Diodes Incorporated 74LVC2G32HD4-7
- Part No.:
- 74LVC2G32HD4-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Gates and Inverters
- Package:
- 8-XFDFN
- Datasheet:
-
74LVC2G32HD4-7.pdf
- Description:
- IC GATE OR 2CH 2-INP DFN2010-8
- Quantity:
- Payment:

- Shipping:

Inventory:10,432
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74LVC2G32HD4-7 from Diodes Incorporated is a dual 2-input OR gate in X2-DFN2010-8 package, operating from 1.65V to 5.5V supply, delivering ±24mA output drive at 3.3V, with IOFF-enabled partial power-down protection and Schmitt-trigger inputs (100mV hysteresis at 3.0V). It enables voltage-level shifting and signal isolation in portable logic interfaces.
For engineers reviewing the 74LVC2G32HD4-7 datasheet, 74LVC2G32HD4-7 pinout, 74LVC2G32HD4-7 application, or 74LVC2G32HD4-7 equivalent, key selection criteria include dual-gate logic function, IOFF leakage <±10μA at 5.5V, 4.2ns typical propagation delay at 3.3V, and DFN-8 footprint compatibility with space-constrained PCB layouts.
Technical Context
This device implements two independent positive-logic OR functions (Y = A + B) using CMOS technology with push-pull outputs. Its IOFF circuitry actively disables outputs during power-down, blocking reverse current flow when VCC = 0V while inputs remain at up to 5.5V.
All inputs feature Schmitt-trigger action-providing 100mV typical hysteresis at VCC = 3.0V-which ensures noise immunity and reliable switching with slow-rising/falling signals. Input voltage tolerance extends to 5.5V regardless of VCC level, enabling robust level-shifting across mixed-supply domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Function | Dual 2-input OR gate (Y = A + B), fully independent channels |
| Supply Voltage Range | 1.65V to 5.5V - supports single-supply operation across 1.8V, 2.5V, 3.3V, and 5V systems |
| IOFF Leakage Current | ±10μA max at 5.5V - prevents backflow damage during partial power-down |
| Propagation Delay | 4.2ns typical at VCC = 3.3V - enables timing-critical logic interfacing up to ~100MHz toggle rate |
| Output Drive Strength | ±24mA at VCC = 3.3V - drives moderate capacitive loads without external buffers |
| Input Hysteresis | 100mV typical at VCC = 3.0V - rejects noise on slow edges in noisy environments |
| ESD Protection | 2000V HBM, >1000V CDM - meets industrial handling requirements without additional protection |
Pinout & Package
X2-DFN2010-8 package: 1.95mm × 1.0mm × 0.4mm body, 0.5mm lead pitch, exposed thermal pad (no internal connection), RoHS-compliant, halogen- and antimony-free "Green" construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Input A for Gate 1 | CMOS-compatible input accepting 0–5.5V; Schmitt-triggered for noise immunity |
| 1B | Input B for Gate 1 | Independent OR operand; electrically identical to 1A |
| 2Y | Output Y for Gate 2 | Push-pull output with ±24mA drive; disabled by IOFF when VCC = 0V |
| GND | Ground Reference | Primary return path for all I/O and supply currents; connects to thermal pad |
| 2A | Input A for Gate 2 | Second independent OR input; no crosstalk with Gate 1 |
| 2B | Input B for Gate 2 | Second independent OR operand; identical electrical behavior to 1A/1B |
| 1Y | Output Y for Gate 1 | Push-pull output with same drive and IOFF behavior as 2Y |
| VCC | Supply Voltage | Single power rail (1.65–5.5V); powers both gates and IOFF control circuitry |
Key Features
| Feature | Design Value |
|---|---|
| IOFF Partial Power-Down Support | Outputs enter high-impedance state with <±10μA leakage when VCC = 0V, enabling safe hot-insertion in multi-rail systems |
| Schmitt-Trigger Inputs | 100mV typical hysteresis at 3.0V ensures clean transitions on slow or noisy signals without external RC filtering |
| 5.5V-Tolerant Inputs | Accepts input voltages up to 5.5V irrespective of VCC level - simplifies level-shifting between 1.8V/3.3V/5V domains |
| Low Dynamic Power | 17pF typical power dissipation capacitance at 3.3V/10MHz - reduces switching current and system-level EMI |
| Ultra-Small Footprint | X2-DFN2010-8 (1.95 × 1.0 mm) saves >60% board area vs. SOIC-8 while maintaining thermal performance (θJA = 313°C/W) |
Applications
| Mobile Device Power Sequencing | USB-C Port Logic Interface |
|---|---|
|
Use Scenario: Coordinating enable signals across multiple voltage rails during boot-up and sleep/wake transitions in smartphones and tablets. IC Role / Device Role / Timing Role: Dual OR gate combines reset or enable signals from PMICs and SoC peripherals to generate synchronized power-good assertions. Use Value: IOFF prevents backfeed from powered rails into unpowered sections; Schmitt inputs tolerate slow ramp-up of auxiliary supplies. |
Use Scenario: Detecting cable insertion and negotiating USB-C configuration modes (DFP/UFP) using CC line status signals. IC Role / Device Role / Timing Role: Level-shifting OR logic resolves dual-role port status flags (e.g., CC1/CC2 detection + VCONN presence) before MCU sampling. Use Value: 5.5V-tolerant inputs interface directly with 5V CC line voltages; compact DFN-8 fits tight connector-side routing zones. |
| Industrial Sensor Hub Signal Aggregation | Embedded Display Backlight Control |
|
Use Scenario: Consolidating fault alerts (over-temp, over-current, communication loss) from multiple sensors into a single interrupt line for microcontroller polling. IC Role / Device Role / Timing Role: OR gate performs wired-OR aggregation of open-drain sensor outputs, converted to active-high push-pull for MCU GPIO compatibility. Use Value: ±24mA drive ensures clean logic levels despite trace capacitance; wide VCC range matches 3.3V sensor hub supply. |
Use Scenario: Enabling LED backlight drivers only when both display enable and brightness PWM are asserted, preventing unintended illumination during initialization. IC Role / Device Role / Timing Role: Dual OR gate implements safety interlock logic: one gate validates panel readiness, the other validates backlight enable sequence. Use Value: 4.2ns propagation delay ensures sub-microsecond response to display controller commands; low ICC (<10μA) minimizes standby power. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 2-input OR gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G32DBVR | TSSOP-8 package (2.3 × 2.0 mm); higher θJA (210°C/W); identical logic, IOFF, and voltage specs | Better manual solderability and test probe access; less suitable for ultra-dense mobile PCBs | Select when board assembly favors larger packages or reworkability is prioritized over size |
| 74LVC2G32HK3-7 | X2-DFN1410-8 (1.35 × 1.0 mm); 0.4 mm pitch; 321°C/W θJA; same electrical specs | Smaller footprint than HD4 but lower thermal performance; tighter layout constraints | Select when board area is more constrained than thermal margin, and 0.4 mm pitch is supported |
Compared with SN74LVC2G32DBVR and 74LVC2G32HK3-7, the 74LVC2G32HD4-7 offers optimal balance of miniaturization (1.95 × 1.0 mm), thermal resistance (313°C/W), and manufacturability - making it preferred for high-volume portable electronics where space and reliability coexist.
Availability
74LVC2G32HD4-7 is available at Aetrix Electronics and suitable for mobile device power sequencing, USB-C port logic interface, and industrial sensor hub signal aggregation requiring stable component supply and long-term lifecycle support.
Supply support for 74LVC2G32HD4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and computing markets.
The 74LVC logic family delivers low-voltage, high-speed CMOS logic with robust level-shifting and power-management features - designed specifically for battery-powered and mixed-supply embedded systems.
FAQ
Can 74LVC2G32HD4-7 operate with VCC = 1.65V while inputs are at 3.3V?
Yes. All inputs tolerate up to 5.5V regardless of VCC level, enabling reliable level-shifting from higher-voltage sources into 1.65V logic domains. At VCC = 1.65V, VIH is 0.65×VCC (≈1.07V), ensuring valid high-level recognition of 3.3V inputs without external resistors or translators.
What happens to outputs during power-down when VCC = 0V?
IOFF circuitry forces both outputs into high-impedance state with leakage ≤±10μA at 5.5V applied to inputs. This prevents damaging reverse current flow from live system buses into the unpowered IC - critical for hot-swap and partial-power-down architectures.
Is the X2-DFN2010-8 package thermally enhanced?
Yes. The package includes an exposed thermal pad (non-electrical) that must be soldered to a PCB copper pour. With recommended 2oz FR-4 layout, junction-to-ambient thermal resistance is 313°C/W - sufficient for continuous operation at 24mA output drive within -40°C to +125°C ambient.
Does this device require external pull-up or pull-down resistors on unused inputs?
Yes. Per datasheet Note 9, unused inputs must be tied to VCC or GND to prevent floating nodes, which could cause excessive ICC, oscillation, or unpredictable logic states. Schmitt-trigger inputs do not eliminate this requirement - they only improve noise margin on driven signals.
74LVC2G32HD4-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74LVC
- Package/Case:
- 8-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- OR Gate
- Number of Circuits:
- 2
- Number of Inputs:
- 2
- Features:
- -
- Voltage - Supply:
- 1.65V ~ 5.5V
- Current - Quiescent (Max):
- 40 µA
- Current - Output High, Low:
- 32mA, 32mA
- Input Logic Level - Low:
- -
- Input Logic Level - High:
- -
- Max Propagation Delay @ V, Max CL:
- 4ns @ 5V, 50pF
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN2010-8
74LVC2G32HD4-7 FAQ
1.How can I place an order for 74LVC2G32HD4-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC2G32HD4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC2G32HD4-7 reliable?
The price and inventory of 74LVC2G32HD4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC2G32HD4-7 is usually 5 days.
3.What payment methods are accepted for 74LVC2G32HD4-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC2G32HD4-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC2G32HD4-7?
74LVC2G32HD4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC2G32HD4-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC2G32HD4-7?
For technical support, including 74LVC2G32HD4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC2G32HD4-7 requirements.
6.How does Aetrix verify that 74LVC2G32HD4-7 is sourced from the original manufacturer or authorized distributors?
All 74LVC2G32HD4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC2G32HD4-7 meets industry standards.
7.What is the process for return or replacement of 74LVC2G32HD4-7?
All 74LVC2G32HD4-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC2G32HD4-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC2G32HD4-7 part is unused and in its original packaging.
Return procedure for 74LVC2G32HD4-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74LVC2G32HD4-7 Tags
-
SN74LVC1G14DBVR
Texas Instruments
-
SN74LVC1G14DCKR
Texas Instruments
-
SN74AHC1G14DBVR
Texas Instruments
-
SN74LVC1G08DBVR
Texas Instruments
-
SN74LVC1G08DCKR
Texas Instruments
-
SN74LVC1G32DCKR
Texas Instruments
-
SN74LVC1G04DBVR
Texas Instruments
.jpg)
-
74LVC1G08GW,125
Nexperia USA Inc.
-
SN74LVC1G04DCKR
Texas Instruments
-
SN74AHC1G08DBVR
Texas Instruments
-
SN74LVC1G32DBVR
Texas Instruments
-
SN74AHCT1G08DBVR
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

