact consumer electronics.
For engineers reviewing the 74LVC2G241DCURE4 datasheet, 74LVC2G241DCURE4 pinout, 74LVC2G241DCURE4 application, or 74LVC2G241DCURE4 equivalent, this page provides verified functional modes, Ioff-enabled partial-power-down behavior, NanoFree™ package mechanical data, and validated alternatives for bus interface and signal integrity-critical designs.
Technical Context
The 74LVC2G241DCURE4 implements two independent noninverting buffers, each with dedicated active-low (1OE) and active-high (2OE) output-enable controls. Its Ioff circuitry disables outputs during power-down, blocking back-drive current and supporting live insertion in hot-swap systems.
It operates across 1.65–5.5 V VCC, accepts input voltages up to 5.5 V regardless of VCC level, and maintains guaranteed logic thresholds (VIH/VIL) across all supply voltages. Output drive strength scales with VCC: 4 mA at 1.65 V, 32 mA at 4.5 V, with symmetric ±24-mA capability at 3.3 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - enables interoperability across mixed-voltage subsystems (e.g., 1.8-V logic driving 3.3-V bus) |
| Max Propagation Delay | 4.1 ns at 3.3 V - ensures timing-critical signal redriving without violating setup/hold margins in high-speed interfaces |
| Output Drive Strength | ±24 mA at 3.3 V - sustains robust signal integrity into 50-Ω transmission lines or fan-out loads without external buffering |
| Ioff Current | ±10 µA max - prevents damaging current flow when powered down, critical for partial-power-down system architectures |
| Input Voltage Tolerance | Up to 5.5 V - allows direct connection to 5-V legacy signals while operating at 1.8-V or 2.5-V VCC (down-translation) |
| ESD Protection | ±2000-V HBM - meets industrial-grade reliability requirements without external protection components |
| Operating Temperature | –40°C to +125°C - qualified for automotive under-hood and industrial control environments |
Pinout & Package
VSSOP-8 (DCU) package: 2.30 mm × 2.00 mm body, 0.5-mm lead pitch, exposed pad optional. Compact footprint supports high-density PCB layouts in space-constrained applications such as portable media players and embedded PCs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Input | Data input for first buffer channel; accepts 0–5.5 V regardless of VCC |
| 1OE | Input | Active-low output enable for first channel; low = enabled, high = high-Z |
| 1Y | Output | Noninverting buffered output of 1A; drives bidirectionally with ±24-mA capability at 3.3 V |
| 2A | Input | Data input for second buffer channel; electrically identical to 1A |
| 2OE | Input | Active-high output enable for second channel; high = enabled, low = high-Z |
| 2Y | Output | Noninverting buffered output of 2A; independently controllable from 1Y |
| GND | Power | Ground reference for logic and output stages; must be low-impedance for noise immunity |
| VCC | Power | Supply voltage input (1.65–5.5 V); requires local 0.1-µF bypass capacitor per TI layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ packaging | Dies-as-packages eliminate wirebonds and leadframes, reducing parasitic inductance and improving thermal performance in VSSOP-8 form factor |
| Ioff partial-power-down support | Enables safe insertion/removal in live backplanes by disabling outputs and blocking reverse current when VCC = 0 V |
| 5.5-V tolerant inputs | Eliminates need for external level shifters when interfacing 5-V sensors or legacy peripherals to 1.8-V/2.5-V microcontrollers |
| Low ground bounce (VOLP < 0.8 V) | Minimizes switching noise on shared GND planes, preserving signal integrity in multi-channel digital systems |
| High noise immunity (VOHV > 2 V) | Prevents false triggering from transient undershoot on output lines during fast edge transitions |
Applications
| Memory Address Buffering | USB Hub Signal Redriving |
|---|---|
|
Use Scenario: Driving address lines from a low-power microcontroller to multiple SRAM chips in an embedded PC. IC Role / Device Role / Timing Role: Dual noninverting buffer isolating controller outputs from capacitive bus loading; 1OE/2OE enable staggered activation to reduce simultaneous switching noise. Use Value: 4.1-ns tpd ensures address setup time compliance at 100-MHz bus speeds; ±24-mA drive sustains signal integrity over 5-cm PCB traces. |
Use Scenario: Reinforcing D+ and D− signals between USB 2.0 host controller and downstream ports in a mobile internet device. IC Role / Device Role / Timing Role: Redriver restoring edge rate and amplitude degraded by trace loss and connector insertion loss. Use Value: 5.5-V tolerant inputs accept controller-level signaling; low VOLP/VOHV specs suppress jitter induced by ground bounce on shared USB GND. |
| Automotive Infotainment Bus Interface | Portable Media Player Audio Clock Distribution |
|
Use Scenario: Interfacing a 3.3-V SoC to CAN transceiver and display controller sharing a common 5-V supply rail in a GPS navigation unit. IC Role / Device Role / Timing Role: Level-translating buffer enabling bidirectional communication across voltage domains while maintaining ESD robustness. Use Value: Ioff protection prevents latch-up during ignition-cycle power sequencing; –40°C to +125°C rating supports under-dash mounting. |
Use Scenario: Distributing master audio clock (MCLK) from a CODEC to multiple DACs and ADCs in a digital video camera. IC Role / Device Role / Timing Role: Low-skew, low-jitter buffer minimizing clock phase error across parallel audio channels. Use Value: 2.3-mm × 2.0-mm VSSOP-8 footprint fits tight board real estate; 10-µA ICC minimizes battery drain in always-on audio subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G241DCUT | Same silicon die, identical electrical specs; differs only in tape-and-reel packaging (250-unit vs. 3000-unit reels) | No functional difference; selected when prototyping or low-volume production requires smaller reel size | Direct drop-in replacement; same marking (C41R), same MSL-1 rating, same VSSOP-8 footprint |
| 74LVC2G241DCTRE4 | Identical functionality and specs, but in SSOP-8 (DCT) package: 2.95 mm × 2.80 mm, 0.65-mm pitch | Used where larger pad pitch eases hand-soldering or rework; slightly higher thermal resistance (220°C/W vs. 227°C/W) | Preferred for manual assembly or legacy board designs using SSOP footprints; not pin-compatible due to different package outline |
Compared with SN74LVC2G241DCUT and 74LVC2G241DCTRE4, the 74LVC2G241DCURE4 offers the smallest PCB footprint (2.30 mm × 2.00 mm) and highest density integration for space-constrained portable designs, while retaining full electrical equivalence with the DCUT variant and differing only in packaging format from the DCTRE4.
Availability
74LVC2G241DCURE4 is available at Aetrix Electronics and suitable for memory-address buffering, USB signal redriving, and automotive infotainment bus interface requiring stable component supply across industrial temperature ranges and long-lifecycle programs.
Supply support for 74LVC2G241DCURE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability, low-power logic families.
The SN74LVC2G241 product line targets high-density, low-power signal conditioning in portable and automotive electronics, emphasizing voltage translation, bus isolation, and Ioff-enabled system-level power management.
FAQ
What is the maximum operating temperature range for the 74LVC2G241DCURE4?
The 74LVC2G241DCURE4 is rated for operation from –40°C to +125°C ambient temperature. This extended range qualifies it for under-hood automotive applications and industrial control environments where thermal stress is significant. All electrical specifications - including propagation delay, drive strength, and Ioff leakage - are guaranteed across this full range per TI's SCES210P datasheet revision January 2019.
Does the 74LVC2G241DCURE4 support level translation between different supply voltages?
Yes, the 74LVC2G241DCURE4 supports down-translation: its inputs tolerate up to 5.5 V regardless of VCC level, allowing 5-V signals to safely drive the device while operating at 1.65 V, 1.8 V, 2.5 V, or 3.3 V. The outputs swing rail-to-rail within the VCC domain, making it ideal for interfacing legacy 5-V peripherals to modern low-voltage controllers without external translators.
How does the Ioff feature function in the 74LVC2G241DCURE4?
The Ioff circuitry in the 74LVC2G241DCURE4 disables both output drivers when VCC = 0 V, limiting off-state current to ±10 µA maximum. This prevents damaging back-current flow from live buses into a powered-down device - a critical requirement for hot-plug systems, partial-power-down architectures, and live-insertion applications like modular avionics or field-replaceable computing units.
What is the recommended power supply decoupling for the 74LVC2G241DCURE4?
Texas Instruments specifies a 0.1-µF ceramic capacitor placed as close as possible to the VCC pin of the 74LVC2G241DCURE4. For multi-VCC systems or noisy environments, paralleling a 1-µF capacitor improves low-frequency filtering. The GND connection must be low-inductance; TI's layout guidelines emphasize short, direct traces to minimize ground bounce and ensure stable 4.1-ns propagation timing.
Is the 74LVC2G241DCURE4 pin-compatible with other members of the SN74LVC2G241 family?
The 74LVC2G241DCURE4 shares identical pinout and functionality with SN74LVC2G241DCUT and SN74LVC2G241DCUR - all use the VSSOP-8 (DCU) package with 2.30 mm × 2.00 mm body and 0.5-mm pitch. However, it is not pin-compatible with SSOP-8 (DCT) variants like 74LVC2G241DCTRE4 due to different package dimensions and lead spacing, despite identical logic behavior.
74LVC2G241DCURE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-VFSOP (0.091", 2.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
74LVC2G241DCURE4 FAQ
1.How can I place an order for 74LVC2G241DCURE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC2G241DCURE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC2G241DCURE4 reliable?
The price and inventory of 74LVC2G241DCURE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC2G241DCURE4 is usually 5 days.
3.What payment methods are accepted for 74LVC2G241DCURE4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC2G241DCURE4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC2G241DCURE4?
74LVC2G241DCURE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC2G241DCURE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC2G241DCURE4?
For technical support, including 74LVC2G241DCURE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC2G241DCURE4 requirements.
6.How does Aetrix verify that 74LVC2G241DCURE4 is sourced from the original manufacturer or authorized distributors?
All 74LVC2G241DCURE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC2G241DCURE4 meets industry standards.
7.What is the process for return or replacement of 74LVC2G241DCURE4?
All 74LVC2G241DCURE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC2G241DCURE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC2G241DCURE4 part is unused and in its original packaging.
Return procedure for 74LVC2G241DCURE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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