Texas Instruments 74LVC2G241DCURG4

Overview

74LVC2G241DCURG4 from Texas Instruments is a dual 1-bit noninverting buffer/driver with independent 3-state outputs, designed for 1.65-V to 5.5-V V_CC operation. It delivers ±24-mA output drive at 3.3 V, achieves 4.1-ns max propagation delay, and supports 5.5-V tolerant inputs - enabling level translation from 5-V logic down to lower V_CC rails. It serves as a redriver in bus interface and memory address driver applications where signal integrity and low-power 3-state control are critical.

For engineers reviewing the 74LVC2G241DCURG4 datasheet, 74LVC2G241DCURG4 pinout, 74LVC2G241DCURG4 application, or 74LVC2G241DCURG4 equivalent, this page provides verified functional modes, validated I_off partial-power-down behavior, confirmed NanoFree™ VSSOP package dimensions, and real-world timing performance across 1.8 V–5 V supply conditions.

Technical Context

The 74LVC2G241DCURG4 implements two independent CMOS buffer channels, each with active-low (1OE) and active-high (2OE) output-enable controls - allowing asymmetric enable sequencing and flexible bus arbitration. Its I_off circuitry actively disables outputs during power-down, blocking back-drive current up to ±10 µA when V_I or V_O = 5.5 V and V_CC = 0 V.

It features overvoltage-tolerant inputs (up to 5.5 V regardless of V_CC), rail-to-rail output swing (V_OH ≥ V_CC – 0.1 V, V_OL ≤ 0.1 V), and robust ESD protection (±2000-V HBM, ±1000-V CDM). The device operates across –40°C to +125°C and supports live insertion via its 3-state and I_off capabilities.

Key Specifications

Pinout & Package

VSSOP (DCU) 8-pin package: 2.30 mm × 2.00 mm body, 0.5-mm lead pitch, gull-wing leads. Designed for high-density PCB layouts and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual buffer with 3-state output applications.

Compared with SN74LVC2G241DCUT and 74LVC2G241DCTRG4, the 74LVC2G241DCURG4 provides identical logic behavior and electrical performance in the smallest standardized 8-pin surface-mount package (VSSOP), delivering optimal PCB area efficiency and thermal management for space-constrained embedded systems.

Availability

74LVC2G241DCURG4 is available at Aetrix Electronics and suitable for industrial I/O expansion, automotive infotainment bus interfaces, and USB hub signal redriving requiring stable component supply, full lifecycle support, and guaranteed RoHS-compliant sourcing.

Supply support for 74LVC2G241DCURG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability interface ICs and advanced packaging technologies.

The SN74LVC2G241 product line targets high-density, low-power bus interface and memory addressing applications - engineered for mixed-voltage interoperability, robust ESD resilience, and seamless integration into automotive, industrial, and consumer electronics platforms.

FAQ

What is the maximum propagation delay of the 74LVC2G241DCURG4 at 3.3 V?

The maximum propagation delay (t_pd) of the 74LVC2G241DCURG4 is 4.1 ns at V_CC = 3.3 V, measured under recommended operating conditions (–40°C to +85°C). This value is specified in the Switching Characteristics table of the official TI datasheet SCES210P and reflects worst-case A→Y timing across process, voltage, and temperature corners.

Does the 74LVC2G241DCURG4 support level translation between different supply voltages?

Yes, the 74LVC2G241DCURG4 supports down-translation: its inputs tolerate up to 5.5 V regardless of V_CC, allowing connection to 5-V logic while operating from 1.8-V, 2.5-V, or 3.3-V supplies. The outputs swing rail-to-rail (V_OH ≥ V_CC – 0.1 V, V_OL ≤ 0.1 V), making it suitable for driving loads referenced to the same V_CC rail.

What is the purpose of the I_off feature in the 74LVC2G241DCURG4?

The I_off feature in the 74LVC2G241DCURG4 disables output drivers when V_CC = 0 V, limiting leakage current to ±10 µA even when inputs or outputs are biased to 5.5 V. This prevents damaging back-current flow during partial power-down, hot-swap, or system-level power sequencing - a key requirement for industrial and automotive applications.

Which package type does the 74LVC2G241DCURG4 use, and what are its dimensions?

The 74LVC2G241DCURG4 uses the VSSOP (DCU) package: an 8-pin gull-wing surface-mount package with nominal body size 2.30 mm × 2.00 mm and 0.5-mm lead pitch. This NanoFree™-derived package minimizes PCB area and improves thermal performance (R_θJA = 227°C/W) compared to standard SOIC or SSOP alternatives.

Can the 74LVC2G241DCURG4 be used in automotive applications?

Yes - the 74LVC2G241DCURG4 is qualified for operation from –40°C to +125°C and features ±2000-V HBM ESD protection, meeting core requirements for automotive infotainment and body electronics. While not AEC-Q200 certified as a standalone component, its electrical and thermal specs align with Grade 2 (–40°C to +105°C ambient) and Grade 3 (–40°C to +125°C ambient) use cases when integrated into validated systems.