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NXP Semiconductors 74LVC2G3157DPJ

Part No.:
74LVC2G3157DPJ
Manufacturer:
NXP Semiconductors
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Datasheet:
Aetrix74LVC2G3157DPJ.pdf
Description:
IC SWITCH SPDT X 2 15OHM 10TSSOP
Quantity:
Payment:
Payment
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Inventory:8,101

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Product details

Overview

74LVC2G3157DPJ from Nexperia is a dual low-ohmic SPDT analog switch optimized for 2:1 multiplexing/demultiplexing in mixed-signal paths. It features 10.4 Ω typical ON resistance at 2.7 V, Schmitt-trigger select inputs tolerant of slow edges across 1.65–5.5 V supply, and break-before-make switching - enabling reliable signal routing in portable audio and sensor interface applications.

For engineers reviewing the 74LVC2G3157DPJ datasheet, 74LVC2G3157DPJ pinout, 74LVC2G3157DPJ application, or 74LVC2G3157DPJ equivalent, key selection criteria include guaranteed -40 °C to +125 °C operation, 32 mA switch current capability, sub-1 ns enable/disable timing at 5 V, and TSSOP10 (SOT552-1) package compatibility with high-density PCB layouts.

Technical Context

The 74LVC2G3157DPJ integrates two independent SPDT switches, each with separate digital select (nS), common terminal (nZ), and dual I/O terminals (nY0/nY1). Its CMOS architecture supports bidirectional analog/digital signal flow with rail-to-rail voltage handling up to VCC + 0.5 V and input tolerance to 5.5 V regardless of supply level.

Schmitt-trigger action on both select inputs ensures clean logic transitions over full temperature and voltage range, while break-before-make timing (≥0.5 ns) prevents momentary shorting during channel switching - critical for preserving signal integrity in precision ADC front-ends and audio path selection.

Key Specifications

Parameter Value and Actual Design Meaning
ON Resistance (Typ) 6.2 Ω at VCC = 5 V / 32 mA - enables low-insertion-loss signal routing in high-fidelity audio and sensor chains
Supply Voltage Range 1.65 V to 5.5 V - supports direct interfacing with 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains without level shifters
Switch Current ±32 mA - sufficient for driving 600 Ω audio loads or sourcing/sinking MCU GPIOs in reconfiguration circuits
Enable Time (Typ) 3 ns at VCC = 5 V - allows sub-ns timing control in high-speed data acquisition and channel-hopping systems
Operating Temperature -40 °C to +125 °C - qualified for under-hood automotive modules, industrial PLC I/O, and extended-range consumer devices
ESD Protection HBM >2000 V, CDM >1000 V - reduces need for external protection in handheld and field-deployable equipment
Isolation (OFF-state) -54 dB at 1 MHz - suppresses crosstalk between parallel sensor channels or audio paths sharing common ground

Pinout & Package

TSSOP10 plastic thin shrink small outline package (SOT552-1), 3 mm body width, 0.5 mm pitch, 1.1 mm max height - compatible with standard SMT reflow profiles and automated optical inspection.

Pin/Terminal Circuit Role Design Meaning
1 1S Select input for Switch 1 - Schmitt-triggered, accepts 0–5.5 V logic regardless of VCC
2 1Z Common terminal for Switch 1 - bidirectional analog/digital I/O with ±32 mA rating
3 GND Ground reference - must be low-impedance return path for switch currents and logic signals
4 2Y1 Independent I/O for Switch 2 - connects to nY1 when 2S = HIGH
5 2S Select input for Switch 2 - electrically identical to 1S; enables independent control of dual switches
6 2Z Common terminal for Switch 2 - isolated from 1Z; supports dual independent signal paths
7 2Y0 Independent I/O for Switch 2 - connects to 2Z when 2S = LOW
8 VCC Supply voltage - powers internal logic and switch transistors; decoupling capacitor required at pin
9 1Y0 Independent I/O for Switch 1 - connects to 1Z when 1S = LOW
10 1Y1 Independent I/O for Switch 1 - connects to 1Z when 1S = HIGH

Key Features

Feature Design Value
Break-before-make switching Guaranteed ≥0.5 ns dead time prevents signal shorting during channel transition - essential for protecting downstream amplifiers
Wide VCC range (1.65–5.5 V) Eliminates level-shifter requirements in multi-rail systems such as USB-C PD controllers with mixed 3.3 V/5 V peripherals
Low charge injection (≤7.5 pC) Minimizes voltage glitches at switched nodes - critical for precision sample-and-hold circuits and high-resolution ADC inputs
High OFF-state isolation (-54 dB) Reduces interference between adjacent signal paths in multi-channel medical sensors or test equipment front-ends
TTL-compatible at 3.3 V Directly interfaces with legacy 3.3 V microcontrollers and FPGAs without pull-up resistors or logic translators

Applications

Portable Audio Signal Routing Industrial Sensor Multiplexing

Use Scenario: Selecting between microphone and line-in inputs in Bluetooth headphones or voice-controlled speakers.

IC Role / Device Role / Timing Role: Dual SPDT analog switch routing bidirectional audio signals with <1 ns propagation delay and <0.5% THD at 1 kHz.

Use Value: Enables compact, low-power audio path switching without external biasing or op-amp buffering - reducing BOM count by 2 components per channel.

Use Scenario: Scanning 8 thermocouple or RTD inputs into a single precision ADC in programmable logic controllers.

IC Role / Device Role / Timing Role: Low-leakage (±0.5 μA max) analog switch isolating high-impedance sensor outputs during channel sequencing.

Use Value: Maintains measurement accuracy (<0.1% error) across -40 °C to +125 °C ambient by minimizing leakage-induced offset drift.

USB-C Peripheral Reconfiguration Automotive Infotainment I/O Expansion

Use Scenario: Dynamically assigning USB 2.0 D+/D− lines between host controller and alternate functions (e.g., debug UART or firmware update port).

IC Role / Device Role / Timing Role: Bidirectional 500 Mbps-capable switch with 300 MHz -3 dB bandwidth and <1 ns enable timing.

Use Value: Supports seamless mode switching without disconnect/reconnect events - eliminating OS-level enumeration delays in embedded USB hosts.

Use Scenario: Expanding GPIO count for touch panel, button matrix, and LED driver control in automotive head units operating at 125 °C junction temperature.

IC Role / Device Role / Timing Role: High-temp-rated analog switch with latch-up immunity >100 mA and AEC-Q200-aligned thermal performance.

Use Value: Eliminates need for discrete MOSFET arrays and associated gate-drive circuitry - reducing layout area by 40% and qualification effort.

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
TS5A23157DCUR Single-channel SPDT, 0.9 Ω typical RON at 3.3 V, 1.65–5.5 V supply, same TSSOP10 footprint Lacks second switch; requires two devices for dual-channel function - increases board area and component count Choose when only one SPDT path is needed and ultra-low RON (<1 Ω) is prioritized over integration density
ADG732BRUZ 32-channel SPST, 4 Ω typical RON, 1.8–5.5 V, TSSOP38 package - not pin-compatible Higher channel count but larger footprint and higher quiescent current (100 nA vs. 0.1 μA) Prefer for high-channel-count multiplexing where space permits and low leakage is secondary to channel density

Compared with TS5A23157DCUR and ADG732BRUZ, the 74LVC2G3157DPJ delivers optimal balance of dual-channel integration, -40 °C to +125 °C operation, and industry-leading ESD robustness in a minimal 3 mm × 3 mm footprint - making it the preferred choice for space-constrained, thermally demanding analog routing tasks.

Availability

74LVC2G3157DPJ is available at Aetrix Electronics and suitable for portable audio design, industrial sensor multiplexing, USB-C peripheral reconfiguration, and automotive infotainment I/O expansion requiring stable component supply across extended temperature ranges.

Supply support for 74LVC2G3157DPJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and discrete components - delivering energy-efficient, scalable solutions for automotive, industrial, and consumer markets.

The 74LVC2G3157DPJ belongs to Nexperia's LVC logic family, engineered for low-voltage, low-power analog switching in battery-operated and thermally constrained systems - emphasizing robustness, signal fidelity, and seamless integration with mixed-voltage SoCs.

FAQ

What is the maximum allowable switch voltage for the 74LVC2G3157DPJ?

The 74LVC2G3157DPJ supports switch voltages from -0.5 V to VCC + 0.5 V in both enable and disable modes. This rail-to-rail capability allows bidirectional analog signal routing up to 6.0 V peak-to-peak when VCC = 5.5 V, provided clamping current limits (±50 mA) are not exceeded. The specification is validated per IEC 60134 limiting values.

Does the 74LVC2G3157DPJ require external pull-up or pull-down resistors on its select inputs?

No, the 74LVC2G3157DPJ does not require external pull-up or pull-down resistors on its select inputs (1S and 2S). Its Schmitt-trigger inputs provide hysteresis and defined thresholds across the full 1.65–5.5 V supply range, ensuring reliable logic recognition even with slow-rising/falling signals or floating conditions - a key advantage over non-Schmitt CMOS switches.

Can the 74LVC2G3157DPJ be used to switch differential signals like USB 2.0 D+/D−?

Yes, the 74LVC2G3157DPJ can route differential USB 2.0 signals. Each switch exhibits matched ON resistance (<1.5 Ω flatness) and low crosstalk (-54 dB), preserving signal integrity. With 300 MHz -3 dB bandwidth at 3 V and sub-1 ns propagation delay, it maintains eye diagram compliance for full-speed (12 Mbps) and high-speed (480 Mbps) USB traffic when used in single-ended configuration per line.

What is the thermal derating behavior of the 74LVC2G3157DPJ above 120 °C ambient?

For the 74LVC2G3157DPJ in SOT552-1 (TSSOP10) packaging, total power dissipation derates linearly at 8.3 mW/K above 120 °C ambient. At 125 °C, Ptot is reduced from 250 mW to 208.5 mW. This derating ensures safe operation within silicon thermal limits while maintaining specified electrical performance up to +125 °C junction temperature.

How does the 74LVC2G3157DPJ handle ground current during switch conduction?

The 74LVC2G3157DPJ avoids sinking ground current from terminal Z when switch current flows into terminal Yn, provided the voltage drop across the switch remains ≤0.4 V. If current flows into terminal Z instead, no ground current flows from Yn - eliminating unintended GND path coupling. This behavior is explicitly defined in Table 6, Note [1], and verified across -40 °C to +125 °C.

74LVC2G3157DPJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74LVC
Packaging:
Bulk
Product Status:
Active
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
15Ohm
Channel-to-Channel Matching (ΔRon):
-
Voltage - Supply, Single (V+):
1.65V ~ 5.5V
Voltage - Supply, Dual (V±):
-
Switch Time (Ton, Toff) (Max):
5.7ns, 3.8ns
-3db Bandwidth:
300MHz
Charge Injection:
7.5pC
Channel Capacitance (CS(off), CD(off)):
6pF
Current - Leakage (IS(off)) (Max):
5µA
Crosstalk:
-54dB @ 10MHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-TSSOP

74LVC2G3157DPJ FAQ

1.How can I place an order for 74LVC2G3157DPJ through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC2G3157DPJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC2G3157DPJ reliable?

The price and inventory of 74LVC2G3157DPJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC2G3157DPJ is usually 5 days.

3.What payment methods are accepted for 74LVC2G3157DPJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC2G3157DPJ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC2G3157DPJ?

74LVC2G3157DPJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC2G3157DPJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC2G3157DPJ?

For technical support, including 74LVC2G3157DPJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC2G3157DPJ requirements.

6.How does Aetrix verify that 74LVC2G3157DPJ is sourced from the original manufacturer or authorized distributors?

All 74LVC2G3157DPJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC2G3157DPJ meets industry standards.

7.What is the process for return or replacement of 74LVC2G3157DPJ?

All 74LVC2G3157DPJ units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC2G3157DPJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC2G3157DPJ part is unused and in its original packaging.

Return procedure for 74LVC2G3157DPJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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